EP3SL50F780I4LG - Stratix III L FPGA, 47.5K LE, 780-FCBGA | Intel
부품 번호: EP3SL50F780I4LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2350 | $235,000.00 |
| 500 | $2120 | $1,060,000.00 |
| 1,000 | $1895 | $1,895,000.00 |
EP3SL50F780I4LG 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and embedded hardened IP such as block RAM, DSP slices, transceivers, and PLLs. The Stratix III line sits in the high-end domain hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs are chosen over ASICs when time-to-market, in-field reprogrammability, or low-to-medium production volume justify their higher unit cost and higher power consumption. The 'L' suffix denotes the Stratix III low-power variant, which traded peak performance for substantially lower static power versus the standard Stratix III family.
Key features of the EP3SL50F780I4LG include 47,500 logic elements (roughly 19,000 ALMs in Altera's adaptive logic module architecture), 2.184 Mbit of embedded RAM, 488 user I/O pins, and the speed grade 4 industrial-grade device (the 'I4' suffix indicates industrial temperature range and speed grade 4). The 780-FCBGA flip-chip BGA package provides high pin density and excellent electrical performance for high-speed signals. The device supports multiple I/O standards and serial transceivers typical of the Stratix III family.
Typical applications for this device include high-performance digital signal processing, telecom baseband processing, military and aerospace signal processing, high-speed instrumentation, and ASIC prototyping. Designers choose this part when they need a balance of logic density, embedded memory, and I/O count in a thermally manageable low-power FPGA. The 'I4LG' suffix indicates lead-free, industrial-temperature, speed-grade 4 packaging.
When designing with this FPGA, verify that PCB BGA escape routing, power-rail decoupling, and thermal management are sized for the 780-pin flip-chip BGA footprint. Use Altera/Intel Quartus II design software for synthesis, place-and-route, and bitstream generation. Program the configuration flash with the appropriate JTAG or Active Serial (AS) scheme.
드롭인 대체품: EP3SL50F780I4LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F780I4LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Core Voltage, Series, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F780I4L
✅ 드롭인✓ 재고 있음
$695.09 / 개
데이터시트 보기 →EP3SL50F780I4G
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SL50F780I4
✅ 드롭인✓ 재고 있음
$580 / 개
데이터시트 보기 →EP3SL50F780I3N
✅ 드롭인✓ 재고 있음
$385 / 개
데이터시트 보기 →EP3SL50F780C4N
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP3SE50F780I4N
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP3SL200H780I4N
✅ 드롭인✓ 재고 있음
$4750 / 개
데이터시트 보기 →EP3SL50F780I4LG 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements (LE) | 47,500 |
| Adaptive Logic Modules (ALM) | 19,000 |
| Embedded Memory | 2,184,192 bits (2.08 Mbit) |
| User I/O Count | 488 |
| 동작 공급 전압 | 1.1 V |
| Package Type | 780-BBGA, FCBGA (flip-chip) |
| 장착 스타일 | SMD/SMT |
| 동작 온도 범위 | -40C to +100C (Industrial) |
| Speed Grade | 4 |
| Lead-Free | Yes |
| RoHS 상태 | Compliant |
| Configuration Method | JTAG / Active Serial (AS) |
| Design Software | Quartus II (Altera/Intel) |
| Sub-Family | Low-power (L) variant |
EP3SL50F780I4LG 780-bbga, fcbga (flip-chip) 핀 구성 가이드
EP3SL50F780I4LG(780-bbga, fcbga (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F780I4LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F780I4LG 적합 용도: 6 애플리케이션s: Telecom Baseband Processing, High-Performance DSP and FFT Pipelines, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Medical Imaging and Diagnostics.
Telecom Baseband Processing
The EP3SL50F780I4LG fits telecom baseband designs because its 47,500 logic elements and 2.08 Mbit of embedded block RAM deliver enough DSP and buffering capacity for baseband channel cards while the Stratix III L (low-power) variant keeps thermal load manageable in dense line-card chassis. The 488 user I/Os provide parallel LVDS lanes to companion framers, SERDES chips, and backplane transceivers without external muxing. Per the Stratix III handbook, the device supports CPRI and OBSAI physical interfaces at common baseband clock rates, making it suitable for 3G/4G base station signal processing. The industrial -40C to +100C temperature grade also supports outdoor remote-radio-head (RRH) deployments.
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High-Performance DSP and FFT Pipelines
The EP3SL50F780I4LG is well suited to high-performance DSP and FFT pipelines because its 47.5K logic elements pair with dedicated DSP blocks (typical of the Stratix III family) and 2.08 Mbit of embedded block RAM to support multi-stage filter banks and fast Fourier transforms. The 488 user I/Os allow direct ADC/DAC interfacing at LVDS rates up to 1.6 Gbps per the device handbook, eliminating external buffer chips. The L (low-power) sub-family is particularly attractive for radar, sonar, and software-defined radio front-ends where thermal budget is constrained. The device is often paired with high-speed ADCs and DACs in electronic warfare and instrumentation systems.
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ASIC Prototyping and Emulation
The EP3SL50F780I4LG is commonly used as an ASIC prototyping platform because its 47.5K logic elements, abundant block RAM, and 488 user I/Os can map mid-complexity ASIC RTL with reasonable timing closure. Multiple FPGAs can be paralleled via LVDS or SERDES connections to emulate larger ASICs. The Stratix III industrial temperature grade allows the prototyping board to be used in lab environments without active cooling. Quartus II design software provides synthesis, place-and-route, and incremental compile flows tailored for ASIC prototyping. Many design houses use this part as the stepping stone before committing to mask production.
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Military and Aerospace Signal Processing
The EP3SL50F780I4LG suits military and aerospace signal processing because of its industrial -40C to +100C temperature range, lead-free 780-FCBGA packaging with high pin density, and the heritage of the Stratix III family in defense electronics. Per the Altera Military/Aerospace brochure, the device supports secure-boot configuration flows and is widely used in radar, electronic warfare, and avionics platforms. The 47.5K logic elements and 2.08 Mbit of embedded block RAM enable channelization, beamforming, and cryptographic acceleration in a single FPGA. The flip-chip BGA package provides the ruggedness required for vibration and shock environments typical of airborne platforms.
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Test and Measurement Instrumentation
The EP3SL50F780I4LG is a strong fit for test and measurement equipment because its 488 user I/Os and high-speed LVDS support allow direct interfacing with high-speed ADCs, DACs, and digital bus standards. The 2.08 Mbit of embedded memory provides deep sample buffers for oscilloscope, logic analyzer, and protocol analyzer applications. The Stratix III L variant offers lower static power than the standard Stratix III, reducing cooling requirements in compact benchtop instruments. The device is often paired with TI ADC and DAC families (ADS62P, DAC38J82) to build 12-16 bit wide-bandwidth acquisition systems.
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Medical Imaging and Diagnostics
The EP3SL50F780I4LG serves medical imaging applications including ultrasound beamforming, CT reconstruction, and MRI signal processing. Its 47.5K logic elements plus embedded DSP blocks deliver the throughput needed for real-time image reconstruction, while 2.08 Mbit of block RAM holds line buffers and coefficient tables. The 488 user I/Os support direct connection to multi-channel ADC front-ends. The industrial temperature rating allows the FPGA to be deployed in controlled hospital environments with predictable thermal behavior. The Altera Quartus II DSP Builder toolchain accelerates MATLAB-to-FPGA image processing pipeline development.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F780I4LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F780I4L | EP3SL50F780I4G | EP3SL50F780C4N | EP3SE50F780I4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | ~50,000 (enhanced) |
| Embedded Memory | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | ~3.9 Mbit |
| User I/O | 488 | 488 | 488 | 488 | 488 |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | 4 | 4 | 4 | 4 | 4 |
| Sub-Family | Low-power (L) | Low-power (L) | Low-power (L) | Low-power (L) | Enhanced (E) |
| Lead-Free | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Low-power variant reduces static consumption (vs EP3SE50F780I4N (Stratix III E))
- Industrial temperature rating for harsh environments (vs EP3SL50F780C4N (Commercial))
- Speed grade 4 for power-optimized timing closure (vs EP3SL50F780I3N (Speed grade 3))
설계 노트
The 780-ball FCBGA package uses a 1.0 mm or 0.8 mm ball pitch (verify against the package datasheet) and requires microvia or via-in-pad PCB technology. A minimum 6-layer stack-up with dedicated power and ground planes is recommended. Decoupling must follow the Stratix III power distribution network guide: 100 nF X7R capacitors placed within 100 mils of every power pin, with bulk decoupling on each power rail. Trace impedance should be controlled to 50 ohm single-ended or 100 ohm differential for high-speed LVDS pairs.
Estimated: At 1.1 V core voltage and full logic utilization, the EP3SL50F780I4LG static power may reach several watts even in the L (low-power) variant. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to model dynamic power based on your design's toggle rate, clock frequency, and block RAM usage. The 780-FCBGA has a moderate theta_JB that requires thermal vias under the package center balls and a bottom-side thermal relief copper pour for heat spreading. Forced-air cooling is recommended for closed enclosures.
Stratix III configuration requires careful sequencing of the MSEL pins to select AS, AP, PS, JTAG, or FPP modes. Confirm the configuration scheme (typically Active Serial with EPCS or EPCQ flash) before PCB layout because it determines the number of dedicated configuration pins and the supporting flash footprint. The CONFIG_DONE, nSTATUS, and nCONFIG signals must be properly pulled up per the device handbook. Do not confuse Stratix III (EP3S) with Stratix IV (EP4SGX) or Stratix V (5SGX) families - the I/O standards and configuration schemes differ.
The EP3SL50F780I4LG supports LVDS at data rates up to 1.6 Gbps per the Stratix III device handbook. For DDR2/DDR3 memory interfaces, follow the Altera external memory interface toolkit guidelines for read/write deskew, OCT calibration, and Vref training. Use length-matched routing within the byte lane groups. Series termination may be required for high-speed LVDS pairs longer than 2 inches.
규정 준수 정보
RoHS compliant per DigiKey listing. Lead-free packaging per 'L' suffix. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade IC. Industrial temperature grade only.
