EP3SL50F780C4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
부품 번호: EP3SL50F780C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $196 | $19,600.00 |
| 500 | $178 | $89,000.00 |
| 1,000 | $162 | $162,000.00 |
EP3SL50F780C4N 개요
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hard IP (transceivers, memory interfaces, multipliers) into a single die. FPGAs sit at the top of the digital logic hierarchy: programmable logic -> configurable logic block -> FPGA -> programmable semiconductor. Stratix III in particular introduced advanced power management, hard memory controllers, and DSP blocks, making it the workhorse for high-throughput digital signal processing, high-speed serial links, and ASIC prototyping in the late-2000s and early-2010s design cycles.
Key features include 47,500 logic elements, 2,184,192 embedded RAM bits (about 273 KB), 488 user I/Os, hard DSP blocks for high-speed arithmetic, hard memory controllers supporting DDR/DDR2/DDR3, and dedicated high-speed transceivers in higher-density family members. The 65 nm process delivers a favorable performance-per-watt ratio versus the prior Stratix II generation, and the 780-ball FC-FBGA package exposes many high-speed SERDES-capable pins while keeping board-level routing feasible.
Typical applications include ASIC prototyping and emulation, high-speed data-acquisition front-ends, telecom baseband signal processing, military/aerospace DSP, test-and-measurement instrumentation, and high-performance compute accelerators. The large logic capacity combined with 488 user I/Os also makes it suitable for industrial imaging and broadcast video processing.
When designing with the EP3SL50F780C4N, follow Altera's Stratix III Hardware Reference Manual power-up sequencing: drive all power rails through the Power Management Bus (PMBus) or a TI/Linear Technology sequencer, and respect the 1.1 V core / 0.86-1.15 V supply window. Decoupling and PCB layout for a 780-ball FC-FBGA demand a multilayer board with buried vias and a solid ground pour.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. The data sources include distributor listings, the Altera/Intel Stratix III datasheet family, and the manufacturer product page.
드롭인 대체품: EP3SL50F780C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL50F780C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Embedded Memory, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL50F780C3N
✅ 드롭인✓ 재고 있음
$555 / 개
데이터시트 보기 →EP3SL50F780C4
✅ 드롭인✓ 재고 있음
$220 / 개
데이터시트 보기 →EP3SL50F780C2N
✅ 드롭인✓ 재고 있음
$312 / 개
데이터시트 보기 →EP3SE50F780C4N
✅ 드롭인✓ 재고 있음
$1430 / 개
데이터시트 보기 →EP3SE50F780C3N
✅ 드롭인✓ 재고 있음
$717.12 / 개
데이터시트 보기 →EP3SL50F780C4N 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Series | EP3SL50 |
| Logic Elements (LEs) | 47,500 |
| Number of LABs / CLBs | 1,900 |
| Total RAM Bits | 2,184,192 (273 KB) |
| Number of User I/Os | 488 |
| Number of GPIO | 488 |
| 패키지 | 780-BBGA, FCBGA (FBGA-780) |
| Process Technology | 65 nm CMOS |
| Speed Grade | -4 |
| 동작 온도 | 0C to +85C (commercial) |
| Core Voltage Range | 0.86 V to 1.15 V |
| 실장 유형 | Surface Mount |
| Lead Free / RoHS | Lead free, RoHS compliant per distributor listing |
| Maximum Operating Frequency | 717 MHz (per family) |
| DSP Blocks | Hard DSP blocks (Stratix III family) |
| Memory Interface Support | DDR, DDR2, DDR3 (family feature) |
EP3SL50F780C4N 780-bbga, fcbga (fbga-780) 핀 구성 가이드
EP3SL50F780C4N(780-bbga, fcbga (fbga-780) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL50F780C4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL50F780C4N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Telecom Baseband Signal Processing, High-Speed Data Acquisition Front-End, Industrial Imaging and Machine Vision, Military and Aerospace Avionics DSP, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL50F780C4N is widely used as an ASIC and SoC prototyping platform. With 47,500 LEs, 1,900 LABs, 2,184,192 bits of embedded block RAM, and 488 user I/Os, it can map mid-complexity ASIC RTL directly into programmable logic while preserving timing closure targets. Its hard DDR/DDR2/DDR3 memory controllers in the Stratix III L family shorten bring-up for memory subsystems that would otherwise require a soft controller. Combined with Quartus II synthesis and TimeQuest timing analysis, designers can validate multi-million-gate ASIC designs at near-ASIC clock frequencies. The 488 GPIO budget is more than enough to expose PCIe-style endpoints, memory buses, and high-speed parallel interfaces for in-system validation.
추천
Telecom Baseband Signal Processing
The Stratix III L family, including the EP3SL50F780C4N, is well-suited to telecom baseband processing where 65 nm power efficiency and hard DSP blocks are key advantages. The hard DSP blocks accelerate FIR filters, FFTs, and QAM demodulation, while the 488 user I/Os route multiple antenna data streams and CPRI/OBSAI baseband lanes. Operating at up to 717 MHz, the device sustains sample rates sufficient for LTE and early 5G prototype baseband chains. The low-power sub-family architecture keeps junction temperature manageable in dense line-card designs where multiple FPGAs share a confined chassis.
추천
High-Speed Data Acquisition Front-End
The EP3SL50F780C4N fits high-speed data acquisition front-ends that need large FIFOs and parallel ADC/DAC interfaces. Its 2,184,192 bits of embedded block RAM give a sustained on-chip buffering budget (about 273 KB) for high-sample-rate capture before DMA to host memory, while the 488 user I/Os allow direct interfacing to multi-channel LVDS or parallel CMOS ADCs without external muxes. Hard memory controllers simplify external DDR2/DDR3 buffering for sustained streams. The 780-ball FBGA package exposes enough high-speed SERDES-capable pins for typical 1-2 Gbps ADC link rates in test and measurement instruments.
추천
Industrial Imaging and Machine Vision
The EP3SL50F780C4N supports industrial imaging pipelines where raw sensor data throughput is the bottleneck. Its 488 user I/Os handle multiple Camera Link or MIPI CSI-2 channels, while hard DSP blocks accelerate 2D convolution and color-space conversion at line rate. The 273 KB of embedded block RAM is enough for line buffers in real-time image processing, and the 65 nm process keeps total power dissipation within industrial chassis thermal budgets. Quartus II IP cores for Camera Link, CoaXPress, and GigE Vision are validated on this device family, accelerating time-to-market for vision-system OEMs.
추천
Military and Aerospace Avionics DSP
Aerospace and defense programs continue to use Stratix III devices such as the EP3SL50F780C4N for signal-intelligence and radar-baseband processing, where long product lifecycles and ITAR-controlled supply chains favor mature FPGAs. The 47,500 LEs are enough to implement pulse compression, MTI filtering, and beamforming for airborne radar front-ends, while the 488 GPIO count accommodates multiple analog front-end data lanes. The 65 nm Stratix III L process is qualified for harsh-environment operation, and the FBGA-780 package is compatible with established avionics PCB stackups. Many defense primes have validated FPGA bitstreams that they expect to re-use across production runs.
추천
Test and Measurement Instrumentation
The EP3SL50F780C4N is well-suited for high-end oscilloscopes, protocol analyzers, and logic analyzer back-ends. Its 488 user I/Os capture wide parallel buses, while hard memory controllers drive deep DDR3 acquisition memory. The hard DSP blocks accelerate real-time trigger calculations, FFT-based spectrum displays, and statistical analysis on multi-gigasample waveforms. The 65 nm Stratix III L power efficiency allows dense channel count in a single 1U or 2U chassis without thermal throttling, and the FBGA-780 package supports high-density PCB layouts required for multi-GHz analog front-ends adjacent to the FPGA.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL50F780C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL50F780C3N | EP3SL50F780C4 | EP3SL50F780C2N | EP3SE50F780C4N | EP3SE50F780C3N |
|---|---|---|---|---|---|---|
| Package | FBGA-780 | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | -4 | -3 | -4 | -2 | -4 | -3 |
| Sub-Family | L (Low power) | L (Low power) | L (Low power) | L (Low power) | E (Enhanced) | E (Enhanced) |
| Total RAM Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | Higher (E sub-family) | Higher (E sub-family) |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Process | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
주요 차별점
- Mid-density sweet spot in the Stratix III L family (vs EP3SL340F1760C4N)
- Low-power sub-family for thermal-constrained designs (vs EP3SE50F780C4N)
- Same-package speed-grade flexibility (vs EP3SL50F780C3N)
설계 노트
Stratix III FPGAs require multi-rail power sequencing (VCCINT 1.1 V, VCCAUX, VCCIO banks, VCCPD, VCCBAT) per the Stratix III Power Management Bus specification. Use a TI TPS53820 or equivalent PMBus-compliant controller. Power-on must follow the VCCINT -> VCCAUX -> VCCIO order; violation can cause long-term reliability degradation or inrush latch-up. For the EP3SL50F780C4N at full utilization, plan a 6-8 layer PCB with a 1 oz copper inner core and 2 oz top/bottom pour to keep VCCINT IR drop below 50 mV.
The FBGA-780 package is 1.0 mm pitch, demanding blind or buried microvias in the breakout region. Recommended stackup is a 1-6-1 or 2-8-2 build with the BGA land pads on the top layer and via-in-pad for inner rows. Provide a continuous ground plane directly under the BGA and stitch grounds with 200-mil spacing to control return-path impedance for the high-speed transceivers. Use Altera's FBGA-780 package-symbol and pin-out files from Quartus II to drive your CAD library.
Common design pitfalls for the EP3SL50F780C4N: (1) forgetting the CF (configuration) pin pull-up requirements for AS or JTAG modes; (2) leaving any VCCIO bank unconnected - all banks must be powered, even unused ones; (3) under-estimating configuration time for 47,500-LE designs and selecting an EPCS or EPCQ flash too small; (4) omitting the POR (power-on-reset) decoupling on VCCPD - causes random configuration failures at cold start. Refer to AN 571: Using the Stratix III Configuration Scheme for a checklist.
Estimated: at 100% LE utilization, 50% toggle rate, and 717 MHz operation, the EP3SL50F780C4N can dissipate 4-6 W. With the FBGA-780 theta_JA around 13-15 C/W for a JEDEC 8-layer test board (refer to package thermal model), junction temperature rises 50-90 C above ambient. Without airflow or a heatsink, derate clock rate or utilization to keep Tj below 100 C in commercial-temperature applications. Use the Stratix III PowerPlay Early Power Estimator (EPE) spreadsheet to validate your thermal budget before tape-out.
규정 준수 정보
RoHS and lead-free status confirmed by distributor listings (DigiKey, Octopart). Stratix III is not AEC-Q100 qualified - it is a commercial/industrial/military-temp FPGA. Halogen-free status not explicitly confirmed in distributor data - left as unknown.
