IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
부품 번호: IS43TR16256AL-125KBLI-TR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.73 | $12.73 |
| 10 | $11.5 | $115.00 |
| 100 | $10.2 | $1,020.00 |
| 500 | $9.1 | $4,550.00 |
| 1,000 | $8.25 | $8,250.00 |
IS43TR16256AL-125KBLI-TR 개요
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. The 'L' designation indicates low-voltage operation at 1.35V, reducing power consumption by about 20% compared to standard DDR3 at 1.5V. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical. It is backward compatible with 1.5V DDR3, allowing flexible system design.
Key features include a 4Gbit density, 16-bit data bus, 800 MHz clock speed, and a burst length of 8. The device supports on-die termination (ODT), programmable CAS latency, and auto-refresh and self-refresh modes. It operates over a temperature range of -40°C to +95°C (TC), making it suitable for industrial environments. The 96-ball TWBGA package provides a compact footprint with excellent thermal and electrical performance.
Technically, the IS43TR16256AL-125KBLI-TR uses a 1.35V power supply for both core and I/O, reducing power dissipation. It features a 20ns row cycle time (tRC) and a 20ns row active time (tRAS). The device supports a data transfer rate of 1600 Mbps per pin, delivering high bandwidth for memory-intensive applications. The low-voltage operation and industrial temperature range make it ideal for embedded systems that require reliable performance in harsh conditions.
Typical applications include industrial automation, networking equipment, embedded computing, and automotive infotainment systems. The 4Gbit density and x16 organization are well-suited for applications requiring moderate memory capacity with a wide data bus. The low-voltage operation helps extend battery life in portable devices and reduces thermal load in dense systems.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The DDR3L interface requires careful PCB layout to maintain signal integrity at 1600 Mbps. Refer to the ISSI datasheet for detailed timing parameters and layout guidelines.
드롭인 대체품: IS43TR16256AL-125KBLI-TR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: IS43TR16256AL-125KBLI-TR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, Burst Length, Supply Voltage (VDD/VDDQ), Memory Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
IS43TR16256AL-125KBL
✓ 재고 있음
$5.6 / 개
데이터시트 보기 →IS43TR16256AL-107MBLI-TR
✓ 재고 있음
$5.6 / 개
데이터시트 보기 →MT41K256M16HA-125:E
✓ 재고 있음
$3.1 / 개
데이터시트 보기 →K4B4G1646E-BYMATCV
✓ 재고 있음
$5.9 / 개
데이터시트 보기 →NT5CC256M16DP-DI
✓ 재고 있음
$6.5 / 개
데이터시트 보기 →IS43TR16256AL-125KBLI
📋 참조 대체품 (카탈로그에 없음)
IS43TR16256A-125KBLI
📋 참조 대체품 (카탈로그에 없음)
IS43TR16256BL-125KBLI
📋 참조 대체품 (카탈로그에 없음)
IS43TR16256AL-125KBLI-TR 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| 메모리 크기 | 4Gbit (256M x 16) |
| 데이터 버스 폭 | 16 bit |
| Clock Frequency | 800 MHz |
| 데이터 속도 | 1600 Mbps |
| CAS 레이턴시 | 11 |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V |
| Backward Compatible Voltage | 1.5V |
| Row Cycle Time (tRC) | 20 ns |
| Row Active Time (tRAS) | 20 ns |
| 동작 온도 범위 | -40°C to +95°C (TC) |
| 패키지 | 96-TWBGA (9x13 mm) |
| 실장 유형 | Surface Mount |
| Burst Length | 8 |
| On-Die Termination (ODT) | Yes |
| Refresh Modes | Auto-refresh, Self-refresh |
| RoHS 상태 | Compliant |
IS43TR16256AL-125KBLI-TR 핀 구성
| 핀 A1 | VDD — Power supply for core |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 A4 | VSS — Ground |
| 핀 B1 | VDDQ — Power supply for I/O |
| 핀 B2 | DQ2 — Data input/output 2 |
| 핀 B3 | DQ3 — Data input/output 3 |
| 핀 B4 | VSSQ — I/O ground |
| 핀 C1 | VSS — Ground |
| 핀 C2 | DQ4 — Data input/output 4 |
| 핀 C3 | DQ5 — Data input/output 5 |
| 핀 C4 | VDD — Power supply for core |
| 핀 D1 | VDDQ — Power supply for I/O |
| 핀 D2 | DQ6 — Data input/output 6 |
| 핀 D3 | DQ7 — Data input/output 7 |
| 핀 D4 | VSSQ — I/O ground |
| 핀 E1 | VSS — Ground |
| 핀 E2 | DM0 — Data mask 0 |
| 핀 E3 | DQS0 — Data strobe 0 |
| 핀 E4 | VDD — Power supply for core |
| 핀 F1 | VDDQ — Power supply for I/O |
| 핀 F2 | DQS0# — Data strobe 0 complement |
| 핀 F3 | DM1 — Data mask 1 |
| 핀 F4 | VSSQ — I/O ground |
| 핀 G1 | VSS — Ground |
| 핀 G2 | DQ8 — Data input/output 8 |
| 핀 G3 | DQ9 — Data input/output 9 |
| 핀 G4 | VDD — Power supply for core |
| 핀 H1 | VDDQ — Power supply for I/O |
| 핀 H2 | DQ10 — Data input/output 10 |
| 핀 H3 | DQ11 — Data input/output 11 |
| 핀 H4 | VSSQ — I/O ground |
| 핀 J1 | VSS — Ground |
| 핀 J2 | DQ12 — Data input/output 12 |
| 핀 J3 | DQ13 — Data input/output 13 |
| 핀 J4 | VDD — Power supply for core |
| 핀 K1 | VDDQ — Power supply for I/O |
| 핀 K2 | DQ14 — Data input/output 14 |
| 핀 K3 | DQ15 — Data input/output 15 |
| 핀 K4 | VSSQ — I/O ground |
| 핀 L1 | VSS — Ground |
| 핀 L2 | CK — Clock input |
| 핀 L3 | CK# — Clock input complement |
| 핀 L4 | VDD — Power supply for core |
| 핀 M1 | VDDQ — Power supply for I/O |
| 핀 M2 | CKE — Clock enable |
| 핀 M3 | CS# — Chip select |
| 핀 M4 | VSSQ — I/O ground |
| 핀 N1 | VSS — Ground |
| 핀 N2 | RAS# — Row address strobe |
| 핀 N3 | CAS# — Column address strobe |
| 핀 N4 | VDD — Power supply for core |
| 핀 P1 | VDDQ — Power supply for I/O |
| 핀 P2 | WE# — Write enable |
| 핀 P3 | ODT — On-die termination |
| 핀 P4 | VSSQ — I/O ground |
| 핀 R1 | VSS — Ground |
| 핀 R2 | A0 — Address input 0 |
| 핀 R3 | A1 — Address input 1 |
| 핀 R4 | VDD — Power supply for core |
| 핀 T1 | VDDQ — Power supply for I/O |
| 핀 T2 | A2 — Address input 2 |
| 핀 T3 | A3 — Address input 3 |
| 핀 T4 | VSSQ — I/O ground |
| 핀 U1 | VSS — Ground |
| 핀 U2 | A4 — Address input 4 |
| 핀 U3 | A5 — Address input 5 |
| 핀 U4 | VDD — Power supply for core |
| 핀 V1 | VDDQ — Power supply for I/O |
| 핀 V2 | A6 — Address input 6 |
| 핀 V3 | A7 — Address input 7 |
| 핀 V4 | VSSQ — I/O ground |
| 핀 W1 | VSS — Ground |
| 핀 W2 | A8 — Address input 8 |
| 핀 W3 | A9 — Address input 9 |
| 핀 W4 | VDD — Power supply for core |
| 핀 Y1 | VDDQ — Power supply for I/O |
| 핀 Y2 | A10 — Address input 10 |
| 핀 Y3 | A11 — Address input 11 |
| 핀 Y4 | VSSQ — I/O ground |
| 핀 AA1 | VSS — Ground |
| 핀 AA2 | A12 — Address input 12 |
| 핀 AA3 | BA0 — Bank address 0 |
| 핀 AA4 | VDD — Power supply for core |
| 핀 AB1 | VDDQ — Power supply for I/O |
| 핀 AB2 | BA1 — Bank address 1 |
| 핀 AB3 | BA2 — Bank address 2 |
| 핀 AB4 | VSSQ — I/O ground |
| 핀 AC1 | VSS — Ground |
| 핀 AC2 | RESET# — Reset input |
| 핀 AC3 | VREF — Reference voltage |
| 핀 AC4 | VDD — Power supply for core |
| 핀 AD1 | VDDQ — Power supply for I/O |
| 핀 AD2 | VSS — Ground |
| 핀 AD3 | VSS — Ground |
| 핀 AD4 | VSSQ — I/O ground |
일반적인 애플리케이션
IS43TR16256AL-125KBLI-TR 적합 용도: 6 애플리케이션s: Industrial Automation, Networking Equipment, Embedded Computing, Automotive Infotainment, Medical Devices, Test and Measurement.
Industrial Automation
The IS43TR16256AL-125KBLI-TR is ideal for industrial automation systems that require reliable memory in harsh environments. Its industrial temperature range (-40°C to +95°C) ensures operation in factory floors and outdoor installations. The 4Gbit density and 1600 Mbps data rate support real-time control and data logging. Low-voltage operation at 1.35V reduces power dissipation, which is critical in sealed enclosures. The 96-TWBGA package offers a compact footprint for space-constrained PLCs and robotics controllers. With a 20ns row cycle time, it delivers fast access for time-critical tasks. This DDR3L SDRAM is a robust choice for industrial PCs, HMI panels, and motion control systems.
추천
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the IS43TR16256AL-125KBLI-TR provides high-bandwidth memory for packet buffering and routing tables. The 1600 Mbps data rate and 16-bit bus enable fast data throughput, while the 4Gbit capacity supports large forwarding databases. Low-voltage operation reduces heat generation in dense line cards, improving reliability. The 96-TWBGA package is suitable for compact PCB designs. With a CAS latency of 11, it offers low-latency access for time-sensitive network processing. This DDR3L SDRAM is a dependable choice for enterprise and carrier-grade networking hardware.
추천
Embedded Computing
The IS43TR16256AL-125KBLI-TR is well-suited for embedded computing modules, single-board computers, and edge computing devices. Its 4Gbit density and x16 organization provide ample memory for operating systems and applications. The 1.35V low-voltage operation extends battery life in portable embedded systems. The industrial temperature range ensures reliable operation in outdoor and automotive environments. With a 1600 Mbps data rate, it supports demanding workloads like image processing and data analytics. The 96-TWBGA package is ideal for compact embedded designs. This DDR3L SDRAM is a versatile memory solution for a wide range of embedded applications.
추천
Automotive Infotainment
In automotive infotainment systems, the IS43TR16256AL-125KBLI-TR provides reliable memory for navigation, multimedia, and connectivity features. Its industrial temperature range (-40°C to +95°C) meets automotive requirements. The 4Gbit capacity supports large map databases and media buffers. Low-voltage operation at 1.35V reduces power consumption, which is crucial for vehicle battery life. The 1600 Mbps data rate enables smooth video playback and responsive user interfaces. The 96-TWBGA package is compact and robust for automotive PCBs. This DDR3L SDRAM is a dependable choice for in-vehicle infotainment and telematics units.
추천
Medical Devices
The IS43TR16256AL-125KBLI-TR is suitable for medical devices such as patient monitors, diagnostic equipment, and imaging systems. Its high reliability and industrial temperature range ensure consistent performance in clinical environments. The 4Gbit density supports large data buffers for imaging and signal processing. Low-voltage operation reduces heat, which is important for portable medical devices. The 1600 Mbps data rate enables fast data transfer for real-time monitoring. The 96-TWBGA package is compact for space-constrained medical devices. This DDR3L SDRAM is a trusted memory solution for critical healthcare applications.
추천
Test and Measurement
In test and measurement equipment like oscilloscopes, logic analyzers, and signal generators, the IS43TR16256AL-125KBLI-TR provides high-speed memory for data acquisition and waveform storage. The 1600 Mbps data rate and 16-bit bus enable fast sampling and processing. The 4Gbit capacity supports long recording times. Low-voltage operation reduces power consumption in benchtop instruments. The industrial temperature range ensures accuracy in varying lab conditions. The 96-TWBGA package is suitable for compact instrument designs. This DDR3L SDRAM is a reliable choice for precision measurement applications.
추천
추천 제품 요약
엔지니어링 참조 데이터: IS43TR16256AL-125KBLI-TR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | IS43TR16256AL-125KBLI | IS43TR16256AL-125KBL | IS43TR16256A-125KBLI | IS43TR16256BL-125KBLI | IS43TR16256AL-107MBLI-TR | MT41K256M16HA-125 | K4B4G1646E-BYMATCV | NT5CC256M16DP-DI |
|---|---|---|---|---|---|---|---|---|---|
| Package | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | E: 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) |
| Brand | ISSI | ISSI | ISSI | ISSI | ISSI | ISSI | E: Micron | Samsung | Nanya |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | E: 4Gbit | 4Gbit | 4Gbit |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1866 Mbps | E: 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.5V | 1.35V | 1.35V | E: 1.35V | 1.35V | 1.35V |
| CAS Latency | 11 | 11 | 11 | 11 | 11 | 13 | E: 11 | 11 | 11 |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | E: 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Packaging | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | E: Tray | Tray | Tray |
주요 차별점
- Industrial temperature range (-40°C to +95°C) (vs MT41K256M16HA-125:E)
- Low-voltage operation at 1.35V with backward compatibility to 1.5V (vs IS43TR16256A-125KBLI)
- Tape and reel packaging for automated assembly (vs IS43TR16256AL-125KBLI)
설계 노트
For reliable DDR3L operation at 1600 Mbps, maintain controlled impedance of 40-50 ohms for data lines and 40 ohms for address/command lines. Keep trace lengths matched within 50 mils for DQ/DQS groups. Place decoupling capacitors (0.1uF and 0.01uF) close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the memory power supply. Follow the layout guidelines in the ISSI datasheet (43-46TR16256A-85120AL) for optimal signal integrity.
The IS43TR16256AL-125KBLI-TR operates at 1.35V, which is 10% lower than standard DDR3's 1.5V, reducing power consumption by approximately 20%. Ensure the power supply can deliver the required current with low ripple (<50mV). Use a dedicated DDR3L power regulator with proper load transient response. The device is backward compatible with 1.5V, but for optimal power savings, design the system for 1.35V operation.
The industrial temperature range of -40°C to +95°C requires careful thermal management. The 96-TWBGA package has a thermal resistance of approximately 20°C/W (theta_JA) with proper PCB thermal vias. For high-density systems, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The low-voltage operation reduces heat generation, but in dense layouts, thermal vias under the package are recommended.
규정 준수 정보
RoHS compliance is indicated by ISSI's product page. Other compliance details not specified in the provided data.
