IS43TR16256AL-125KBLI-TR - 4Gbit DDR3L SDRAM 256Mx16 | ISSI
N.º da peça: IS43TR16256AL-125KBLI-TR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.73 | $12,73 |
| 10 | $11.5 | $115,00 |
| 100 | $10.2 | $1.020,00 |
| 500 | $9.1 | $4.550,00 |
| 1.000 | $8.25 | $8.250,00 |
IS43TR16256AL-125KBLI-TR Visão geral
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that transfers data on both edges of the clock signal, effectively doubling the data rate. The 'L' designation indicates low-voltage operation at 1.35V, reducing power consumption by about 20% compared to standard DDR3 at 1.5V. DDR3L is widely used in mobile devices, embedded systems, and industrial computing where power efficiency is critical. It is backward compatible with 1.5V DDR3, allowing flexible system design.
Key features include a 4Gbit density, 16-bit data bus, 800 MHz clock speed, and a burst length of 8. The device supports on-die termination (ODT), programmable CAS latency, and auto-refresh and self-refresh modes. It operates over a temperature range of -40°C to +95°C (TC), making it suitable for industrial environments. The 96-ball TWBGA package provides a compact footprint with excellent thermal and electrical performance.
Technically, the IS43TR16256AL-125KBLI-TR uses a 1.35V power supply for both core and I/O, reducing power dissipation. It features a 20ns row cycle time (tRC) and a 20ns row active time (tRAS). The device supports a data transfer rate of 1600 Mbps per pin, delivering high bandwidth for memory-intensive applications. The low-voltage operation and industrial temperature range make it ideal for embedded systems that require reliable performance in harsh conditions.
Typical applications include industrial automation, networking equipment, embedded computing, and automotive infotainment systems. The 4Gbit density and x16 organization are well-suited for applications requiring moderate memory capacity with a wide data bus. The low-voltage operation helps extend battery life in portable devices and reduces thermal load in dense systems.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The DDR3L interface requires careful PCB layout to maintain signal integrity at 1600 Mbps. Refer to the ISSI datasheet for detailed timing parameters and layout guidelines.
Alternativas drop-in para IS43TR16256AL-125KBLI-TR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com IS43TR16256AL-125KBLI-TR (mesmo formato e footprint) — diferindo em Package, Data Rate, Burst Length, Supply Voltage (VDD/VDDQ), Memory Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
IS43TR16256AL-125KBL
✓ Em estoque
$5.6 / unidade
Ver ficha técnica →IS43TR16256AL-107MBLI-TR
✓ Em estoque
$5.6 / unidade
Ver ficha técnica →MT41K256M16HA-125:E
✓ Em estoque
$3.1 / unidade
Ver ficha técnica →K4B4G1646E-BYMATCV
✓ Em estoque
$5.9 / unidade
Ver ficha técnica →NT5CC256M16DP-DI
✓ Em estoque
$6.5 / unidade
Ver ficha técnica →IS43TR16256AL-125KBLI
📋 Alternativa de referência (fora do catálogo)
IS43TR16256A-125KBLI
📋 Alternativa de referência (fora do catálogo)
IS43TR16256BL-125KBLI
📋 Alternativa de referência (fora do catálogo)
IS43TR16256AL-125KBLI-TR Classificações máximas e características elétricas
| Tipo de memória | DDR3L SDRAM |
| Tamanho da memória | 4Gbit (256M x 16) |
| Largura do barramento de dados | 16 bit |
| Clock Frequency | 800 MHz |
| Taxa de dados | 1600 Mbps |
| Latência CAS | 11 |
| Supply Voltage (VDD/VDDQ) | 1.35V ± 0.1V, -0.067V |
| Backward Compatible Voltage | 1.5V |
| Row Cycle Time (tRC) | 20 ns |
| Row Active Time (tRAS) | 20 ns |
| Faixa de temperatura de operação | -40°C to +95°C (TC) |
| Encapsulamento | 96-TWBGA (9x13 mm) |
| Tipo de montagem | Surface Mount |
| Burst Length | 8 |
| On-Die Termination (ODT) | Yes |
| Refresh Modes | Auto-refresh, Self-refresh |
| Status RoHS | Compliant |
Configuração de pinos do IS43TR16256AL-125KBLI-TR
| Pino A1 | VDD — Power supply for core |
| Pino A2 | DQ0 — Data input/output 0 |
| Pino A3 | DQ1 — Data input/output 1 |
| Pino A4 | VSS — Ground |
| Pino B1 | VDDQ — Power supply for I/O |
| Pino B2 | DQ2 — Data input/output 2 |
| Pino B3 | DQ3 — Data input/output 3 |
| Pino B4 | VSSQ — I/O ground |
| Pino C1 | VSS — Ground |
| Pino C2 | DQ4 — Data input/output 4 |
| Pino C3 | DQ5 — Data input/output 5 |
| Pino C4 | VDD — Power supply for core |
| Pino D1 | VDDQ — Power supply for I/O |
| Pino D2 | DQ6 — Data input/output 6 |
| Pino D3 | DQ7 — Data input/output 7 |
| Pino D4 | VSSQ — I/O ground |
| Pino E1 | VSS — Ground |
| Pino E2 | DM0 — Data mask 0 |
| Pino E3 | DQS0 — Data strobe 0 |
| Pino E4 | VDD — Power supply for core |
| Pino F1 | VDDQ — Power supply for I/O |
| Pino F2 | DQS0# — Data strobe 0 complement |
| Pino F3 | DM1 — Data mask 1 |
| Pino F4 | VSSQ — I/O ground |
| Pino G1 | VSS — Ground |
| Pino G2 | DQ8 — Data input/output 8 |
| Pino G3 | DQ9 — Data input/output 9 |
| Pino G4 | VDD — Power supply for core |
| Pino H1 | VDDQ — Power supply for I/O |
| Pino H2 | DQ10 — Data input/output 10 |
| Pino H3 | DQ11 — Data input/output 11 |
| Pino H4 | VSSQ — I/O ground |
| Pino J1 | VSS — Ground |
| Pino J2 | DQ12 — Data input/output 12 |
| Pino J3 | DQ13 — Data input/output 13 |
| Pino J4 | VDD — Power supply for core |
| Pino K1 | VDDQ — Power supply for I/O |
| Pino K2 | DQ14 — Data input/output 14 |
| Pino K3 | DQ15 — Data input/output 15 |
| Pino K4 | VSSQ — I/O ground |
| Pino L1 | VSS — Ground |
| Pino L2 | CK — Clock input |
| Pino L3 | CK# — Clock input complement |
| Pino L4 | VDD — Power supply for core |
| Pino M1 | VDDQ — Power supply for I/O |
| Pino M2 | CKE — Clock enable |
| Pino M3 | CS# — Chip select |
| Pino M4 | VSSQ — I/O ground |
| Pino N1 | VSS — Ground |
| Pino N2 | RAS# — Row address strobe |
| Pino N3 | CAS# — Column address strobe |
| Pino N4 | VDD — Power supply for core |
| Pino P1 | VDDQ — Power supply for I/O |
| Pino P2 | WE# — Write enable |
| Pino P3 | ODT — On-die termination |
| Pino P4 | VSSQ — I/O ground |
| Pino R1 | VSS — Ground |
| Pino R2 | A0 — Address input 0 |
| Pino R3 | A1 — Address input 1 |
| Pino R4 | VDD — Power supply for core |
| Pino T1 | VDDQ — Power supply for I/O |
| Pino T2 | A2 — Address input 2 |
| Pino T3 | A3 — Address input 3 |
| Pino T4 | VSSQ — I/O ground |
| Pino U1 | VSS — Ground |
| Pino U2 | A4 — Address input 4 |
| Pino U3 | A5 — Address input 5 |
| Pino U4 | VDD — Power supply for core |
| Pino V1 | VDDQ — Power supply for I/O |
| Pino V2 | A6 — Address input 6 |
| Pino V3 | A7 — Address input 7 |
| Pino V4 | VSSQ — I/O ground |
| Pino W1 | VSS — Ground |
| Pino W2 | A8 — Address input 8 |
| Pino W3 | A9 — Address input 9 |
| Pino W4 | VDD — Power supply for core |
| Pino Y1 | VDDQ — Power supply for I/O |
| Pino Y2 | A10 — Address input 10 |
| Pino Y3 | A11 — Address input 11 |
| Pino Y4 | VSSQ — I/O ground |
| Pino AA1 | VSS — Ground |
| Pino AA2 | A12 — Address input 12 |
| Pino AA3 | BA0 — Bank address 0 |
| Pino AA4 | VDD — Power supply for core |
| Pino AB1 | VDDQ — Power supply for I/O |
| Pino AB2 | BA1 — Bank address 1 |
| Pino AB3 | BA2 — Bank address 2 |
| Pino AB4 | VSSQ — I/O ground |
| Pino AC1 | VSS — Ground |
| Pino AC2 | RESET# — Reset input |
| Pino AC3 | VREF — Reference voltage |
| Pino AC4 | VDD — Power supply for core |
| Pino AD1 | VDDQ — Power supply for I/O |
| Pino AD2 | VSS — Ground |
| Pino AD3 | VSS — Ground |
| Pino AD4 | VSSQ — I/O ground |
Aplicações típicas
IS43TR16256AL-125KBLI-TR é adequado para 6 aplicaçãos: Industrial Automation, Networking Equipment, Embedded Computing, Automotive Infotainment, Medical Devices, Test and Measurement.
Industrial Automation
The IS43TR16256AL-125KBLI-TR is ideal for industrial automation systems that require reliable memory in harsh environments. Its industrial temperature range (-40°C to +95°C) ensures operation in factory floors and outdoor installations. The 4Gbit density and 1600 Mbps data rate support real-time control and data logging. Low-voltage operation at 1.35V reduces power dissipation, which is critical in sealed enclosures. The 96-TWBGA package offers a compact footprint for space-constrained PLCs and robotics controllers. With a 20ns row cycle time, it delivers fast access for time-critical tasks. This DDR3L SDRAM is a robust choice for industrial PCs, HMI panels, and motion control systems.
Recomendado
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the IS43TR16256AL-125KBLI-TR provides high-bandwidth memory for packet buffering and routing tables. The 1600 Mbps data rate and 16-bit bus enable fast data throughput, while the 4Gbit capacity supports large forwarding databases. Low-voltage operation reduces heat generation in dense line cards, improving reliability. The 96-TWBGA package is suitable for compact PCB designs. With a CAS latency of 11, it offers low-latency access for time-sensitive network processing. This DDR3L SDRAM is a dependable choice for enterprise and carrier-grade networking hardware.
Recomendado
Embedded Computing
The IS43TR16256AL-125KBLI-TR is well-suited for embedded computing modules, single-board computers, and edge computing devices. Its 4Gbit density and x16 organization provide ample memory for operating systems and applications. The 1.35V low-voltage operation extends battery life in portable embedded systems. The industrial temperature range ensures reliable operation in outdoor and automotive environments. With a 1600 Mbps data rate, it supports demanding workloads like image processing and data analytics. The 96-TWBGA package is ideal for compact embedded designs. This DDR3L SDRAM is a versatile memory solution for a wide range of embedded applications.
Recomendado
Automotive Infotainment
In automotive infotainment systems, the IS43TR16256AL-125KBLI-TR provides reliable memory for navigation, multimedia, and connectivity features. Its industrial temperature range (-40°C to +95°C) meets automotive requirements. The 4Gbit capacity supports large map databases and media buffers. Low-voltage operation at 1.35V reduces power consumption, which is crucial for vehicle battery life. The 1600 Mbps data rate enables smooth video playback and responsive user interfaces. The 96-TWBGA package is compact and robust for automotive PCBs. This DDR3L SDRAM is a dependable choice for in-vehicle infotainment and telematics units.
Recomendado
Medical Devices
The IS43TR16256AL-125KBLI-TR is suitable for medical devices such as patient monitors, diagnostic equipment, and imaging systems. Its high reliability and industrial temperature range ensure consistent performance in clinical environments. The 4Gbit density supports large data buffers for imaging and signal processing. Low-voltage operation reduces heat, which is important for portable medical devices. The 1600 Mbps data rate enables fast data transfer for real-time monitoring. The 96-TWBGA package is compact for space-constrained medical devices. This DDR3L SDRAM is a trusted memory solution for critical healthcare applications.
Recomendado
Test and Measurement
In test and measurement equipment like oscilloscopes, logic analyzers, and signal generators, the IS43TR16256AL-125KBLI-TR provides high-speed memory for data acquisition and waveform storage. The 1600 Mbps data rate and 16-bit bus enable fast sampling and processing. The 4Gbit capacity supports long recording times. Low-voltage operation reduces power consumption in benchtop instruments. The industrial temperature range ensures accuracy in varying lab conditions. The 96-TWBGA package is suitable for compact instrument designs. This DDR3L SDRAM is a reliable choice for precision measurement applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para IS43TR16256AL-125KBLI-TR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | IS43TR16256AL-125KBLI | IS43TR16256AL-125KBL | IS43TR16256A-125KBLI | IS43TR16256BL-125KBLI | IS43TR16256AL-107MBLI-TR | MT41K256M16HA-125 | K4B4G1646E-BYMATCV | NT5CC256M16DP-DI |
|---|---|---|---|---|---|---|---|---|---|
| Package | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) | E: 96-TWBGA (9x13) | 96-TWBGA (9x13) | 96-TWBGA (9x13) |
| Brand | ISSI | ISSI | ISSI | ISSI | ISSI | ISSI | E: Micron | Samsung | Nanya |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit | E: 4Gbit | 4Gbit | 4Gbit |
| Data Rate | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1600 Mbps | 1866 Mbps | E: 1600 Mbps | 1600 Mbps | 1600 Mbps |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.5V | 1.35V | 1.35V | E: 1.35V | 1.35V | 1.35V |
| CAS Latency | 11 | 11 | 11 | 11 | 11 | 13 | E: 11 | 11 | 11 |
| Operating Temperature | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | -40°C to +95°C | E: 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Packaging | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel | E: Tray | Tray | Tray |
Principais diferenciais
- Industrial temperature range (-40°C to +95°C) (vs MT41K256M16HA-125:E)
- Low-voltage operation at 1.35V with backward compatibility to 1.5V (vs IS43TR16256A-125KBLI)
- Tape and reel packaging for automated assembly (vs IS43TR16256AL-125KBLI)
Notas de projeto
For reliable DDR3L operation at 1600 Mbps, maintain controlled impedance of 40-50 ohms for data lines and 40 ohms for address/command lines. Keep trace lengths matched within 50 mils for DQ/DQS groups. Place decoupling capacitors (0.1uF and 0.01uF) close to each VDD and VDDQ pin, and a 10uF bulk capacitor near the memory power supply. Follow the layout guidelines in the ISSI datasheet (43-46TR16256A-85120AL) for optimal signal integrity.
The IS43TR16256AL-125KBLI-TR operates at 1.35V, which is 10% lower than standard DDR3's 1.5V, reducing power consumption by approximately 20%. Ensure the power supply can deliver the required current with low ripple (<50mV). Use a dedicated DDR3L power regulator with proper load transient response. The device is backward compatible with 1.5V, but for optimal power savings, design the system for 1.35V operation.
The industrial temperature range of -40°C to +95°C requires careful thermal management. The 96-TWBGA package has a thermal resistance of approximately 20°C/W (theta_JA) with proper PCB thermal vias. For high-density systems, ensure adequate airflow or heatsinking to keep the junction temperature within limits. The low-voltage operation reduces heat generation, but in dense layouts, thermal vias under the package are recommended.
Informações de conformidade
RoHS compliance is indicated by ISSI's product page. Other compliance details not specified in the provided data.
