H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix
부품 번호: H5TC4G63AFR-PBI ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.2 | $720.00 |
| 500 | $6.8 | $3,400.00 |
| 1,000 | $6.5 | $6,500.00 |
H5TC4G63AFR-PBI 개요
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses double data rate signaling to transfer data on both edges of the clock, and is commonly used in servers, routers, and industrial PCs. DDR3L is backward compatible with DDR3 slots in many designs, making it a versatile choice for memory upgrades.
Key features include a 16-bit I/O width, 8 internal banks, and a burst length of 8 (BL8) with on-die termination (ODT) and programmable CAS latency. The device supports auto-refresh and self-refresh modes, with a typical refresh period of 7.8us at 85°C. The industrial temperature grade ensures reliable operation in harsh environments, and the 96-ball FBGA package provides a compact footprint for space-constrained designs.
The H5TC4G63AFR-PBI uses a CMOS process technology and features a pseudo-open-drain output driver with adjustable impedance. It includes a DLL (Delay-Locked Loop) for precise timing alignment and supports write leveling for improved signal integrity. The memory operates from a single 1.35V supply, with an on-chip voltage regulator for the core, reducing external component count.
Typical applications include network routers and switches, industrial automation controllers, embedded computing modules, and test and measurement equipment. Its low voltage and high density make it ideal for power-sensitive systems that require large memory capacity.
When designing with this device, ensure proper decoupling capacitors are placed near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a stable 1.35V supply and a clean clock signal for reliable operation.
드롭인 대체품: H5TC4G63AFR-PBI — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5TC4G63AFR-PBI (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, Burst Length, Supply Voltage, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5TC4G63AFR-PBR
✅ 드롭인✓ 재고 있음
$5.9091 / 개
데이터시트 보기 →H5TC4G63CFR-PBA
✅ 드롭인✓ 재고 있음
$6.23 / 개
데이터시트 보기 →H5TC4G63MFR-PBA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.5 / 개
데이터시트 보기 →MT41K256M16HA-125
✅ 드롭인✓ 재고 있음
$6.3636 / 개
데이터시트 보기 →MT41K256M16RE-125:D
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.19 / 개
데이터시트 보기 →IS43TR16256AL-125KBLI-TR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.25 / 개
데이터시트 보기 →NT5CC256M16ER-EKI
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.7045 / 개
데이터시트 보기 →K4B4G1646E-BYMA
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.3182 / 개
데이터시트 보기 →H5TC4G63AFR-PBI 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| 메모리 구성 | 256M x 16 |
| Total Memory Size | 4 Gb |
| 데이터 속도 | DDR3-1600 (PC3L-12800) |
| 공급 전압 | 1.35 V |
| Number of Banks | 8 |
| Burst Length | 8 (BL8) |
| CAS 레이턴시 | Programmable |
| On-Die Termination (ODT) | Yes |
| Refresh Period | 7.8 us at 85°C |
| 동작 온도 범위 | -40°C to +95°C |
| 패키지 | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| 실장 유형 | Surface Mount |
| Number of Terminals | 96 |
| RoHS 상태 | Compliant |
H5TC4G63AFR-PBI 핀 구성
| 핀 A1 | VDD — Power supply for core logic |
| 핀 A2 | VSS — Ground |
| 핀 A3 | DQ0 — Data input/output bit 0 |
| 핀 A4 | DQ1 — Data input/output bit 1 |
| 핀 A5 | VDDQ — Power supply for I/O |
| 핀 A6 | VSSQ — Ground for I/O |
| 핀 A7 | DQ2 — Data input/output bit 2 |
| 핀 A8 | DQ3 — Data input/output bit 3 |
| 핀 A9 | VDD — Power supply for core logic |
| 핀 A10 | VSS — Ground |
| 핀 B1 | VSS — Ground |
| 핀 B2 | DQ4 — Data input/output bit 4 |
| 핀 B3 | DQ5 — Data input/output bit 5 |
| 핀 B4 | VDDQ — Power supply for I/O |
| 핀 B5 | VSSQ — Ground for I/O |
| 핀 B6 | DQ6 — Data input/output bit 6 |
| 핀 B7 | DQ7 — Data input/output bit 7 |
| 핀 B8 | VDD — Power supply for core logic |
| 핀 B9 | VSS — Ground |
| 핀 B10 | CK — Clock input |
일반적인 애플리케이션
H5TC4G63AFR-PBI 적합 용도: 6 애플리케이션s: Network Routers and Switches, Industrial Automation Controllers, Embedded Computing Modules, Test and Measurement Equipment, Networking Appliances, Medical Monitoring Devices.
Network Routers and Switches
The H5TC4G63AFR-PBI provides 4Gb DDR3L memory for packet buffering and routing tables in network equipment. Its 1.35V operation reduces power consumption in 24/7 operation, and the industrial temperature range ensures reliability in telecom cabinets. The 16-bit interface simplifies PCB routing, and the 96-ball FBGA package saves board space. With DDR3-1600 speed, it handles high-throughput packet processing without bottlenecking the CPU.
추천
Industrial Automation Controllers
In industrial PLCs and robotics controllers, the H5TC4G63AFR-PBI offers reliable memory for real-time control algorithms and data logging. Its -40°C to +95°C range withstands factory floor temperatures, and the low 1.35V supply reduces heat generation in sealed enclosures. The 256Mx16 organization provides ample storage for program code and sensor data. The device's on-die termination improves signal integrity in noisy industrial environments.
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Embedded Computing Modules
The H5TC4G63AFR-PBI is ideal for single-board computers and embedded modules that require a balance of performance and power efficiency. Its 4Gb capacity supports Linux-based applications, and the 1.35V operation extends battery life in portable systems. The 96-ball FBGA package is compatible with standard manufacturing processes, and the industrial temperature grade allows deployment in outdoor kiosks and digital signage. The DDR3-1600 speed ensures smooth multitasking.
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Test and Measurement Equipment
In oscilloscopes, spectrum analyzers, and data acquisition systems, the H5TC4G63AFR-PBI provides high-speed memory for waveform capture and processing. Its DDR3-1600 data rate enables fast sampling, and the 16-bit interface matches ADC output widths. The industrial temperature range ensures accuracy in lab and field environments. The low 1.35V supply reduces noise coupling into analog front-ends, preserving measurement integrity.
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Networking Appliances
The H5TC4G63AFR-PBI is used in firewalls, VPN concentrators, and load balancers for session state storage and packet buffering. Its 4Gb density supports large connection tables, and the 1.35V operation reduces power in dense chassis. The industrial temperature range is suitable for server rooms with variable cooling. The device's burst length of 8 optimizes throughput for network traffic patterns.
추천
Medical Monitoring Devices
In patient monitors and diagnostic equipment, the H5TC4G63AFR-PBI provides reliable memory for real-time data processing and storage. Its industrial temperature range ensures operation in clinical environments, and the low 1.35V supply is suitable for battery-powered portable devices. The 4Gb capacity supports high-resolution waveform storage, and the 16-bit interface simplifies integration with medical-grade MCUs. The device's low power consumption extends battery life.
추천
추천 제품 요약
엔지니어링 참조 데이터: H5TC4G63AFR-PBI — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5TC4G63AFR-PBR | H5TC4G63CFR-PBA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) | 96-ball FBGA (same) | 96-ball FBGA (same) | 96-ball FBGA (same) |
| Brand | SK Hynix | SK Hynix | SK Hynix | Micron |
| Memory Size | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Data Rate | DDR3-1600 | DDR3-1600 | DDR3-1600 | DDR3-1600 |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Temperature Range | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C |
| Lifecycle Status | Obsolete | Obsolete | Active | Active |
주요 차별점
- Industrial temperature grade (vs H5TC4G63AFR-PBR)
- Low voltage operation (vs MT41K256M16HA-125)
- Pin compatibility with newer Hynix parts (vs H5TC4G63CFR-PBA)
설계 노트
The H5TC4G63AFR-PBI requires a stable 1.35V supply for VDD and VDDQ. Use low-ESR ceramic capacitors (0.1uF and 1uF) placed close to each power pin to decouple high-frequency noise. A bulk capacitor (10uF) should be placed near the memory device to handle transient currents during refresh and burst operations. Ensure the power supply can deliver peak current without voltage droop.
Follow the PCB layout guidelines in the SK Hynix datasheet to minimize signal integrity issues. Route DQ, DQS, and address/command lines with matched lengths to maintain timing. Use ground planes beneath the memory to reduce noise. Place termination resistors for ODT as recommended. Keep the clock traces short and shielded to avoid crosstalk.
The industrial temperature range (-40°C to +95°C) allows operation in harsh environments, but proper thermal management is still required. Ensure adequate airflow or heatsinking if the device is placed near other heat-generating components. The 96-ball FBGA package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values and design accordingly.
규정 준수 정보
RoHS compliant per Kynix product page. Not AEC-Q100 qualified. Other compliance data not available in provided sources.
