K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung
부품 번호: K4A4G085WD-BCPB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
K4A4G085WD-BCPB 개요
A DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random Access Memory) is a type of volatile memory IC that transfers data on both clock edges, sitting within the memory hierarchy as DRAM -> synchronous DRAM -> DDR SDRAM -> DDR4 SDRAM. DDR4 lowered operating voltage from 1.5V (DDR3) to 1.2V and increased bank-group architecture, improving bandwidth and power efficiency in servers, desktops, and industrial controllers.
Key features of this component include its 4Gb density in a x8 organization, 1.2V core supply consistent with the DDR4 JEDEC-era interface used across the industry, and the compact FBGA-78 footprint that enables high-density module layouts. The D-die generation provides the electrical characteristics Samsung documented in the K4A4G085WD family datasheet.
Architecturally, the device uses Samsung's D-die process with DDR4 bank-group parallelism, burst-oriented operation, and on-die termination practices typical of the DDR4 generation. Timing and AC parameters must be taken from the official Samsung K4A4G085WD datasheet for the specific speed grade.
Typical applications include UDIMM/SODIMM/RDIMM memory modules, embedded systems, industrial PCs, networking equipment, and set-top platforms that use discrete DDR4 components with a x8 data width.
When designing with this part, follow Samsung's DDR4 routing guidelines for fly-by or tree topology, length-matched address/command lines, and proper VTT/VDDQ decoupling; confirm the exact speed grade and timing parameters from the datasheet for your controller.
This page synthesizes verified distributor listings, drop-in alternatives, and sourcing context not found in the manufacturer datasheet, helping engineers and buyers evaluate the K4A4G085WD-BCPB alongside pin-compatible DDR4 options.
드롭인 대체품: K4A4G085WD-BCPB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K4A4G085WD-BCPB (동일 폼 팩터 및 풋프린트) — 차이점: Package, Interface, Data Rate, Memory Type, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K4A4G045WD-BCPB
✅ 드롭인✓ 재고 있음
$2.2 / 개
데이터시트 보기 →K4A4G085WD-BCRC
✅ 드롭인✓ 재고 있음
$3.58 / 개
데이터시트 보기 →K4A4G085WD
✅ 드롭인✓ 재고 있음
$2.05 / 개
데이터시트 보기 →K4A4G085WF-BITD
✅ 드롭인✓ 재고 있음
$2.65 / 개
데이터시트 보기 →MT40A512M8RH-075E:B
✅ 드롭인✓ 재고 있음
$2.15 / 개
데이터시트 보기 →K4A4G085WD-BCPB 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| Density | 4 Gb |
| 메모리 구성 | 512M x 8 |
| Die Generation | D-die |
| 공급 전압 | 1.2 V |
| 인터페이스 | DDR4 (Double Data Rate 4) |
| 패키지 | FBGA-78 (PB) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (PB lead-free suffix) |
| Datasheet Pages | 66 pages (K4A4G085WD family datasheet) |
K4A4G085WD-BCPB fbga-78 (pb) 핀 구성 가이드
K4A4G085WD-BCPB(fbga-78 (pb) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: K4A4G085WD-BCPB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
K4A4G085WD-BCPB 적합 용도: 6 애플리케이션s: DDR4 Memory Modules (UDIMM/SODIMM/RDIMM), Embedded and Industrial Systems, Networking and Communication Equipment, Consumer Electronics and Set-Top Platforms, Automotive-Adjacent Telematics and Displays, Test, Measurement, and Development Platforms.
DDR4 Memory Modules (UDIMM/SODIMM/RDIMM)
The K4A4G085WD-BCPB is a core building block for DDR4 memory modules, where eight or sixteen x8 components populate a 64-bit or 72-bit (with ECC) channel. Its 4Gb density in 512M x 8 organization and 1.2V DDR4 operation allow module makers to reach 4GB per rank with industry-standard FBGA-78 footprints shared across Samsung, Micron, and SK Hynix components. The PB speed bin must match the module's rated data rate; module houses typically qualify multiple die generations (D-die, E-die, F-die) against the same PCB to enable multi-sourcing. Placed on a fly-by address/command topology with per-byte length matching and VTT termination, the component delivers the full DDR4 channel bandwidth while on-die termination and DDR4 calibration features (write leveling, read training) absorb stack-up variations across the module. For ECC RDIMM designs, pair with a register buffer such as the M321R-family register components available on XAIPART.
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Embedded and Industrial Systems
Industrial PCs, PLCs, and embedded controllers use discrete DDR4 SDRAM components like the K4A4G085WD-BCPB for main memory next to x86 or ARM processors. Its 1.2V DDR4 interface aligns with modern SoC memory controllers, and the 4Gb x8 configuration supports 32-bit or 64-bit buses with 4 to 8 devices. The compact FBGA-78 package suits dense industrial boards, while RoHS-compliant lead-free finish meets industrial environmental requirements. Designers should follow the controller's DDR4 routing guide - point-to-point or fly-by topology, intra-byte skew control, and power-integrity analysis on the VDDQ rail - and validate the PB speed bin against the SoC's supported data rates. Because industrial products ship for many years, the availability of pin-compatible alternates (Samsung E-die K4A4G045WD-BCPB, Micron MT40A512M8RH-075E:B) on the same FBGA-78 footprint is a key supply-chain benefit; re-run DDR4 training on any second source.
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Networking and Communication Equipment
Routers, switches, and network appliances use the K4A4G085WD-BCPB as packet-buffer and control-plane memory alongside network processors. The 512M x 8 organization allows flexible bus widths - eight devices form a 64-bit DDR4 channel - and 4Gb density balances capacity against board space in 1U appliances. The 1.2V DDR4 rail reduces power per bit versus DDR3, important in fanless or constrained-thermal networking hardware. Designers route the FBGA-78 devices in a fly-by topology with on-die termination enabled and add VTT termination regulation on the address/command bus. The PB speed bin should be validated against the network processor's DDR4 controller timing table; where headroom exists, slower-bin second sources such as the K4A4G085WD-BCRC can be drop-in qualified. Multi-vendor footprint compatibility (Samsung/Micron FBGA-78) simplifies dual-sourcing in long-lifecycle telecom platforms subject to NEBS-style reliability programs.
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Consumer Electronics and Set-Top Platforms
Set-top boxes, smart TVs, and streaming media players use 4Gb DDR4 x8 components like the K4A4G085WD-BCPB as system memory for SoCs from vendors such as Rockchip, Amlogic, and Allwinner. Typically two or four devices provide 1-2 GB of 32-bit or 64-bit DDR4 memory, and the 1.2V operation keeps total DRAM power low for always-on consumer devices. The FBGA-78 footprint fits tightly around the SoC on cost-driven four-layer boards, though designers should verify signal-integrity margins on shorter point-to-point traces and enable the SoC's DDR4 training routines at boot. Consumer BOMs frequently qualify several DDR4 vendors; the K4A4G045WD-BCPB (same footprint, E-die) and Micron MT40A512M8RH-075E:B give purchasing teams alternate approved vendors without PCB respin, protecting production schedules against commodity DRAM allocation swings.
추천
Automotive-Adjacent Telematics and Displays
Digital cockpits, telematics gateways, and in-vehicle infotainment suppliers serving the automotive ecosystem use DDR4 SDRAM in x8 configurations for SoC main memory. While this commercial-grade K4A4G085WD-BCPB targets standard-temperature platforms, its architecture illustrates the DDR4 x8 FBGA-78 interface shared across automotive-qualified memory families. The 4Gb density and 1.2V operation support the memory bandwidth demands of HD displays, navigation stacks, and connectivity modules while keeping the DDR4 rail efficient. Board designers apply extended-temperature derating rules, stiff VDDQ decoupling for crank and load-dump transients managed upstream by regulators such as the TPS4H000 family, and conformal-coating-compatible BGA layouts. For programs requiring AEC-Q100-qualified memory, verify the automotive variant of Samsung's DDR4 line; the same footprint discipline allows platform reuse across commercial and automotive builds.
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Test, Measurement, and Development Platforms
Logic analyzers, protocol test fixtures, and DDR4 characterization platforms use the K4A4G085WD-BCPB as a known-good reference device for signal-integrity validation and memory-controller bring-up. The D-die generation's documented datasheet timing provides a stable reference for measuring setup/hold, eye margins, and write-leveling behavior across a 64-bit fly-by channel. Labs value the cross-vendor FBGA-78 interchangeability: swapping to Micron MT40A512M8RH-075E:B or Samsung E-die parts on the same fixture verifies controller robustness across die generations without fixture respin. When instrumenting, place probing vias at mid-bus points, maintain series damping resistors per the layout guide, and use the DDR4 controller's built-in training loops to log margin data. Engineers can also benchmark PB-bin devices against faster bins (e.g., BCRC) to quantify the controller's timing headroom before finalizing a production speed grade.
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추천 제품 요약
엔지니어링 참조 데이터: K4A4G085WD-BCPB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K4A4G045WD-BCPB | K4A4G085WD-BCRC | K4A4G085WF-BITD | MT40A512M8RH-075E:B |
|---|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Lead-Free Finish | Yes (PB suffix) | Yes (PB suffix) | Yes (PB suffix) | Yes (lead-free suffix) | Yes (RoHS) |
주요 차별점
- D-die generation with established module ecosystem (vs K4A4G045WD-BCPB)
- Same die family speed-bin flexibility (vs K4A4G085WD-BCRC)
- Cross-brand footprint second sourcing (vs MT40A512M8RH-075E:B)
설계 노트
Route the K4A4G085WD-BCPB per DDR4 fly-by topology: clock, address, and command signals daisy-chain from device to device with on-die termination enabled, while DQ/DM/DQS byte lanes are length-matched intra-byte (typically a few tens of mils of skew budget). Maintain controlled-impedance routing (approximately 40 ohm single-ended for DQ) and reference signals to a solid ground plane. Place the FBGA-78 devices close to the controller to limit stub effects, and follow the memory controller vendor's design guide for via stub minimization on inner-layer escape routing.
The 1.2V VDD/VDDQ rail carries the bulk of dynamic DRAM current, which scales with data rate and bus utilization. Decouple each FBGA-78 device with multiple 0.1 uF ceramics at the ball field plus bulk capacitance (10-47 uF) per device group. Provide a regulated VTT termination rail (0.6 V, VDDQ/2) for address/command termination with a dedicated LDO or sink-source termination regulator capable of bidirectional current. Estimate: current draw is dominated by Idd values in the Samsung K4A4G085WD datasheet - sum Idd0/Idd4N per your utilization model rather than guessing.
Do not assume all K4A4G085WD suffixes are interchangeable: the speed-bin code (PB vs RC) defines the guaranteed data rate and timing set, and swapping bins without re-validating controller timing can cause marginal boot failures at temperature extremes. After any second-source substitution (E-die K4A4G045WD-BCPB or Micron MT40A512M8RH-075E:B), re-run DDR4 write leveling, read training, and margin tests across the full temperature range. Also confirm ZQ calibration resistor placement (240 ohm 1%) per device per the Samsung datasheet.
규정 준수 정보
PB suffix denotes Samsung lead-free package/ball finish and RoHS compliance. REACH, halogen-free, and conflict-minerals declarations should be requested from Samsung per date code; they are not present in the provided web data.
