K4A4G085WD-BCPB - 4Gb DDR4 SDRAM x8 1.2V | Samsung
MPN: K4A4G085WD-BCPB ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for K4A4G085WD-BCPB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A4G045WD-BCPB
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View Datasheet →K4A4G085WD-BCRC
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View Datasheet →K4A4G085WD
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View Datasheet →K4A4G085WF-BITD
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View Datasheet →MT40A512M8RH-075E:B
✅ Drop-In✓ In Stock
$2.15 / Unit
View Datasheet →K4A4G085WD-BCPB Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 4 Gb |
| Organization | 512M x 8 |
| Die Generation | D-die |
| Supply Voltage | 1.2 V |
| Interface | DDR4 (Double Data Rate 4) |
| Package | FBGA-78 (PB) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (PB lead-free suffix) |
| Datasheet Pages | 66 pages (K4A4G085WD family datasheet) |
K4A4G085WD-BCPB fbga-78 (pb) Pin Configuration Guide
Complete pinout information for K4A4G085WD-BCPB (fbga-78 (pb) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4A4G085WD-BCPB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A4G085WD-BCPB is suitable for 6 applications: DDR4 Memory Modules (UDIMM/SODIMM/RDIMM), Embedded and Industrial Systems, Networking and Communication Equipment, Consumer Electronics and Set-Top Platforms, Automotive-Adjacent Telematics and Displays, Test, Measurement, and Development Platforms.
DDR4 Memory Modules (UDIMM/SODIMM/RDIMM)
The K4A4G085WD-BCPB is a core building block for DDR4 memory modules, where eight or sixteen x8 components populate a 64-bit or 72-bit (with ECC) channel. Its 4Gb density in 512M x 8 organization and 1.2V DDR4 operation allow module makers to reach 4GB per rank with industry-standard FBGA-78 footprints shared across Samsung, Micron, and SK Hynix components. The PB speed bin must match the module's rated data rate; module houses typically qualify multiple die generations (D-die, E-die, F-die) against the same PCB to enable multi-sourcing. Placed on a fly-by address/command topology with per-byte length matching and VTT termination, the component delivers the full DDR4 channel bandwidth while on-die termination and DDR4 calibration features (write leveling, read training) absorb stack-up variations across the module. For ECC RDIMM designs, pair with a register buffer such as the M321R-family register components available on XAIPART.
Recommended
Embedded and Industrial Systems
Industrial PCs, PLCs, and embedded controllers use discrete DDR4 SDRAM components like the K4A4G085WD-BCPB for main memory next to x86 or ARM processors. Its 1.2V DDR4 interface aligns with modern SoC memory controllers, and the 4Gb x8 configuration supports 32-bit or 64-bit buses with 4 to 8 devices. The compact FBGA-78 package suits dense industrial boards, while RoHS-compliant lead-free finish meets industrial environmental requirements. Designers should follow the controller's DDR4 routing guide - point-to-point or fly-by topology, intra-byte skew control, and power-integrity analysis on the VDDQ rail - and validate the PB speed bin against the SoC's supported data rates. Because industrial products ship for many years, the availability of pin-compatible alternates (Samsung E-die K4A4G045WD-BCPB, Micron MT40A512M8RH-075E:B) on the same FBGA-78 footprint is a key supply-chain benefit; re-run DDR4 training on any second source.
Recommended
Networking and Communication Equipment
Routers, switches, and network appliances use the K4A4G085WD-BCPB as packet-buffer and control-plane memory alongside network processors. The 512M x 8 organization allows flexible bus widths - eight devices form a 64-bit DDR4 channel - and 4Gb density balances capacity against board space in 1U appliances. The 1.2V DDR4 rail reduces power per bit versus DDR3, important in fanless or constrained-thermal networking hardware. Designers route the FBGA-78 devices in a fly-by topology with on-die termination enabled and add VTT termination regulation on the address/command bus. The PB speed bin should be validated against the network processor's DDR4 controller timing table; where headroom exists, slower-bin second sources such as the K4A4G085WD-BCRC can be drop-in qualified. Multi-vendor footprint compatibility (Samsung/Micron FBGA-78) simplifies dual-sourcing in long-lifecycle telecom platforms subject to NEBS-style reliability programs.
Recommended
Consumer Electronics and Set-Top Platforms
Set-top boxes, smart TVs, and streaming media players use 4Gb DDR4 x8 components like the K4A4G085WD-BCPB as system memory for SoCs from vendors such as Rockchip, Amlogic, and Allwinner. Typically two or four devices provide 1-2 GB of 32-bit or 64-bit DDR4 memory, and the 1.2V operation keeps total DRAM power low for always-on consumer devices. The FBGA-78 footprint fits tightly around the SoC on cost-driven four-layer boards, though designers should verify signal-integrity margins on shorter point-to-point traces and enable the SoC's DDR4 training routines at boot. Consumer BOMs frequently qualify several DDR4 vendors; the K4A4G045WD-BCPB (same footprint, E-die) and Micron MT40A512M8RH-075E:B give purchasing teams alternate approved vendors without PCB respin, protecting production schedules against commodity DRAM allocation swings.
Recommended
Automotive-Adjacent Telematics and Displays
Digital cockpits, telematics gateways, and in-vehicle infotainment suppliers serving the automotive ecosystem use DDR4 SDRAM in x8 configurations for SoC main memory. While this commercial-grade K4A4G085WD-BCPB targets standard-temperature platforms, its architecture illustrates the DDR4 x8 FBGA-78 interface shared across automotive-qualified memory families. The 4Gb density and 1.2V operation support the memory bandwidth demands of HD displays, navigation stacks, and connectivity modules while keeping the DDR4 rail efficient. Board designers apply extended-temperature derating rules, stiff VDDQ decoupling for crank and load-dump transients managed upstream by regulators such as the TPS4H000 family, and conformal-coating-compatible BGA layouts. For programs requiring AEC-Q100-qualified memory, verify the automotive variant of Samsung's DDR4 line; the same footprint discipline allows platform reuse across commercial and automotive builds.
Recommended
Test, Measurement, and Development Platforms
Logic analyzers, protocol test fixtures, and DDR4 characterization platforms use the K4A4G085WD-BCPB as a known-good reference device for signal-integrity validation and memory-controller bring-up. The D-die generation's documented datasheet timing provides a stable reference for measuring setup/hold, eye margins, and write-leveling behavior across a 64-bit fly-by channel. Labs value the cross-vendor FBGA-78 interchangeability: swapping to Micron MT40A512M8RH-075E:B or Samsung E-die parts on the same fixture verifies controller robustness across die generations without fixture respin. When instrumenting, place probing vias at mid-bus points, maintain series damping resistors per the layout guide, and use the DDR4 controller's built-in training loops to log margin data. Engineers can also benchmark PB-bin devices against faster bins (e.g., BCRC) to quantify the controller's timing headroom before finalizing a production speed grade.
Recommended
Recommended Products Summary
Engineering reference data for K4A4G085WD-BCPB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A4G045WD-BCPB | K4A4G085WD-BCRC | K4A4G085WF-BITD | MT40A512M8RH-075E:B |
|---|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same | FBGA-78 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Die Generation | D-die | E-die | D-die | F-die | [DATA_NEEDED] |
| Speed Bin / Data Rate | [DATA_NEEDED: speed bin PB per Samsung suffix table] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | DDR4-2400 class (075E bin) |
| Lead-Free Finish | Yes (PB suffix) | Yes (PB suffix) | Yes (PB suffix) | Yes (lead-free suffix) | Yes (RoHS) |
Key Differentiators
- D-die generation with established module ecosystem (vs K4A4G045WD-BCPB)
- Same die family speed-bin flexibility (vs K4A4G085WD-BCRC)
- Cross-brand footprint second sourcing (vs MT40A512M8RH-075E:B)
Design Notes
Route the K4A4G085WD-BCPB per DDR4 fly-by topology: clock, address, and command signals daisy-chain from device to device with on-die termination enabled, while DQ/DM/DQS byte lanes are length-matched intra-byte (typically a few tens of mils of skew budget). Maintain controlled-impedance routing (approximately 40 ohm single-ended for DQ) and reference signals to a solid ground plane. Place the FBGA-78 devices close to the controller to limit stub effects, and follow the memory controller vendor's design guide for via stub minimization on inner-layer escape routing.
The 1.2V VDD/VDDQ rail carries the bulk of dynamic DRAM current, which scales with data rate and bus utilization. Decouple each FBGA-78 device with multiple 0.1 uF ceramics at the ball field plus bulk capacitance (10-47 uF) per device group. Provide a regulated VTT termination rail (0.6 V, VDDQ/2) for address/command termination with a dedicated LDO or sink-source termination regulator capable of bidirectional current. Estimate: current draw is dominated by Idd values in the Samsung K4A4G085WD datasheet - sum Idd0/Idd4N per your utilization model rather than guessing.
Do not assume all K4A4G085WD suffixes are interchangeable: the speed-bin code (PB vs RC) defines the guaranteed data rate and timing set, and swapping bins without re-validating controller timing can cause marginal boot failures at temperature extremes. After any second-source substitution (E-die K4A4G045WD-BCPB or Micron MT40A512M8RH-075E:B), re-run DDR4 write leveling, read training, and margin tests across the full temperature range. Also confirm ZQ calibration resistor placement (240 ohm 1%) per device per the Samsung datasheet.
Compliance Information
PB suffix denotes Samsung lead-free package/ball finish and RoHS compliance. REACH, halogen-free, and conflict-minerals declarations should be requested from Samsung per date code; they are not present in the provided web data.
