K9F2808Q0B - 128Mb SLC NAND Flash 1.8V 63-TBGA | Samsung
부품 번호: K9F2808Q0B ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
K9F2808Q0B 개요
NAND Flash is a non-volatile memory technology that stores data in floating-gate cells arranged in series, enabling high density at low cost per bit. Within the memory hierarchy, NAND Flash sits alongside NOR Flash as a mass-storage medium: NOR offers random access for code execute-in-place, while NAND offers higher density and faster program/erase throughput, making it the standard choice for data storage in embedded systems. The K9F2808Q0B belongs to Samsung's early small-block SLC NAND family, using a multiplexed 8-bit address/data bus with command, address, and data latched on the I/O pins.
Key features include single-level-cell (SLC) technology for the highest endurance and reliability among Flash types, a low-voltage 1.8 V operating rail that reduces system power compared with 3.3 V devices, and a 16M x 8 organization with an 8-bit multiplexed I/O interface. Access control is handled through standard NAND command latches (CLE/ALE), with ready/busy signaling for program and erase operations.
Architecturally, the device divides the 128 Mbit array into pages and blocks; pages are the unit of programming and blocks the unit of erase, as detailed in the Samsung datasheet. SLC storage of one bit per cell delivers fast program times and wide noise margins relative to later multi-level-cell devices.
Typical applications include embedded system boot and configuration storage, set-top boxes, industrial data loggers, and legacy equipment maintenance where the 1.8 V rail and 63-TBGA footprint are already designed in.
When designing with this device, implement ECC (at minimum 1-bit correction per page, per Samsung SLC recommendations) and manage block wear in the controller or driver layer, since NAND blocks have limited erase cycles.
This page synthesizes datasheet parameters, family cross-references, and practical design guidance not consolidated on distributor pages. Pricing as of 2026-09-04.
드롭인 대체품: K9F2808Q0B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K9F2808Q0B (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, Interface, Organization, Package, Density.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K9F6408Q0C
✅ 드롭인✓ 재고 있음
$1.31 / 개
데이터시트 보기 →K9F6408U0B
✅ 드롭인✓ 재고 있음
$3.2 / 개
데이터시트 보기 →K9F2808U0B-DCB0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
K9F2808U0B-DIB0
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
K9F2808Q0B 최대 정격 & 전기적 특성
| 메모리 유형 | SLC NAND Flash (parallel) |
| Density | 128 Mbit |
| 메모리 구성 | 16M x 8 |
| Operating Voltage (VCC) | 1.7 V to 1.95 V |
| Read Access Speed | 50 ns |
| Cell Type | SLC (1 bit/cell) |
| 인터페이스 | 8-bit multiplexed address/data |
| 패키지 | 63-pin TBGA |
| Temperature Grade | C (commercial), I (industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | unknown |
| Production Status | Mass production (per legacy datasheet); now EOL/obsolete |
K9F2808Q0B 63-pin tbga 핀 구성 가이드
K9F2808Q0B(63-pin tbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: K9F2808Q0B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
K9F2808Q0B 적합 용도: 6 애플리케이션s: Embedded System Boot Storage, Set-Top Box and Consumer Electronics Firmware, Industrial Data Loggers, Legacy Equipment Maintenance and Repair, Handheld and Portable Instruments, Networking Equipment Configuration Storage.
Embedded System Boot Storage
The K9F2808Q0B stores boot code and configuration parameters in embedded systems where the processor already boots from a Samsung small-block NAND command set. Its 16M x 8 organization provides 16 MB of code space - ample for bootloaders, kernel images, and factory settings - while the 1.7 V to 1.95 V rail matches modern low-voltage microcontroller I/O. SLC cells retain data reliably across power cycles with 50 ns read access for fast boot sequencing. Designers must implement 1-bit-per-page ECC and bad-block scanning at the boot driver level, per Samsung's small-block NAND management scheme, since raw NAND requires controller-side error handling.
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Set-Top Box and Consumer Electronics Firmware
In set-top boxes and consumer media devices of the K9F design generation, the K9F2808Q0B held firmware images and channel/configuration databases on a 1.8 V rail that reduced system power versus 3.3 V NAND. The 128 Mbit density accommodated complete firmware plus user preference storage, and the 50 ns read speed supported in-place reads during firmware validation. The 63-pin TBGA package enabled compact two-sided board assembly in slim consumer enclosures. SLC endurance suited devices that rewrite settings daily; systems performing frequent recording needed external wear-leveling software to distribute erase cycles across the block array.
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Industrial Data Loggers
Industrial data loggers used the K9F2808Q0B to record sensor samples and event logs, exploiting the industrial (I) temperature grade (ordering variants such as -DIB0) and SLC reliability. The 1.8 V supply reduced logger power draw during battery operation, and the multiplexed 8-bit interface connected easily to low-pin-count microcontrollers through GPIO or memory controllers. The 16 MB capacity stored months of timestamped records, while SLC's wide noise margins protected data against the electrical noise typical of factory floors. Loggers must implement block wear leveling and power-fail recovery, since program interruption mid-page can corrupt the page, per Samsung's NAND management guidelines.
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Legacy Equipment Maintenance and Repair
For maintaining installed bases of equipment designed around the K9F2808Q0B, service organizations source this exact MPN because firmware images and address maps are hard-coded to its 16M x 8 geometry and 1.8 V rail. The 63-pin TBGA footprint and Samsung command-set timing mean a same-MPN replacement restores operation without firmware changes. Repair stock should be date-code controlled, since stored SLC NAND can accumulate bit errors over many years; reprogramming the spare parts and verifying ECC counters during service is recommended. Aftermarket channels and quote-based sourcing are the realistic acquisition paths given the part's EOL status.
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Handheld and Portable Instruments
Battery-powered handheld instruments adopted the K9F2808Q0B because its 1.7 V to 1.95 V operation allowed direct connection to single-cell rail systems, minimizing converter stages. Typical read current figures (revised in the datasheet history, originally around 5 mA class) kept average drain low between measurement bursts, while the 50 ns access time let instrument firmware read calibration tables without delaying measurements. The TBGA package withstood portable mechanical stress better than thin plastic leaded packages when properly underfilled. Designers should buffer the R/B output and manage CE during sleep states to minimize standby current in duty-cycled instruments.
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Networking Equipment Configuration Storage
Routers, switches, and access points of the K9F generation stored MAC addresses, configuration files, and failsafe boot images on the K9F2808Q0B. The 16 MB capacity covered a compressed firmware image plus dual-config schemes, and SLC endurance handled frequent configuration writes in the field. The 1.8 V rail matched the low-voltage memory subsystems of networking SoCs of that era, and the TBGA package suited high-density line-card assemblies. Network equipment requires failsafe dual-image designs, so two power-fail-safe update procedures with rollback pointers in spare area were standard practice on this class of raw NAND.
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추천 제품 요약
엔지니어링 참조 데이터: K9F2808Q0B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K9F6408Q0C | K9F6408U0B | K9F2808U0B-DCB0 |
|---|---|---|---|---|
| Package | 63-pin TBGA | 63-TBGA family - same | 63-TBGA family - same | 63-TBGA family - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Density | 128 Mbit (16M x 8) | 64 Mbit (8M x 8) | 64 Mbit (8M x 8) | 128 Mbit (16M x 8) |
| Supply Voltage | 1.7 V to 1.95 V | 1.8 V class (Q-series) | 3.3 V class (U-series) | 3.3 V class (U-series) |
| Cell Type | SLC | SLC | SLC | SLC |
| Lifecycle Status | EOL | EOL (legacy family) | EOL (legacy family) | EOL (legacy family) |
주요 차별점
- Full 128 Mbit capacity on a 1.8 V rail (vs K9F6408Q0C)
- 1.8 V operation vs 3.3 V siblings (vs K9F2808U0B-DCB0)
- SLC reliability with 50 ns read access (vs K9F6408U0B)
설계 노트
The 8-bit multiplexed I/O bus of the K9F2808Q0B relies on clean CLE/ALE/WE/RE timing; keep command and address latch setup/hold within the datasheet AC limits and keep bus traces short (under ~10 cm at this speed class). Termination is generally unnecessary at 1.8 V NAND speeds, but series resistors of 22-33 ohms on WE/RE damp ringing on longer traces. Ensure R/B is treated as open-drain with a pull-up appropriate to the 1.8 V rail - typically 10 kohm.
Never connect the K9F2808Q0B to a 3.3 V rail - it is the 1.8 V (1.7-1.95 V) member of the K9F2808 family, while the U0B suffix denotes the 3.3 V device. Additionally, raw NAND requires controller-side ECC (1-bit per page for SLC) and bad-block management; writing data without ECC and without marking factory bad blocks will cause silent data corruption. Check the initial bad-block table shipped in the device before first use, per Samsung's small-block NAND application guidance.
Decouple VCC with at least 0.1 uF ceramic close to each supply ball plus 4.7-10 uF bulk capacitance, since program operations draw current pulses on the 1.8 V rail. Estimated: if the revised typical read current is in the several-mA class (datasheet history notes Icc1 was changed from 5 mA), a stable 1.8 V LDO rated at 50-100 mA provides ample margin including program/erase peaks; verify peak program current against the latest datasheet revision before finalizing the regulator.
규정 준수 정보
This is a legacy EOL part predating modern environmental declarations; Samsung's current compliance databases no longer list it. Verify RoHS/lead status with the specific date code and package suffix when sourcing aftermarket stock.
