NXP Semiconductors

MRF6S9130HSR3 - 27W 880MHz RF Power MOSFET | NXP Semiconductors

부품 번호: MRF6S9130HSR3 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
68 V Vdss 950 mA Id NI-780S (CASE 465-06, Style 1) ceramic flange Package 880 MHz Speed
시작가 $65 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-15
볼륨 가격
수량 단가 합계
1 $95 $95.00
10 $88.5 $885.00
100 $78 $7,800.00
500 $70.2 $35,100.00
1,000 $65 $65,000.00
ℹ️ 모든 가격은 USD 기준입니다

MRF6S9130HSR3 개요

The NXP Semiconductors MRF6S9130HSR3 is a 27 W average, 28 V lateral N-channel RF power MOSFET designed for single N-CDMA base station amplification at 880 MHz, housed in the NI-780S ceramic package (CASE 465-06, Style 1). The part delivers 19.2 dB typical gain and is characterized for 950 mA quiescent operation from a 28 V DC supply rail, making it suitable for driver and final stages in sub-1 GHz cellular infrastructure.

A radio-frequency power MOSFET (LDMOS) is a lateral double-diffused metal-oxide-semiconductor transistor optimized for high-frequency, high-power operation in the 100 MHz to 30 GHz range. LDMOS devices dominate cellular base-station power amplifier (PA) designs because they combine high RF power density, reasonable gain, and straightforward 28 V or 50 V drain biasing. The MRF6S9130HSR3 sits within the LDMOS -> RF power transistor -> discrete semiconductor -> power management hierarchy.

Key differentiating features include 19.2 dB typical power gain at 880 MHz, 27 W average output power for N-CDMA single-carrier waveforms, and the NI-780S hermetic ceramic flange package that provides a low thermal resistance path from die to heatsink. The HSR3 suffix denotes a tape-and-reel shipping form factor rather than the HR3 bolt-down flange variant. The part was originally released by Freescale Semiconductor and migrated to NXP after the 2015 acquisition; PCN12895 covers MRF6S9160-series migration to the MRFE6S9160 family.

Typical applications include 880 MHz N-CDMA cellular base-station PAs, GSM and GSM EDGE driver/final stages in multicarrier amplifiers, and other sub-1 GHz industrial RF power blocks. The 28 V bias and high gain reduce the number of driver stages required, simplifying PA lineups.

When designing with this part, ensure adequate drain bias decoupling with low-ESR ceramic capacitors placed within 5 mm of the lead, and provide a substantial copper or aluminum heatsink rated for the calculated Pdiss (for 27 W Pout at roughly 50% efficiency, internal dissipation approaches 27 W).

드롭인 대체품: MRF6S9130HSR3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MRF6S9130HSR3 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Manufacturer, Package / Case, Technology, Transistor Type.

NXP Semiconductors
Mounting Type: Chassis/Surface flange mount (screw-down)
Manufacturer: Freescale Semiconductor (now NXP Semiconductors)
Package / Case: NI-780H-2L (CASE 465-06, STYLE 1), ceramic, flanged
비교 대상: MRF6S9130HSR3 →
NXP Semiconductors
Mounting Type: Flange / Chassis Mount with screw holes
Transistor Type: LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
비교 대상: MRF6S9130HSR3 →
NXP Semiconductors
Mounting Type: Chassis / Flange mount (through-hole RF leads)
Manufacturer: NXP Semiconductors
Package / Case: NI-780H-2L (ceramic/metal air-cavity flange-mount)
비교 대상: MRF6S9130HSR3 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MRF6S9130HR3

✅ 드롭인
📦 NI-780S (CASE 465-06, Style 1)
same NI-780S flange, same die, tray-packed (HR3) vs tape-and-reel (HSR3) - electrically identical, only packing differs

📋 참조 대체품 (카탈로그에 없음)

MRF6S9160HR3

✅ 드롭인
NXP Semiconductors
📦 NI-780S (CASE 465-06, Style 1)
RF Power MOSFET (lateral N-channel, enhancement mode) · 880 MHz (single-band cellular UHF) · 28 V (typical operation) · 35 W (N-CDMA, 880 MHz) · 20.9 dB (typical at 880 MHz)

✓ 재고 있음

$510 / 개

데이터시트 보기 →

MRF6S9160HSR3

✅ 드롭인
NXP Semiconductors
📦 NI-780S (CASE 465-06, Style 1)
LDMOS, N-Channel Enhancement-Mode Lateral MOSFET · RF Power Amplifier · 865 MHz to 960 MHz · 880 MHz · 68 V · 28 V · 1.2 A · 35 W Avg.

✓ 재고 있음

$92.4 / 개

데이터시트 보기 →

MRF6S9125NR1

✅ 드롭인
📦 NI-780S (CASE 465-06, Style 1)
same NI-780S flange, Pout ~25 W vs 27 W (-7%), 880 MHz, lower power drop-in for derated designs

📋 참조 대체품 (카탈로그에 없음)

MRFE6S9160HR3

✅ 드롭인
NXP Semiconductors
📦 NI-780S (CASE 465-06, Style 1)
NXP Semiconductors · N-Channel Enhancement-Mode Lateral MOSFET · HV6E lateral MOSFET (LDMOS-like) · 70 V (max) · 865 MHz to 960 MHz · 880 MHz · 28 V (typical)

✓ 재고 있음

$25.2 / 개

데이터시트 보기 →

MRF6S9130HSR3 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors (formerly Freescale)
Part Status Active
트랜지스터 유형 Lateral N-Channel RF Power MOSFET (LDMOS)
Operating Frequency 880 MHz
Drain-Source Voltage (Vdss) Max 68 V
Typical Quiescent Current (Idq) 950 mA
Output Power (Pout) Avg 27 W (N-CDMA single-carrier)
Power Gain (Gps) 19.2 dB typical
Supply Voltage (Vdd) Recommended 28 V
패키지 / 케이스 NI-780S (CASE 465-06, Style 1) ceramic flange
실장 유형 Chassis / flange mount with screw-down
핀 수 3
Style Style 1
Technology LDMOS (laterally diffused MOS)
RoHS 상태 Compliant
Lead-Free Yes
Packing Tape & Reel (HSR3 suffix)
Primary Applications N-CDMA, GSM, GSM EDGE base station PAs, 880-960 MHz multicarrier amplifiers

MRF6S9130HSR3 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 Drain — RF output / drain bias (connected to flange)
핀 2 Gate — RF input / gate bias
핀 3 Source — Source / RF ground (bolted to flange)

안전 동작 영역 (DC)

DC 연속 동작

일반적인 애플리케이션

MRF6S9130HSR3 적합 용도: 6 애플리케이션s: 880 MHz N-CDMA Base Station Final PA, GSM / GSM EDGE Multicarrier Driver Amplifier, Industrial / Scientific 900 MHz RF Power Block, Repeater / Booster PA Stage, Public-Safety 800/900 MHz P25 / TETRA PA, Test & Measurement RF Power Amplifier Module.

🌐

880 MHz N-CDMA Base Station Final PA

The MRF6S9130HSR3 is purpose-built for 880 MHz N-CDMA cellular base-station final power amplifier stages, where its 27 W average Pout and 19.2 dB gain minimize the number of driver stages required in the lineup. The LDMOS transistor operates from a 28 V drain supply, providing an optimum trade-off between RF power density, N-CDMA linearity, and ruggedness under load mismatch. Placed at the output of the PA chain with input/output matching networks tuned for 880 MHz, the device delivers full Pout with appropriate gain compression; unlike GaN devices, it adds no exotic biasing requirements and integrates easily into existing Freescale/NXP reference designs.

📱

GSM / GSM EDGE Multicarrier Driver Amplifier

The MRF6S9130HSR3 functions as a driver or intermediate gain block in 900 MHz GSM EDGE base-station multicarrier amplifiers, where the LDMOS gap linearity is well-suited to the GMSK/8-PSK modulation envelope. With 19.2 dB of typical gain at 880-915 MHz, a single stage can deliver enough drive to a higher-power final LDMOS; the ceramic NI-780S flange keeps junction temperature manageable even in confined MTBF-bound fan-cooled enclosures. Designed-in line with NXP base-station reference designs, the MRF6S9130HSR3 multicarrier capability makes it a workhorse for cost-sensitive 900 MHz GSM infrastructure.

🏭

Industrial / Scientific 900 MHz RF Power Block

Industrial RF applications at 900 MHz - such as ISM-band RF generators, plasma drivers, and scientific particle-accelerator RF amplifiers - benefit from the MRF6S9130HSR3's robust 28 V LDMOS architecture and ceramic NI-780S flange. The 27 W continuous-wave RF power capability, combined with the inherent LDMOS ruggedness under severe load mismatch (high VSWR), makes the device suitable for industrial duty cycles where reliability outweighs the need for ultimate linearity. The flange-mount package bolts directly to a machined heatsink for continuous full-power operation in factory-floor or laboratory equipment.

📡

Repeater / Booster PA Stage

Cellular signal repeaters and bi-directional amplifiers (BDAs) operating in the 880-915 MHz uplink band often use the MRF6S9130HSR3 as a Class-D PA building block. The 19.2 dB gain and 27 W Pout provide the headroom needed to drive a moderate-power final stage or feed a bandpass-filtered output combiner. The 28 V supply rail matches typical repeater rack PSUs, simplifying the LDMOS bias network. NXP's MRF6S9130H.pdf reference design provides tested PCB layouts and component layout that accelerate repeater-BDA development.

🚨

Public-Safety 800/900 MHz P25 / TETRA PA

Land Mobile Radio systems using P25, TETRA, and DMR waveforms at 800/900 MHz can leverage the MRF6S9130HSR3 as a high-power PA stage due to its high linearity, high gain, and 28 V rugged LDMOS design. The 19.2 dB typical gain reduces the number of cascaded gain blocks needed to reach the target transmit power, and the ceramic NI-780S flange provides the thermal headroom required for high-duty-cycle public-safety transmissions. Compared to narrowband bipolar parts, the LDMOS gap offers wider instantaneous bandwidth and improved intermodulation performance for mission-critical comms.

🖥️

Test & Measurement RF Power Amplifier Module

Laboratory RF test amplifiers and ATE (Automated Test Equipment) signal sources use the MRF6S9130HSR3 as a known-good 27 W RF power building block at 880 MHz. The well-characterized S-parameters and load-pull data published by NXP simplify test-fixture design, and the rugged LDMOS withstands the accidental load-mismatch events common in development labs. The ceramic NI-780S flange bolts to a standard test-bench heatsink, making it easy to integrate into modular rack-mount RF amplifier chassis for EMC, wireless-compliance, and radar test applications.

추천 제품 요약

MRF6S9130HR3 Same die, tray-packed variant for hand-loading 사용처: 880 MHz N-CDMA Base Station Final PA, Repeater / Booster PA Stage, Test & Measurement RF Power Amplifier Module MRF6S9160HR3 NXP Semiconductors 사용처: 880 MHz N-CDMA Base Station Final PA, GSM / GSM EDGE Multicarrier Driver Amplifier, Public-Safety 800/900 MHz P25 / TETRA PA MRF6S9125NR1 Lower-power (25 W) drop-in variant 사용처: GSM / GSM EDGE Multicarrier Driver Amplifier MRFE6S9160HR3 NXP Semiconductors 사용처: Industrial / Scientific 900 MHz RF Power Block
What is the MRF6S9130HSR3 and what does it do?
The MRF6S9130HSR3 is a 27 W average, 28 V lateral N-channel RF power MOSFET designed by NXP for 880 MHz single N-CDMA base-station power amplifier stages. According to the NXP datasheet (MRF6S9130H.pdf), it delivers 19.2 dB typical power gain and is housed in the NI-780S ceramic flange package (CASE 465-06, Style 1). It is intended for sub-1 GHz cellular infrastructure and multicarrier amplifier designs.
What is the operating frequency of MRF6S9130HSR3?
The MRF6S9130HSR3 is characterized for operation at 880 MHz, the N-CDMA cellular band. According to the NXP datasheet, it is also suitable for 880-960 MHz multicarrier amplifier applications, covering the upper cellular UHF sub-bands used by GSM and GSM EDGE systems. The LDMOS architecture provides usable gain across this band.
What is the output power rating of MRF6S9130HSR3?
The MRF6S9130HSR3 delivers 27 W average output power under single-carrier N-CDMA modulation with a 28 V drain supply. According to the NXP datasheet, the device is designed for base-station final or driver PA stages in cellular infrastructure, providing high power density from the NI-780S ceramic flange package with its low thermal-resistance mounting interface.
What is the recommended drain supply voltage for MRF6S9130HSR3?
The MRF6S9130HSR3 is designed for operation with a 28 V drain supply rail, with Vdss rated to 68 V maximum. According to the NXP datasheet, the 28 V bias provides the optimum trade-off between RF power density, linearity, and ruggedness for N-CDMA signals. Lower drain voltages will reduce Pout; higher voltages risk exceeding SOA limits.
What package does the MRF6S9130HSR3 use?
The MRF6S9130HSR3 uses the NI-780S ceramic flange package, also designated CASE 465-06, Style 1, with 3 leads (drain, gate, source). According to the NXP datasheet, the ceramic flange provides a low-thermal-resistance path from the LDMOS die to the external heatsink, which is essential at 27 W continuous RF power. The HSR3 suffix indicates tape-and-reel packaging rather than the tray-packed HR3 variant.
What is the difference between MRF6S9130HSR3 and MRF6S9130HR3?
The MRF6S9130HSR3 is the tape-and-reel shipping form factor, while the MRF6S9130HR3 is the tray-packed bulk form factor. According to NXP part numbering conventions, both share the same NI-780S ceramic flange package (CASE 465-06, Style 1), same die, and same 27 W / 880 MHz / 28 V electrical specifications. They are drop-in equivalents - only the packing differs.
What is the drop-in replacement for MRF6S9130HSR3?
The best drop-in replacement for the MRF6S9130HSR3 is the MRF6S9130HR3, which uses the same NI-780S ceramic flange and identical die. According to NXP part-number conventions, HSR3 and HR3 share the exact same electrical specifications, so the HR3 can be hand-loaded onto the same PCB land pattern when tape-and-reel is not required.
Is the MRF6S9130HSR3 still in production?
Yes, the MRF6S9130HSR3 remains an active NXP part. The part was originally released by Freescale Semiconductor and transitioned to NXP after the 2015 acquisition. According to NXP distributor listings (DigiKey / Octopart), it is still orderable, though PCN12895 covers a migration of the MRF6S9160 family to MRFE6S9160 - the MRF6S9130 line is unaffected.
Where can I buy the MRF6S9130HSR3?
The MRF6S9130HSR3 is available from NXP-authorized distributors including DigiKey (NXP USA Inc. / Rochester Electronics LLC stock) and through Octopart-aggregated channels. Pricing as of 2026-10-16 starts around $95 each at qty-1 and scales down to roughly $65 at 1000-piece reels. Lead time is typically 8-12 weeks for direct NXP orders.
What is the price of MRF6S9130HSR3?
The MRF6S9130HSR3 lists at approximately $95 at qty-1, with quantity breaks down to roughly $65 per unit at 1000 pieces as of 2026-10-16. Pricing reflects its position as a high-power RF LDMOS with ceramic flange packaging. For current quotes, consult DigiKey or contact NXP directly, as specialty RF power transistors often carry negotiated volume pricing.
What is the lead time for MRF6S9130HSR3?
Lead time for the MRF6S9130HSR3 is typically 8-12 weeks when ordered directly from NXP, with distributor stock available for smaller quantities. As of 2026-10-16, both NXP USA Inc. and Rochester Electronics LLC list active inventory through DigiKey. For large OEM quantities, contact NXP sales for a scheduled factory order.
How does the MRF6S9130HSR3 compare with the MRF6S9160HSR3?
The MRF6S9130HSR3 is the 27 W / 880 MHz variant, while the MRF6S9160HSR3 is the higher-power 35 W / 960 MHz variant. Both share the NI-780S ceramic package and 28 V bias, but the 9160 line operates at slightly higher frequency with more Pout. The MRF6S9160 family is subject to PCN12895 migration to MRFE6S9160 - the 9130 is not.
Should I choose MRF6S9130HSR3 or MRF6S9160HSR3 for my base-station PA?
Choose the MRF6S9130HSR3 when you need 27 W output power at 880 MHz N-CDMA bands - it is purpose-tuned for that frequency and provides optimal efficiency. Choose the MRF6S9160HSR3 for higher-power (35 W) 960 MHz GSM/EDGE final stages. Both share the NI-780S package, but the matching networks differ due to the frequency shift.
Where can I download the MRF6S9130HSR3 datasheet PDF?
The MRF6S9130HSR3 datasheet (document MRF6S9130H.pdf) is available from NXP at nxp.com/assets/documents/data/en/data-sheets/MRF6S9130H.pdf. The same PDF covers both the HR3 and HSR3 variants. According to third-party aggregator sites, the file is approximately 474 KB and 12 pages, including electrical specifications, test circuits, and mechanical drawings.
Where can I find the pinout of the MRF6S9130HSR3?
The MRF6S9130HSR3 pinout is shown on page 1 of the NXP datasheet (MRF6S9130H.pdf) and on the CASE 465-06, Style 1 mechanical drawing. The 3-lead NI-780S package assigns leads to drain, gate, and source. A package diagram is also reproduced on distributor product pages such as DigiKey under the MRF6S9130HSR3 listing.
What is the thermal resistance of MRF6S9130HSR3?
The thermal resistance junction-to-case (RthJC) of the MRF6S9130HSR3 NI-780S ceramic flange package is approximately 0.65 C/W according to typical NXP LDMOS datasheet curves. This low thermal resistance is critical for dissipating the 27 W class RF power - the ceramic flange provides a direct thermal path to the chassis or heatsink, which must be rated to keep Tj below 200 C.

엔지니어링 참조 데이터: MRF6S9130HSR3 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MRF6S9130HSR3 when you need a 27 W average-output, 880 MHz-tuned LDMOS RF power MOSFET for N-CDMA base-station final PA stages, GSM/EDGE multicarrier driver amplifiers, or sub-1 GHz industrial/public-safety PAs in tape-and-reel packaging. Choose the MRF6S9130HR3 if you are prototyping or building low-volume trays of chassis-mount amplifiers - the HR3 is electrically identical to the HSR3, differing only in shipping form factor. Choose the MRF6S9160HSR3 if your PA design operates at 960 MHz and needs ~35 W Pout, or the MRF6S9125NR1 if a derated 25 W version provides sufficient margin. All alternatives share the same NI-780S ceramic flange (CASE 465-06, Style 1), enabling PCB land-pattern reuse across the 9130/9160 family.

대체품과의 비교

파라미터 이 제품 MRF6S9130HR3 MRF6S9160HR3 MRF6S9160HSR3 MRF6S9125NR1 MRFE6S9160HR3
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package NI-780S (CASE 465-06, Style 1) NI-780S (CASE 465-06, Style 1) - same NI-780S (CASE 465-06, Style 1) - same NI-780S (CASE 465-06, Style 1) - same NI-780S (CASE 465-06, Style 1) - same NI-780S (CASE 465-06, Style 1) - same
Operating Frequency 880 MHz 880 MHz 960 MHz 960 MHz 880 MHz 960 MHz
Output Power (Pout) Avg 27 W 27 W 35 W 35 W 25 W 35 W
Power Gain (Gps) 19.2 dB 19.2 dB 19 dB 19 dB 18.5 dB 19 dB
Drain Supply Voltage 28 V 28 V 28 V 28 V 28 V 28 V
Vdss Max 68 V 68 V 68 V 68 V 68 V 65 V
Packing Tape & Reel (HSR3) Tray (HR3) Tray (HR3) Tape & Reel (HSR3) Tape & Reel (NR1) Tray (HR3)

주요 차별점

  • Factory-tape-and-reel form factor for high-volume SMT-compatible production (vs MRF6S9130HR3)
  • Purpose-tuned 880 MHz N-CDMA frequency response vs higher-frequency 960 MHz variants (vs MRF6S9160HSR3)
  • Higher output power available in the same NI-780S package with the 9160 family (vs MRF6S9160HSR3)

설계 노트

Estimated: at 27 W Pout with 50% drain efficiency, the MRF6S9130HSR3 dissipates approximately 27 W internally. The NI-780S ceramic flange has a typical RthJC of about 0.65 C/W; to keep Tj below 150 C with a 25 C ambient, the heatsink-to-case thermal resistance must remain below 4.6 C/W. Use a machined aluminum heatsink with thermal compound and torque the mounting screws to the datasheet-specified value.

Place drain-bias decoupling capacitors (100 nF and 10 uF minimum) within 5 mm of the drain lead. Use low-ESR ceramic (X7R/X5R) capacitors and minimize loop area for the RF ground return. The source lead is internally connected to the flange - use multiple source-ground vias under the package footprint to minimize common-lead inductance.

Do not exceed Vdss of 68 V - any overvoltage from inductive kickback during load-mismatch events will permanently damage the LDMOS die. Add a TVS diode or transient suppressor across the drain if the application includes antennas that can create high VSWR. Ensure the gate-bias network prevents exceeding the maximum Vgs rating of +/-20 V; any ESD event on the gate will destroy the device.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free per NXP product page. AEC-Q100 not applicable for RF power MOSFET. Conflict-minerals compliant per NXP policy.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MRF6S9130HSR3 MRF6S9130HSR3 datasheet NXP MRF6S9130HSR3 27W 880MHz RF power MOSFET NI-780S LDMOS transistor N-CDMA base station PA amplifier MRF6S9130HSR3 vs MRF6S9130HR3 MRF6S9130HSR3 drop-in replacement MRF6S9130HSR3 buy price what is the output power of MRF6S9130HSR3 MRF6S9130HSR3 pinout NI-780S LDMOS 880MHz base station amplifier

관련 부품 & 용어

NXP Semiconductors Freescale Semiconductor MRF6S9130HSR3 MRF6S9130HR3 MRF6S9160HR3 MRF6S9160HSR3 MRF6S9125NR1 MRFE6S9160HR3 LDMOS lateral N-channel MOSFET RF power transistor NI-780S CASE 465-06 ceramic flange package N-CDMA GSM EDGE base station power amplifier PCN12895 tape and reel VSWR drain efficiency PSRR RoHS
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