W634GU6RB-12 - 4Gb DDR3L SDRAM x16 933MHz | Winbond
Référence : W634GU6RB-12 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.87 | $13,87 |
| 10 | $12.5 | $125,00 |
| 100 | $11.2 | $1 120,00 |
| 500 | $10.1 | $5 050,00 |
| 1 000 | $9.5 | $9 500,00 |
W634GU6RB-12 Présentation
DDR3L SDRAM is a type of double data rate synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DDR3 memory family, which uses 8n-prefetch architecture and on-die termination to achieve high data rates. DDR3L is widely used in mobile, embedded, and industrial systems where power efficiency is critical.
Key features include a 4Gbit density, x16 organization, 933 MHz clock speed (DDR3L-1600), 20 ns tRCD, and a 96-ball VFBGA package. The device supports industrial temperature grades: the -12I grade guarantees -40°C to 95°C case temperature, and the -12J grade guarantees -40°C to 105°C. It is RoHS compliant and halogen-free, meeting environmental standards.
The W634GU6RB-12 utilizes advanced DRAM process technology, offering high-speed data transfer with low power consumption. The 8n-prefetch architecture enables burst lengths of 8, and the on-die termination (ODT) improves signal integrity. The device includes programmable CAS latency, burst length, and output drive strength, providing flexibility for system optimization.
Typical applications include networking equipment, industrial automation, embedded computing, and consumer electronics such as set-top boxes and smart TVs. The low voltage and high density make it ideal for space-constrained designs requiring large memory capacity.
When designing with this device, ensure proper decoupling capacitors near the VDD and VDDQ pins, and follow the PCB layout guidelines in the datasheet to minimize signal integrity issues. The device requires a 1.35V supply and a separate VDDQ supply, which should be well-regulated.
Alternatives de remplacement direct pour W634GU6RB-12 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec W634GU6RB-12 (même facteur de forme et même empreinte) — différant par Package, Data Rate, Operating Temperature, Supply Voltage, Organization.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
W634GU6RB-11TR
✅ Remplacement direct✓ En stock
$32 / unité
Voir la fiche technique →W634GU6RB-09
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.69 / unité
Voir la fiche technique →W634GU6RB-12I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
W634GU6RB-12J
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MT41K256M16HA-125
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.3636 / unité
Voir la fiche technique →K4B4G1646E-BYMA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.3182 / unité
Voir la fiche technique →W634GU6RB-12 Valeurs maximales et caractéristiques électriques
| Type de mémoire | SDRAM - DDR3L |
| Taille de mémoire | 4Gbit |
| Organisation de la mémoire | 256M x 16 |
| Interface | Parallel |
| Clock Frequency | 933 MHz |
| Access Time | 20 ns |
| Tension d'alimentation | 1.35V |
| Boîtier | 96-VFBGA (7.5x13) |
| Speed Grade | DDR3L-1600 (11-11-11) |
| Température de fonctionnement | -40°C to +95°C (12I), -40°C to +105°C (12J) |
| RoHS | Compliant |
| Sans halogène | Yes |
| Type de montage | Surface Mount |
| Nombre de broches | 96 |
| Débit de données | 1600 MT/s |
Configuration des broches de W634GU6RB-12
| Broche A1 | VDD — Power supply (1.35V) |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output 2 |
| Broche A6 | DQ3 — Data input/output 3 |
| Broche A7 | VDDQ — I/O power supply |
| Broche A8 | DQ4 — Data input/output 4 |
| Broche A9 | DQ5 — Data input/output 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output 6 |
| Broche A12 | DQ7 — Data input/output 7 |
Applications typiques
W634GU6RB-12 convient pour 6 applications: Networking Equipment, Industrial Automation, Embedded Computing, Consumer Electronics, Automotive Infotainment, Medical Devices.
Networking Equipment
The W634GU6RB-12 provides high-bandwidth, low-power memory for routers, switches, and network appliances. Its 4Gbit density and 933 MHz clock support high-throughput packet processing, while the 1.35V supply reduces power consumption in always-on network infrastructure. The industrial temperature grades (-12I/-12J) ensure reliable operation in uncontrolled environments. The x16 organization simplifies board layout and reduces component count, making it ideal for compact line cards and edge routers.
Recommandé
Industrial Automation
In industrial automation, the W634GU6RB-12 offers reliable memory for PLCs, robotics controllers, and HMI systems. Its wide temperature range (-40°C to 105°C for -12J) ensures operation in factory floors without climate control. The low 1.35V supply reduces heat generation, critical in sealed enclosures. The 4Gbit capacity supports complex control algorithms and data logging. The 96-ball VFBGA package withstands vibration and thermal cycling, making it suitable for harsh industrial environments.
Recommandé
Embedded Computing
The W634GU6RB-12 is ideal for embedded computing modules, single-board computers, and IoT gateways. Its 4Gbit density provides ample memory for Linux-based applications, while the 1.35V supply extends battery life in portable devices. The 933 MHz clock enables fast data processing for real-time analytics. The compact VFBGA package fits space-constrained designs. The industrial temperature grades support outdoor deployments, and the RoHS compliance meets environmental standards for global markets.
Recommandé
Consumer Electronics
For consumer electronics like set-top boxes, smart TVs, and gaming consoles, the W634GU6RB-12 delivers high-speed memory at low power. The 4Gbit capacity supports HD video streaming and multitasking. The 1.35V supply reduces energy consumption, meeting energy-efficiency standards. The x16 interface simplifies PCB design, reducing BOM cost. The 96-ball VFBGA package is compact enough for slim devices. The -12 speed grade ensures smooth performance for multimedia applications.
Recommandé
Automotive Infotainment
The W634GU6RB-12 supports automotive infotainment systems, providing reliable memory for navigation, audio, and display applications. Its industrial temperature grades (-12I/-12J) ensure operation in vehicle environments. The low 1.35V supply reduces heat and power draw, critical for battery-powered vehicles. The 4Gbit capacity handles map data and multimedia content. The VFBGA package is resistant to vibration, making it suitable for in-vehicle electronics. Note: AEC-Q100 qualification should be verified for strict automotive requirements.
Recommandé
Medical Devices
In medical devices, the W634GU6RB-12 provides high-reliability memory for patient monitors, imaging systems, and diagnostic equipment. Its wide temperature range and RoHS compliance meet medical standards. The 4Gbit capacity supports large data sets for imaging and patient records. The low 1.35V supply reduces heat, important for portable devices. The industrial temperature grades ensure reliable operation in clinical environments. The compact package fits space-constrained medical instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour W634GU6RB-12 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | W634GU6RB-11 | W634GU6RB-09 | MT41K256M16HA-125 | K4B4G1646E-BYMA |
|---|---|---|---|---|---|
| Package | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-VFBGA (7.5x13) | 96-FBGA (7.5x13) | 96-FBGA (7.5x13) |
| Brand | Winbond Electronics | Winbond Electronics | Winbond Electronics | Micron Technology | Samsung Electronics |
| Memory Size | 4Gbit | 4Gbit | 4Gbit | 4Gbit | 4Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Clock Frequency | 933 MHz | 933 MHz | 1066 MHz | 933 MHz | 933 MHz |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V | 1.35V |
| Operating Temperature | -40°C to +95°C (12I), -40°C to +105°C (12J) | -40°C to +95°C (11I), -40°C to +105°C (11J) | -40°C to +95°C (09I), -40°C to +105°C (09J) | 0°C to +95°C (commercial) | 0°C to +95°C (commercial) |
| Speed Grade | DDR3L-1600 (11-11-11) | DDR3L-1333 (9-9-9) | DDR3L-1866 (13-13-13) | DDR3L-1600 (11-11-11) | DDR3L-1600 (11-11-11) |
Principaux différenciateurs
- Industrial temperature grades available (vs MT41K256M16HA-125)
- Higher speed grade option (vs W634GU6RB-11)
- Cross-brand compatibility (vs K4B4G1646E-BYMA)
Notes de conception
The W634GU6RB-12 requires a 1.35V VDD supply and a separate VDDQ supply. Use low-impedance decoupling capacitors (e.g., 0.1uF and 1uF) close to each VDD and VDDQ pin to minimize voltage ripple. Ensure the power supply can handle peak current during refresh and burst operations.
Follow the PCB layout guidelines in the Winbond datasheet. Route DQ, DQS, and address lines with matched lengths to maintain signal integrity. Use ground planes under the VFBGA package to reduce noise. Place termination resistors for ODT as recommended.
The industrial temperature grades (-12I/-12J) allow operation up to 105°C case temperature. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The VFBGA package has a thermal resistance that should be considered in thermal design.
Informations de conformité
RoHS compliant and halogen-free per Winbond datasheet. AEC-Q100 not specified in provided data.
