10M25DAF484A7P vs 10M25DAF484C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484A7P disebabkan oleh Intel dan 10M25DAF484C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484A7P | 10M25DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | 55 nm CMOS |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Kemasan | 484-ball Plastic BGA (S-PBGA-B484) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | — |
| Speed Grade | A7 | -8 |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | Yes (up to 4 analog PLLs per device) |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Tegangan Pemberi Arus | 3.3 V or 1.8 V single supply | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Suhu Operasi | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Aras MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |