10M25DAF484A7P vs 10M25DAF484C8G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 10M25DAF484A7P sa pamamagitan ng Intel at 10M25DAF484C8G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | 10M25DAF484A7P | 10M25DAF484C8G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | MAX 10 | — |
| Logic Elements | 25,000 | 25,000 |
| Configurable Logic Blocks (CLBs) | 1,563 | — |
| Process Technology | 55 nm non-volatile | 55 nm CMOS |
| Embedded Memory | 1,728 Kbits | — |
| Maximum User I/O | 360 | — |
| Packhaging | 484-ball Plastic BGA (S-PBGA-B484) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Temperature Grade | Automotive (-40 C to +125 C TJ) | — |
| Speed Grade | A7 | -8 |
| Configuration | Internal dual-boot flash (no external PROM) | — |
| On-chip ADC | 1 x 12-bit, 1 MSPS | — |
| PLLs | 2 (general-purpose) | Yes (up to 4 analog PLLs per device) |
| DSP Blocks | Up to 25 (18x18 MAC) | — |
| Volte ng Pagbibigay | 3.3 V or 1.8 V single supply | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Temperature na Operasyon | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Level ng MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |