5CSEBA4U19C7N vs 5CSEBA4U19A7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CSEBA4U19C7N disebabkan oleh Intel dan 5CSEBA4U19A7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
5CSEBA4U19C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U19C7N ✓ AktifPengandingan Spesifikasi
| Parametr | 5CSEBA4U19C7N | 5CSEBA4U19A7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone V SE SoC FPGA | — |
| Family | 5CSEBA4 (U19 device) | Cyclone V SE SoC FPGA |
| Logic Elements | 40 K | 40 K |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Max Frequency | 800 MHz | — |
| DSP Blocks | Variable-precision DSP (number not specified in data) | — |
| Embedded Memory | [DATA_NEEDED: total Kbits of embedded RAM] | 3.4 Mbits (M9K) |
| Embedded Multipliers | 56 (18x18) | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Hard Memory Controllers | 2 | — |
| Hard USB 2.0 OTG | Yes | — |
| Hard PCIe Gen2 | Yes (rootport/endpoint configurable) | — |
| Core Voltage | 1.1 V | 1.1 V (typical) |
| Process Technology | 28 nm low-power | — |
| Suhu Operasi | 0 C to +85 C (commercial) | — |
| Kemasan | 484-pin UBG A (UBGA), 19x19 mm | 484-UBGA (U19), 19x19 mm, 1.0 mm pitch |
| AES Encryption | Supported | — |
| SEU Error Detection/Correction | Supported | — |
| Configuration Interface | JTAG | — |
| Status RoHS | Compliant | Compliant |
| Hard Processor System | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Adaptive Logic Modules | — | [DATA_NEEDED: ALM count] |
| DSP Blocks (18x18 Multipliers) | — | 224 |
| HPS Maximum Application Clock | — | 925 MHz |
| Memory Interfaces | — | DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA |
| User I/O | — | 161 |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Suhu Hubungan Operasi | — | -40C to +125C (automotive) / -40C to +100C (industrial) |
| Process Node | — | TSMC 28 nm low-power |
| Aras MSL | — | 3 (168 hours) |