5CSEBA4U19C7N vs 5CSEBA4U19A7N 比較

詳細並排比較 5CSEBA4U19C7N 由 Intel 與 5CSEBA4U19A7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CSEBA4U19C7N 5CSEBA4U19A7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series Cyclone V SE SoC FPGA —
Family 5CSEBA4 (U19 device) Cyclone V SE SoC FPGA
Logic Elements 40 K 40 K
HPS Cores Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Max Frequency 800 MHz —
DSP Blocks Variable-precision DSP (number not specified in data) —
Embedded Memory [DATA_NEEDED: total Kbits of embedded RAM] 3.4 Mbits (M9K)
Embedded Multipliers 56 (18x18) —
PLLs 4 [DATA_NEEDED: PLL count]
Hard Memory Controllers 2 —
Hard USB 2.0 OTG Yes —
Hard PCIe Gen2 Yes (rootport/endpoint configurable) —
Core Voltage 1.1 V 1.1 V (typical)
Process Technology 28 nm low-power —
工作溫度 0 C to +85 C (commercial) —
封裝 484-pin UBG A (UBGA), 19x19 mm 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
AES Encryption Supported —
SEU Error Detection/Correction Supported —
Configuration Interface JTAG —
RoHS 狀態 Compliant Compliant
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
DSP Blocks (18x18 Multipliers) — 224
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
安裝類型 — Surface Mount (BGA)
工作接面溫度 — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
MSL 等級 — 3 (168 hours)

資料表與資源

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