EDB1332BDBH-1DAUT-F-R vs EDB1332BDBH-1DAUT-F-D Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EDB1332BDBH-1DAUT-F-R disebabkan oleh Micron Technology dan EDB1332BDBH-1DAUT-F-D disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
EDB1332BDBH-1DAUT-F-R - 1Gbit LPDDR2 SDRAM 533MHz | Micron
EDB1332BDBH-1DAUT-F-R ✓ AktifMicron Technology
EDB1332BDBH-1DAUT-F-D - 1Gbit LPDDR2 533MHz | Micron
EDB1332BDBH-1DAUT-F-D ✓ AktifPengandingan Spesifikasi
| Parametr | EDB1332BDBH-1DAUT-F-R | EDB1332BDBH-1DAUT-F-D |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | — | $2.16 |
| Jenis Ingatan | SDRAM Mobile - LPDDR2 | SDRAM - Mobile LPDDR2 |
| Saiz Ingatan | 1 Gbit | 1 Gbit |
| Organisasi | 32M x 32 | 32M x 32 |
| Lebar Bus Data | 32 bit | — |
| Clock Frequency | 533 MHz | 533 MHz |
| Antaramuka | Parallel | Parallel |
| Supply Voltage - Min | 1.14 V | — |
| Supply Voltage - Typ | 1.2 V | — |
| Operating Temperature - Min | -40 C | — |
| Operating Temperature - Max | +125 C | — |
| Kemasan | 134-VFBGA (10 mm x 11.5 mm) | 134-VFBGA (10 x 11.5 mm) |
| JEDEC Package Code | R-PBGA-B134 | — |
| Gaya Pemasangan | SMD/SMT | — |
| Factory Pack Quantity | 1000 | — |
| Packaging | Tape & Reel (-R suffix) | — |
| Technology | CMOS | — |
| Status RoHS | Compliant | — |
| Core Supply Voltage | — | 1.2 V |
| Supply Voltage Range | — | 1.14 V to 1.95 V |
| Access Mode | — | Single Bank Page Burst |
| Number of Terminals | — | 134 |
| Jenis Pemasangan | — | Surface Mount |
| Temperature Grade | — | Automotive |
| Package Shape | — | Rectangular |
| Packaging Suffix | — | -D (Dry Pack) |
| Moisture Sensitivity | — | Dry Pack (per -D suffix) |
| Suhu Operasi | — | [DATA_NEEDED: Operating Temperature] |