EP2SGX130GF40C3N vs EP2SGX130GF40C4NES Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX130GF40C3N disebabkan oleh Intel dan EP2SGX130GF40C4NES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX130GF40C4NES EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel

EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel

EP2SGX130GF40C4NES ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX130GF40C3N EP2SGX130GF40C4NES
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete Masa Terakhir Dibeli
Family Stratix II GX Stratix II GX
Logic Elements 132,540 132,540
Embedded Memory 6.7 Mbits Approximately 4.5 Mbits (TriMatrix)
Embedded Multipliers (18x18) 252 —
User I/O Count 734 —
Transceiver Count 40 channels —
Max Transceiver Data Rate 6.375 Gbps —
Process Technology 90 nm 90 nm CMOS
Core Voltage 1.2 V 1.2 V
Kemasan 1508-ball FC-FBGA —
Jenis Pemasangan Surface Mount (flip-chip BGA) Surface Mount (flip-chip BGA)
Suhu Operasi 0C to +85C (commercial) Commercial Extended (per N suffix)
Speed Grade C3 C4 (speed grade -4)
Configuration Mode Passive Serial / Fast Passive Parallel / JTAG —
Status RoHS Compliant —
Logic Blocks / ALMs — Approximately 53,000 ALMs
Maximum Transceiver Data Rate — 6.375 Gbps
Transceiver Channels — Up to 20 (4 to 20, device-dependent)
User I/O Pins — 734
Total Package Pins — 1508 (FC-FBGA ball grid)
Package Code — GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch)
Internal Operating Frequency — Up to 717 MHz
PLL Blocks — 8
DSP Blocks — Yes (variable, see datasheet)
Lead-Free / RoHS — Yes (LEAD FREE per datasheet family code)
Aras MSL — Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level]
JEDEC Standard Reference — MS-034AAU-1

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