EP2SGX130GF40C4NGB vs EP2SGX130GF40C4NES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX130GF40C4NGB disebabkan oleh Intel dan EP2SGX130GF40C4NES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2SGX130GF40C4NGB - Stratix II GX FPGA, 132K LEs, 6.6K LABs | Intel
EP2SGX130GF40C4NGB ObsoleteIntel
EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
EP2SGX130GF40C4NES ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2SGX130GF40C4NGB | EP2SGX130GF40C4NES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Series | Stratix II GX | — |
| Family | Enhanced Configuration (EPC) Devices | Stratix II GX |
| Logic Elements | 132,540 | 132,540 |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/O Pins | 734 | 734 |
| Kemasan | 1508-ball FBGA (GF40) | — |
| Terminal Pitch | 1.00 mm | — |
| Speed Grade | C4 | C4 (speed grade -4) |
| Temperature Grade | Commercial (0C to 85C) | — |
| Transceivers | Up to 20 multi-gigabit transceivers | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| PLLs | 8 | — |
| On-chip Memory | TriMatrix memory (block RAM + distributed RAM) | — |
| DSP Blocks | Yes (embedded multipliers) | Yes (variable, see datasheet) |
| Configuration | Enhanced / EPC mode | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Blocks / ALMs | — | Approximately 53,000 ALMs |
| Process Technology | — | 90 nm CMOS |
| Core Voltage | — | 1.2 V |
| Maximum Transceiver Data Rate | — | 6.375 Gbps |
| Transceiver Channels | — | Up to 20 (4 to 20, device-dependent) |
| Total Package Pins | — | 1508 (FC-FBGA ball grid) |
| Package Code | — | GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) |
| Internal Operating Frequency | — | Up to 717 MHz |
| Embedded Memory | — | Approximately 4.5 Mbits (TriMatrix) |
| PLL Blocks | — | 8 |
| Jenis Pemasangan | — | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | — | Yes (LEAD FREE per datasheet family code) |
| Aras MSL | — | Per JEDEC J-STD-020, typically MSL-4 or higher [DATA_NEEDED: exact MSL level] |
| Suhu Operasi | — | Commercial Extended (per N suffix) |
| JEDEC Standard Reference | — | MS-034AAU-1 |