EP2SGX60DF780C3N vs EP2SGX60DF780C5 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX60DF780C3N disebabkan oleh Intel dan EP2SGX60DF780C5 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ Akhir Hayat
Intel
EP2SGX60DF780C5 EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP2SGX60DF780C3N EP2SGX60DF780C5
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Akhir Hidup Masa Terakhir Dibeli
Family Stratix II GX Stratix II GX
Device Type FPGA Field-Programmable Gate Array (FPGA)
Logic Elements 60,440 60,440
LABs/CLBs 3,022 —
Total Memory Bits 2,544,192 —
User I/Os 364 —
Package Type 780-pin FC-FBGA (DF780) —
Package Dimensions 23 x 23 mm —
Pitch 1 mm —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm
Internal Frequency 717 MHz —
Propagation Delay [DATA_NEEDED: propagation delay ns] —
Suhu Operasi [DATA_NEEDED: operating temperature range C] Commercial (0C to +85C)
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Status RoHS Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Logic Array Blocks (LABs) — 3,022
User I/O Pins — 364
Kemasan — 780-ball FC-FBGA
Package Body Size — 23 x 23 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.2 V
Internal Frequency (max, typical) — ~717 MHz
Speed Grade — -C5 (commercial, mid-band)
Lead-Free — [DATA_NEEDED: lead-free status]

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