EP2SGX60DF780C3N vs EP2SGX60DF780C5 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60DF780C3N sa pamamagitan ng Intel at EP2SGX60DF780C5 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP2SGX60DF780C3N EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel

EP2SGX60DF780C3N ✗ Tapus ng Buhay
Intel
EP2SGX60DF780C5 EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel

EP2SGX60DF780C5 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP2SGX60DF780C3N EP2SGX60DF780C5
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Tapus ng Buhay Huling Pagbili
Family Stratix II GX Stratix II GX
Device Type FPGA Field-Programmable Gate Array (FPGA)
Logic Elements 60,440 60,440
LABs/CLBs 3,022 —
Total Memory Bits 2,544,192 —
User I/Os 364 —
Package Type 780-pin FC-FBGA (DF780) —
Package Dimensions 23 x 23 mm —
Pitch 1 mm —
Core Voltage 1.2 V —
Process Technology 90 nm 90 nm
Internal Frequency 717 MHz —
Propagation Delay [DATA_NEEDED: propagation delay ns] —
Temperature na Operasyon [DATA_NEEDED: operating temperature range C] Commercial (0C to +85C)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Tindminan RoHS Compliant (per distributor listing) [DATA_NEEDED: RoHS status]
Logic Array Blocks (LABs) — 3,022
User I/O Pins — 364
Packhaging — 780-ball FC-FBGA
Package Body Size — 23 x 23 mm
Ball Pitch — 1.0 mm
Core Supply Voltage — 1.2 V
Internal Frequency (max, typical) — ~717 MHz
Speed Grade — -C5 (commercial, mid-band)
Lead-Free — [DATA_NEEDED: lead-free status]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita