EP3SE260F1152I3N vs EP3SE260F1152C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1152I3N disebabkan oleh Intel dan EP3SE260F1152C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel
EP3SE260F1152I3N ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ AktifPengandingan Spesifikasi
| Parametr | EP3SE260F1152I3N | EP3SE260F1152C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Aktif |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 1.1 V |
| Suhu Operasi | -40C to +100C (industrial) | 0 C to +85 C (Commercial) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Kemasan / Case | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| Kemasan | — | 1152-BBGA, FCBGA |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |