EP3SE260F1152I3N vs EP3SE260F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3N sa pamamagitan ng Intel at EP3SE260F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152I3N EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N - 255K Logic Elements Stratix III E FPGA | Intel

EP3SE260F1152I3N ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152I3N EP3SE260F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Series Stratix III E Stratix III E
Family Name Stratix III E —
Logic Elements / Cells 255000 255,000
Logic Array Blocks (LABs) 10200 10,200
Total RAM Bits 16672768 —
Number of I/Os 744 —
Number of Gates [DATA_NEEDED: number of gates] —
Core Voltage 0.9 V to 1.1 V selectable 1.1 V
Temperature na Operasyon -40C to +100C (industrial) 0 C to +85 C (Commercial)
Uri ng Pagpapasok Surface Mount Surface Mount
Packhaging / Kaso 1152-BBGA, FCBGA (FC-FBGA) —
Process Technology 65 nm CMOS 65 nm
Max Internal Frequency 500 MHz —
Supplier Temperature Grade Industrial —
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant
Level ng MSL [DATA_NEEDED: MSL level] —
Embedded Memory Bits — 16,672,768 bits
User I/O Count — 744
Packhaging — 1152-BBGA, FCBGA
Transceivers — Integrated high-speed transceivers
DSP Blocks — Yes (dedicated multiplier/accumulator)
Embedded Memory Type — TriMatrix (true dual-port, FIFO, ROM, RAM)
External Memory Support — DDR3, DDR2, QDR II+, RLDRAM II
Configuration Modes — AS, AP, PS, FPP, JTAG
Partial Reconfiguration — Supported
Programmable Power Technology — Yes (up to 50% dynamic power reduction)

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