EP3SE260F1152I3N vs EP3SE260F1152C3N 比較
詳細並排比較 EP3SE260F1152I3N 由 Intel 與 EP3SE260F1152C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP3SE260F1152C3N - Stratix III E FPGA, 255K LE, 744 I/O, 1152-FBGA | Intel
EP3SE260F1152C3N ✓ 啟用中規格比較
| 參數 | EP3SE260F1152I3N | EP3SE260F1152C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Series | Stratix III E | Stratix III E |
| Family Name | Stratix III E | — |
| Logic Elements / Cells | 255000 | 255,000 |
| Logic Array Blocks (LABs) | 10200 | 10,200 |
| Total RAM Bits | 16672768 | — |
| Number of I/Os | 744 | — |
| Number of Gates | [DATA_NEEDED: number of gates] | — |
| Core Voltage | 0.9 V to 1.1 V selectable | 1.1 V |
| 工作溫度 | -40C to +100C (industrial) | 0 C to +85 C (Commercial) |
| 安裝類型 | Surface Mount | Surface Mount |
| 封裝 / 外殼 | 1152-BBGA, FCBGA (FC-FBGA) | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Max Internal Frequency | 500 MHz | — |
| Supplier Temperature Grade | Industrial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等級 | [DATA_NEEDED: MSL level] | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 744 |
| 封裝 | — | 1152-BBGA, FCBGA |
| Transceivers | — | Integrated high-speed transceivers |
| DSP Blocks | — | Yes (dedicated multiplier/accumulator) |
| Embedded Memory Type | — | TriMatrix (true dual-port, FIFO, ROM, RAM) |
| External Memory Support | — | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration Modes | — | AS, AP, PS, FPP, JTAG |
| Partial Reconfiguration | — | Supported |
| Programmable Power Technology | — | Yes (up to 50% dynamic power reduction) |