EP3SE260F1517I4N vs EP3SE260F1517C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I4N disebabkan oleh Intel dan EP3SE260F1517C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517I4N - Stratix III E FPGA, 255K LE, 1517-BGA | Intel
EP3SE260F1517I4N ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel
EP3SE260F1517C3N ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517I4N | EP3SE260F1517C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power CMOS |
| Kemasan | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| Suhu Operasi | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| Aras MSL | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| Suhu Hubungan Operasi | — | 0 C to +85 C (commercial) |
| Status RoHS | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |