EP3SE260F1517I4N vs EP3SE260F1517C3N 比較
詳細並排比較 EP3SE260F1517I4N 由 Intel 與 EP3SE260F1517C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260F1517I4N | EP3SE260F1517C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 254,400 |
| Embedded Memory Bits | 16,672,768 bits | — |
| Embedded Memory (M9K/M144K blocks) | [DATA_NEEDED: total Kbits and block count] | — |
| User I/O Pins | 976 | — |
| Transceivers | [DATA_NEEDED: number of full-duplex channels] | — |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps | — |
| DSP Blocks | [DATA_NEEDED: number of 18x18 multipliers] | — |
| PLLs | [DATA_NEEDED: total PLL count] | 4 |
| Core Voltage | 1.1 V | — |
| Process Technology | TSMC 65 nm | 65 nm TSMC low-power CMOS |
| 封裝 | 1517-BBGA, FCBGA | 1517-BBGA (FCBGA) |
| Package Body Size | [DATA_NEEDED: mm x mm] | — |
| 工作溫度 | -40 °C to +100 °C (Industrial) | — |
| Operating Temperature Grade | Industrial (I4) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Lead-Free / RoHS | [DATA_NEEDED: explicit RoHS statement] | — |
| MSL 等級 | [DATA_NEEDED: MSL classification] | — |
| Family | — | Stratix III E |
| Embedded Memory | — | 16,672,768 bits (16.7 Mbits) |
| User I/Os | — | 976 |
| DSP Blocks (18x18 Multipliers) | — | 816 |
| M9K Memory Blocks | — | 1,040 |
| Maximum Transceiver Data Rate | — | 600 Mbps |
| Global Clock Networks | — | 16 |
| Speed Grade | — | C3 (commercial) |
| 工作接面溫度 | — | 0 C to +85 C (commercial) |
| RoHS 狀態 | — | Compliant |
| External Memory Interfaces | — | DDR3, DDR2, QDRII+, RLDRAM2 |