EP4CE75F29C6 vs EP3SL50F780C2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE75F29C6 disebabkan oleh Intel dan EP3SL50F780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE75F29C6 | EP3SL50F780C2 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Stratix III L |
| Logic Elements | 75,408 | — |
| Total Registers | 7,950 | — |
| Embedded Memory (bits) | 2,810,880 | 2,184,192 |
| Embedded Multipliers (18x18) | 274 | — |
| Maximum User I/O Pins | 426 | — |
| PLLs | 4 | — |
| Global Clock Networks | 15 | — |
| Core Voltage | 1.2 V | 1.1 V |
| Process Technology | 60 nm low power | 65 nm |
| Kemasan | 780-ball FineLine BGA (F29, 29x29 mm) | 780-ball FCBGA (Flip-Chip BGA) |
| Suhu Operasi | 0C to +85C (Commercial) | 0°C to +85°C (commercial) |
| Configuration Modes | AS / PS / JTAG / FPP | — |
| Memory Controller | DDR / DDR2 / QDRII SRAM | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/Os | — | 488 |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |
| Jenis Pemasangan | — | Surface Mount (BGA) |