EP4CE75F29C6 vs EP3SL50F780C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE75F29C6 sa pamamagitan ng Intel at EP3SL50F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE75F29C6 | EP3SL50F780C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | Stratix III L |
| Logic Elements | 75,408 | — |
| Total Registers | 7,950 | — |
| Embedded Memory (bits) | 2,810,880 | 2,184,192 |
| Embedded Multipliers (18x18) | 274 | — |
| Maximum User I/O Pins | 426 | — |
| PLLs | 4 | — |
| Global Clock Networks | 15 | — |
| Core Voltage | 1.2 V | 1.1 V |
| Process Technology | 60 nm low power | 65 nm |
| Packhaging | 780-ball FineLine BGA (F29, 29x29 mm) | 780-ball FCBGA (Flip-Chip BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0°C to +85°C (commercial) |
| Configuration Modes | AS / PS / JTAG / FPP | — |
| Memory Controller | DDR / DDR2 / QDRII SRAM | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Maximum User I/Os | — | 488 |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |