H5AN4G8NBJR-UHC vs H5AN4G8NBJR-RDC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci H5AN4G8NBJR-UHC disebabkan oleh SK hynix dan H5AN4G8NBJR-RDC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | H5AN4G8NBJR-UHC | H5AN4G8NBJR-RDC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gbit |
| Organisasi | 512M x 8 | 512M x 8 |
| Kadar Data | 2400 Mbps (PC2400) | [DATA_NEEDED: speed grade Mbps] |
| Tegangan Pemberi Arus | 1.2 V | [DATA_NEEDED: VDD supply voltage] |
| Antaramuka | DDR4 (JEDEC) | DDR4 (Double Data Rate IV) |
| Kemasan | TFBGA-78 (11 x 7.5 mm) | 78-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Technology | CMOS DRAM | — |
| Lifecycle Code | Active | — |
| Status RoHS | Compliant (Rohs Code: Yes) | Lead-Free & Halogen-Free (RoHS Compliant) |
| REACH Compliance | Compliant | — |
| Manufacturer | SK Hynix Inc. | SK hynix |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency for -UHC speed bin] | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x/4x support] | Auto-refresh and self-refresh |
| Bank Architecture | — | 8 banks with 4 bank groups (x8) |
| Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| Termination | — | On-Die Termination (ODT) |
| Process Technology | — | CMOS |
| Family Series | — | H5AN4G4/8/6NBJR |