H5AN4G8NBJR-UHC vs H5AN4G8NBJR-RDC 比較

詳細並排比較 H5AN4G8NBJR-UHC 由 SK hynix 與 H5AN4G8NBJR-RDC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN4G8NBJR-UHC H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC ✓ 啟用中
SK hynix
H5AN4G8NBJR-RDC H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC - 4Gb DDR4 SDRAM x8 | SK hynix | Main Memory

H5AN4G8NBJR-RDC ✓ 啟用中

規格比較

參數 H5AN4G8NBJR-UHC H5AN4G8NBJR-RDC
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit 4 Gbit
組織 512M x 8 512M x 8
資料速率 2400 Mbps (PC2400) [DATA_NEEDED: speed grade Mbps]
供應電壓 1.2 V [DATA_NEEDED: VDD supply voltage]
介面 DDR4 (JEDEC) DDR4 (Double Data Rate IV)
封裝 TFBGA-78 (11 x 7.5 mm) 78-ball FBGA
安裝類型 Surface Mount Surface Mount
Technology CMOS DRAM —
Lifecycle Code Active —
RoHS 狀態 Compliant (Rohs Code: Yes) Lead-Free & Halogen-Free (RoHS Compliant)
REACH Compliance Compliant —
Manufacturer SK Hynix Inc. SK hynix
工作溫度 [DATA_NEEDED: operating temperature range] —
CAS 延遲 [DATA_NEEDED: CAS latency for -UHC speed bin] —
Refresh [DATA_NEEDED: refresh rate 1x/2x/4x support] Auto-refresh and self-refresh
Bank Architecture — 8 banks with 4 bank groups (x8)
Temperature Grade — [DATA_NEEDED: operating temperature range]
Termination — On-Die Termination (ODT)
Process Technology — CMOS
Family Series — H5AN4G4/8/6NBJR

資料表與資源

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