H5TC4G63AFR-PBJ vs H5TC4G63AFR-PBI Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci H5TC4G63AFR-PBJ disebabkan oleh SK hynix dan H5TC4G63AFR-PBI disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | H5TC4G63AFR-PBJ | H5TC4G63AFR-PBI |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Jenis Ingatan | DDR3L SDRAM | DDR3L SDRAM |
| Saiz Ingatan | 4 Gb (256M x 16) | — |
| Tegangan Pemberi Arus | 1.35 V | 1.35 V |
| Kemasan | 96-ball TFBGA | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| Temperature Grade | Industrial (-40°C to +95°C) | — |
| Refresh Cycles | 8192 | — |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | 96 |
| Kadar Data | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] | DDR3-1600 (PC3L-12800) |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | Programmable |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) | — |
| Auto Self-Refresh | Yes | — |
| Data Mask | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | Compliant |
| Organisasi | — | 256M x 16 |
| Total Memory Size | — | 4 Gb |
| Number of Banks | — | 8 |
| Burst Length | — | 8 (BL8) |
| On-Die Termination (ODT) | — | Yes |
| Refresh Period | — | 7.8 us at 85°C |
| Gambaran Suhu Operasi | — | -40°C to +95°C |
| Jenis Pemasangan | — | Surface Mount |