H5TC4G63AFR-PBJ vs H5TC4G63AFR-PBI Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng H5TC4G63AFR-PBJ sa pamamagitan ng SK hynix at H5TC4G63AFR-PBI sa pamamagitan ng SK hynix. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | H5TC4G63AFR-PBJ | H5TC4G63AFR-PBI |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Uri ng Memory | DDR3L SDRAM | DDR3L SDRAM |
| Laki ng Memory | 4 Gb (256M x 16) | — |
| Volte ng Pagbibigay | 1.35 V | 1.35 V |
| Packhaging | 96-ball TFBGA | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| Temperature Grade | Industrial (-40°C to +95°C) | — |
| Refresh Cycles | 8192 | — |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | 96 |
| Rate ng Data | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] | DDR3-1600 (PC3L-12800) |
| Latensya ng CAS | [DATA_NEEDED: CAS Latency] | Programmable |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) | — |
| Auto Self-Refresh | Yes | — |
| Data Mask | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | Compliant |
| Organisasyon | — | 256M x 16 |
| Total Memory Size | — | 4 Gb |
| Number of Banks | — | 8 |
| Burst Length | — | 8 (BL8) |
| On-Die Termination (ODT) | — | Yes |
| Refresh Period | — | 7.8 us at 85°C |
| Hanay ng Temperature na Operasyon | — | -40°C to +95°C |
| Uri ng Pagpapasok | — | Surface Mount |