H5TC4G63AFR-PBJ vs H5TC4G63AFR-PBI 比較
詳細並排比較 H5TC4G63AFR-PBJ 由 SK hynix 與 H5TC4G63AFR-PBI 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | H5TC4G63AFR-PBJ | H5TC4G63AFR-PBI |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | Obsolete |
| 記憶體類型 | DDR3L SDRAM | DDR3L SDRAM |
| 記憶體容量 | 4 Gb (256M x 16) | — |
| 供應電壓 | 1.35 V | 1.35 V |
| 封裝 | 96-ball TFBGA | 96-ball FBGA (TFBGA, BGA96, 9x16, 32) |
| Temperature Grade | Industrial (-40°C to +95°C) | — |
| Refresh Cycles | 8192 | — |
| Package Shape | Rectangular | — |
| Number of Terminals | 96 | 96 |
| 資料速率 | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] | DDR3-1600 (PC3L-12800) |
| CAS 延遲 | [DATA_NEEDED: CAS Latency] | Programmable |
| Access Time | 0.225 ns (from H5TC4G63AFR-PBR datasheet) | — |
| Auto Self-Refresh | Yes | — |
| Data Mask | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS Status] | Compliant |
| 組織 | — | 256M x 16 |
| Total Memory Size | — | 4 Gb |
| Number of Banks | — | 8 |
| Burst Length | — | 8 (BL8) |
| On-Die Termination (ODT) | — | Yes |
| Refresh Period | — | 7.8 us at 85°C |
| 工作溫度範圍 | — | -40°C to +95°C |
| 安裝類型 | — | Surface Mount |