K4A8G085WB-BCWE vs H5AN8G8NCJR-UHC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A8G085WB-BCWE disebabkan oleh Samsung Electronics dan H5AN8G8NCJR-UHC disebabkan oleh SK hynix. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4A8G085WB-BCWE | H5AN8G8NCJR-UHC |
|---|---|---|
| Merek | Samsung Electronics | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Status Stok | In Stock | — |
| Harga Unit (USD) | $12.30 | — |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gb |
| Organisasi | 1G x 8 | 1G x 8 |
| Kadar Data | 3200 Mbps | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Suhu Operasi | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| Kemasan | 78-ball FBGA | FBGA-78 |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Die Classification | B-die | — |
| Antaramuka | DDR4 (SSTL12) | — |
| Application Domain | Server, industrial control, networking, embedded systems | — |
| VREF AC-Noise Derating | +/-1% of VDD included in timing deratings | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance statement] | — |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Body Size | [DATA_NEEDED: package dimensions in mm] | — |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| RoHS Code | — | Yes |
| REACH Compliance | — | Yes (per distributor record) |
| Lead-Free | — | Yes (family documented as Lead-Free & Halogen-Free) |
| Boson Bebas | — | Yes |
| Part Life Cycle Code | — | Active |
| Access Type | — | Synchronous, both clock edges (DDR) |
| Memory Configuration | — | Bank-group architecture DDR4 |
| Die Revision | — | CJR (C-die family) |
| Manufacturer | — | SK hynix Inc. |