K4A8G165WB-BCTD vs AS4C512M16D4A-62BCN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4A8G165WB-BCTD disebabkan oleh Samsung Electronics dan AS4C512M16D4A-62BCN disebabkan oleh Alliance Memory. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4A8G165WB-BCTD - 8Gb DDR4 SDRAM 512Mx16 2666Mbps | Samsung
K4A8G165WB-BCTD ✓ AktifAlliance Memory
AS4C512M16D4A-62BCN - 8Gb DDR4 SDRAM 512Mx16 | Alliance Memory
AS4C512M16D4A-62BCN ✓ AktifPengandingan Spesifikasi
| Parametr | K4A8G165WB-BCTD | AS4C512M16D4A-62BCN |
|---|---|---|
| Merek | Samsung Electronics | Alliance Memory |
| Kategori | DRAM | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| Organisasi | 512M x 16 | 512M x 16 |
| Kadar Data | 2666 Mbps | 1600 MHz (3200 Mbps) |
| Supply Voltage (VDD) | 1.2 V | — |
| Suhu Operasi | 0C to +85C | 0°C to 95°C |
| Kemasan | 96FBGA | 96-FBGA (7.5x13 mm) |
| Die Generation | B-die | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Antaramuka | DDR4 (parallel, double data rate) | POD (Pseudo Open Drain) |
| Data Mask | Supported (DM per x16 lane) | — |
| ZQ Calibration | Supported | — |
| Dynamic On-Die Termination | Supported | — |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | 18 ns |
| Refresh Rate | [DATA_NEEDED: Refresh Rate] | — |
| Status RoHS | Compliant (per JLCPCB listing: ROHS) | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Saiz Ingatan | — | 8 Gbit |
| Tegangan Pemberi Arus | — | 1.2 V |
| JEDEC Standard | — | Compliant |
| Refresh | — | Auto-refresh and self-refresh |
| On-Die Termination | — | Yes |
| Packaging | — | Tray |