K4AAG165WA-BCTD vs K4AAG165WM-BCRC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCTD disebabkan oleh Samsung Electronics dan K4AAG165WM-BCRC disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4AAG165WM-BCRC - 16Gb DDR4 x16 SDRAM 3200Mbps | Samsung
K4AAG165WM-BCRC ✓ AktifPengandingan Spesifikasi
| Parametr | K4AAG165WA-BCTD | K4AAG165WM-BCRC |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 16 Gb | — |
| Memory Organization | 1G x 16 | — |
| Kadar Data | 2666 Mbps | 3200 Mbps |
| Tegangan Pemberi Arus | 1.2 V | — |
| Antaramuka | Synchronous, DDR4 | DDR4 (SSTL-12) |
| Suhu Operasi | 0C to +85C | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] |
| Kemasan | 96-FBGA | 96-ball FBGA |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Memory Format | Volatile (DRAM) | — |
| Bank Architecture | DDR4 bank-group architecture | — |
| Technology Family | DDR4 SDRAM (Samsung K4AAG165WA series) | — |
| Application Class | Computing, embedded, consumer main memory | — |
| Package Family | FBGA -> fine-pitch BGA -> surface mount | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Aras MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Density | — | 16 Gb |
| Organisasi | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS latency at 3200 Mbps] |