MC9S12GC32MFAE vs MC9S12C32MPBE16 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12GC32MFAE disebabkan oleh NXP Semiconductors dan MC9S12C32MPBE16 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12GC32MFAE MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE Nrnd
NXP Semiconductors
MC9S12C32MPBE16 MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP

MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP

MC9S12C32MPBE16 ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12GC32MFAE MC9S12C32MPBE16
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core HCS12 (16-bit) —
CPU Family S12GC —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 2 KB —
EEPROM 1 KB —
Maximum Bus Clock 25 MHz (50 MHz core via PLL) —
Tegangan Pemberi Arus 2.97 V to 5.5 V 2.5 V / 5 V
Internal Voltage Regulator On-chip bandgap Vreg (2.5 V core) —
ADC 10-bit —
PWM / Timer Channels 8 channels —
SCI (UART) Up to 2 —
SPI 1 —
GPIO Up to 60 —
Debug Interface BDM (single-wire background debug) BDM (Background Debug Mode)
Kemasan 48-LQFP (7x7 mm) —
Suhu Operasi [DATA_NEEDED: operating temperature grade] [DATA_NEEDED: operating temperature range]
Status RoHS [DATA_NEEDED: RoHS status] Compliant
Jenis Pemasangan Surface Mount Surface Mount
Core Architecture — HCS12 (CPU12)
Lebar Bus Data — 16-bit
Program Memory Size — 32 KB (32K x 8) Flash
RAM Size — 2 KB (2K x 8)
Maximum CPU Frequency — 16 MHz
Number of I/O Pins — 35
Kemasan / Case — 52-LQFP (10x10 mm)
Oscillator Type — Internal
Packaging — Tray
Peripherals — MSCAN (CAN 2.0A/B), SCI, SPI, 16-bit Timer, 10-bit ADC
Lead-Free — Yes

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