MC9S12GC32MFAE vs MC9S12C32MPBE16 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12GC32MFAE sa pamamagitan ng NXP Semiconductors at MC9S12C32MPBE16 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S12C32MPBE16 - 16-Bit HCS12 MCU, 32KB Flash, 52-LQFP | NXP
MC9S12C32MPBE16 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MC9S12GC32MFAE | MC9S12C32MPBE16 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Core | HCS12 (16-bit) | — |
| CPU Family | S12GC | — |
| Program Memory (Flash) | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | 1 KB | — |
| Maximum Bus Clock | 25 MHz (50 MHz core via PLL) | — |
| Volte ng Pagbibigay | 2.97 V to 5.5 V | 2.5 V / 5 V |
| Internal Voltage Regulator | On-chip bandgap Vreg (2.5 V core) | — |
| ADC | 10-bit | — |
| PWM / Timer Channels | 8 channels | — |
| SCI (UART) | Up to 2 | — |
| SPI | 1 | — |
| GPIO | Up to 60 | — |
| Debug Interface | BDM (single-wire background debug) | BDM (Background Debug Mode) |
| Packhaging | 48-LQFP (7x7 mm) | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | [DATA_NEEDED: operating temperature range] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Core Architecture | — | HCS12 (CPU12) |
| Width ng Data Bus | — | 16-bit |
| Program Memory Size | — | 32 KB (32K x 8) Flash |
| RAM Size | — | 2 KB (2K x 8) |
| Maximum CPU Frequency | — | 16 MHz |
| Number of I/O Pins | — | 35 |
| Packhaging / Kaso | — | 52-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Packaging | — | Tray |
| Peripherals | — | MSCAN (CAN 2.0A/B), SCI, SPI, 16-bit Timer, 10-bit ADC |
| Lead-Free | — | Yes |