MT41K256M16TW-107 vs K4A8G165WB-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MT41K256M16TW-107 disebabkan oleh Micron Technology dan K4A8G165WB-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MT41K256M16TW-107 | K4A8G165WB-BCPB |
|---|---|---|
| Merek | Micron Technology | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Harga Unit (USD) | $14.10 | — |
| Jenis Ingatan | DDR3L SDRAM | DDR4 SDRAM |
| Saiz Ingatan | 4 Gbit | — |
| Organisasi | 256M x 16 | 512M x 16 |
| Antaramuka | Parallel | DDR4 (synchronous, double data rate) |
| Clock Frequency | 933 MHz (DDR3L-1866) | — |
| Access Time | 20 ns | — |
| Tegangan Pemberi Arus | 1.35 V | — |
| Lebar Bus Data | 16 bit | — |
| Kemasan | 96-FBGA (8x14 mm) | 96FBGA (TFBGA) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0C to +95C (commercial :P grade) | 0C to +85C |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask | Yes | — |
| Write Leveling | Yes | — |
| Dynamic On-Die Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per Lisleapex listing) |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Density | — | 8 Gb |
| Kadar Data | — | 2133 Mbps |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Number of Terminals | — | 96 |
| Package Shape | — | Rectangular, bottom terminal position |
| Die Generation | — | 8Gb B-die |
| Bank Groups | — | DDR4 bank-group architecture |
| Refresh | — | [DATA_NEEDED: refresh specification] |