TD1205 vs TD1207 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci TD1205 disebabkan oleh TD next dan TD1207 disebabkan oleh TD next. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | TD1205 | TD1207 |
|---|---|---|
| Merek | TD next | TD next |
| Kategori | RF Modules | RF Modules |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Sigfox-certified RF transceiver module | Sigfox RF Transceiver Module |
| Manufacturer | TD next (Telecom Design) | Telecom Design / TD next |
| RF Protocol | Sigfox (Ultra-Narrow-Band LPWAN) | — |
| Operating Frequency (RC1) | 868 MHz (ETSI Europe) | — |
| Operating Frequency (RC2) | 902-928 MHz (US, Australia, Japan) | — |
| Tx Power (RC1) | +14 dBm typical | — |
| Tx Power (RC2) | +22 dBm maximum | — |
| Receiver Sensitivity | [DATA_NEEDED: receiver sensitivity] | — |
| Integrated Microcontroller | ARM Cortex-M0+ (STM32 family) | — |
| Clock Reference | Integrated TCXO | — |
| Host Interface | UART, SPI, I2C, GPIO | UART (AT commands), SPI, GPIO |
| Modulation | Ultra-Narrow-Band (UNB), DBPSK uplink | Sigfox ultra-narrowband (UNB) |
| Maximum Payload Size | 12 bytes per uplink message | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: VBAT operating range] | 3.3 V typical (single rail) |
| Suhu Operasi | -40C to +85C | -30 C to +70 C |
| Form Factor | Surface-mount LGA castellation module | Surface-mount module |
| Jenis Pemasangan | Surface Mount (reflow) | SMT (castellated edge pads) |
| Status RoHS | Compliant | Compliant |
| Operating Frequency Bands | — | 868 MHz (ETSI) / 902 MHz (FCC) |
| Protocol | — | Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready) |
| RX Sensitivity (typical) | — | -126 dBm |
| TX Output Power (max) | — | +14 dBm |
| Baseband Processor | — | ARM Cortex-M3 |
| Antenna Interface | — | SMA / U.FL footprint (model dependent) |