TD1205 vs TD1207 比較
詳細並排比較 TD1205 由 TD next 與 TD1207 由 TD next. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | TD1205 | TD1207 |
|---|---|---|
| 品牌 | TD next | TD next |
| 類別 | RF Modules | RF Modules |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Product Type | Sigfox-certified RF transceiver module | Sigfox RF Transceiver Module |
| Manufacturer | TD next (Telecom Design) | Telecom Design / TD next |
| RF Protocol | Sigfox (Ultra-Narrow-Band LPWAN) | — |
| Operating Frequency (RC1) | 868 MHz (ETSI Europe) | — |
| Operating Frequency (RC2) | 902-928 MHz (US, Australia, Japan) | — |
| Tx Power (RC1) | +14 dBm typical | — |
| Tx Power (RC2) | +22 dBm maximum | — |
| Receiver Sensitivity | [DATA_NEEDED: receiver sensitivity] | — |
| Integrated Microcontroller | ARM Cortex-M0+ (STM32 family) | — |
| Clock Reference | Integrated TCXO | — |
| Host Interface | UART, SPI, I2C, GPIO | UART (AT commands), SPI, GPIO |
| Modulation | Ultra-Narrow-Band (UNB), DBPSK uplink | Sigfox ultra-narrowband (UNB) |
| Maximum Payload Size | 12 bytes per uplink message | — |
| 供應電壓 | [DATA_NEEDED: VBAT operating range] | 3.3 V typical (single rail) |
| 工作溫度 | -40C to +85C | -30 C to +70 C |
| Form Factor | Surface-mount LGA castellation module | Surface-mount module |
| 安裝類型 | Surface Mount (reflow) | SMT (castellated edge pads) |
| RoHS 狀態 | Compliant | Compliant |
| Operating Frequency Bands | — | 868 MHz (ETSI) / 902 MHz (FCC) |
| Protocol | — | Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready) |
| RX Sensitivity (typical) | — | -126 dBm |
| TX Output Power (max) | — | +14 dBm |
| Baseband Processor | — | ARM Cortex-M3 |
| Antenna Interface | — | SMA / U.FL footprint (model dependent) |