TD1205 vs TD1207 Karşılaştırma
Ayrıntılı yan yana karşılaştırma TD1205 tarafından TD next ve TD1207 tarafından TD nextAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | TD1205 | TD1207 |
|---|---|---|
| Marka | TD next | TD next |
| Kategori | RF Modules | RF Modules |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Product Type | Sigfox-certified RF transceiver module | Sigfox RF Transceiver Module |
| Manufacturer | TD next (Telecom Design) | Telecom Design / TD next |
| RF Protocol | Sigfox (Ultra-Narrow-Band LPWAN) | — |
| Operating Frequency (RC1) | 868 MHz (ETSI Europe) | — |
| Operating Frequency (RC2) | 902-928 MHz (US, Australia, Japan) | — |
| Tx Power (RC1) | +14 dBm typical | — |
| Tx Power (RC2) | +22 dBm maximum | — |
| Receiver Sensitivity | [DATA_NEEDED: receiver sensitivity] | — |
| Integrated Microcontroller | ARM Cortex-M0+ (STM32 family) | — |
| Clock Reference | Integrated TCXO | — |
| Host Interface | UART, SPI, I2C, GPIO | UART (AT commands), SPI, GPIO |
| Modulation | Ultra-Narrow-Band (UNB), DBPSK uplink | Sigfox ultra-narrowband (UNB) |
| Maximum Payload Size | 12 bytes per uplink message | — |
| Besleme Gerilimi | [DATA_NEEDED: VBAT operating range] | 3.3 V typical (single rail) |
| İşletim Sıcaklığı | -40C to +85C | -30 C to +70 C |
| Form Factor | Surface-mount LGA castellation module | Surface-mount module |
| Montaj Türü | Surface Mount (reflow) | SMT (castellated edge pads) |
| RoHS Durumu | Compliant | Compliant |
| Operating Frequency Bands | — | 868 MHz (ETSI) / 902 MHz (FCC) |
| Protocol | — | Sigfox (RC1 / RC2 / RC3 / RC4 zone-ready) |
| RX Sensitivity (typical) | — | -126 dBm |
| TX Output Power (max) | — | +14 dBm |
| Baseband Processor | — | ARM Cortex-M3 |
| Antenna Interface | — | SMA / U.FL footprint (model dependent) |