10AX090N2F45I2SG - Arria 10 GX FPGA, 900K LE, 1932-BGA | Intel
MPN: 10AX090N2F45I2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3995 | $39,950.00 |
| 25 | $3810 | $95,250.00 |
| 50 | $3640 | $182,000.00 |
| 100 | $3475 | $347,500.00 |
Drop-in alternatives for 10AX090N2F45I2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090N2F45I1SG
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View Datasheet →10AX090N2F45I2LG
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View Datasheet →10AX090N2F45E2LG
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View Datasheet →10AX090N2F45I2SG Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field Programmable Gate Array) |
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,104 |
| User I/Os | 768 |
| Number of LABs/CLBs | 33750 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 1932-BBGA, F45 (FCBGA flip-chip) |
| Mounting Type | Surface Mount |
| Speed Grade | -2 |
| Configuration Method | JTAG / Serial / Parallel flash |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AX090N2F45I2SG 1932-bbga, f45 (fcbga flip-chip) Pin Configuration Guide
Complete pinout information for 10AX090N2F45I2SG (1932-bbga, f45 (fcbga flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090N2F45I2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090N2F45I2SG is suitable for 7 applications: High-Speed Serial Link Aggregation, ASIC Prototyping and Emulation, Wireless Baseband Processing, Video Broadcast and Image Processing Pipelines, PCIe Gen3 Add-in Cards and Embedded Modules, Industrial Automation and Machine Vision, Defense and Aerospace Signal Processing.
High-Speed Serial Link Aggregation
The 10AX090N2F45I2SG suits multi-lane serial link aggregation in telecom and data center equipment, where the Arria 10 GX integrated SERDES support multi-gigabit data rates and hard PCIe Gen3 IP. The 900K logic elements provide the fabric to implement packet parsing, queuing, and forwarding at line rate, while the 768 user I/Os expose ample GPIOs for backplane glue logic. Using the industrial temperature range allows deployment in outdoor or uncontrolled-environment shelves. Typical savings versus ASIC NRE are realized by integrating what would otherwise require a discrete PHY plus a companion ASSP, all within one programmable device.
Recommended
ASIC Prototyping and Emulation
With 900K logic elements and approximately 7.2 Mbytes of embedded memory, the 10AX090N2F45I2SG emulates mid-to-large ASIC designs with reasonable partition granularity. The 1932-ball FCBGA exposes enough I/Os for realistic ASIC-style multi-voltage I/O banks, allowing verification of mixed-voltage ASIC IP. Quartus Prime's incremental compile flow partitions designs across multiple FPGAs in a multi-FPGA emulator rig. The -2 speed grade ensures timing closure on faster critical paths, an essential property when emulating ASICs that will later run at hundreds of MHz.
Recommended
Wireless Baseband Processing
The Arria 10 GX hard DSP blocks paired with 900K logic elements make the 10AX090N2F45I2SG a credible choice for wireless baseband PHY implementations. LTE and 5G NR base stations require hundreds of FIR filters, FFTs, and channel estimators per antenna chain, and the DSP blocks deliver GMACs of throughput at lower power than soft-multiplier implementations. The industrial temperature grade supports outdoor macro-cell and small-cell deployments. Integrating the baseband with the backhaul Ethernet MAC on a single device reduces system bill-of-materials and PCB footprint versus discrete processor+FPGA partitioning.
Recommended
Video Broadcast and Image Processing Pipelines
Broadcast video routers, multiviewers, and real-time image processing pipelines benefit from the 10AX090N2F45I2SG's parallel fabric and high external bandwidth. The 768 user I/Os sustain uncompressed 4K video flows at 60 fps and the dedicated DSP blocks accelerate color-space conversion, scaling, and overlay composition. Industrial temperature ensures reliable operation in truck-mounted outside broadcast (OB) and studio environments. Compared to GPU-based processing, deterministic latency on the FPGA fabric simplifies lip-sync and broadcast timing budgets.
Recommended
PCIe Gen3 Add-in Cards and Embedded Modules
The 10AX090N2F45I2SG includes hard PCIe Gen3 IP blocks, allowing direct PCIe Gen3 x4/x8 endpoint implementation without external PHY silicon. Add-in card designers benefit from the integrated transceiver count, the high GPIO for board-level signaling, and Quartus Prime's PCIe hard IP wizard for rapid bring-up. For COM Express or VPX-style embedded modules, the FPGA acts as both a PCIe endpoint and a custom side-band fabric between the host CPU and rear-panel I/O. Industrial temperature covers deployable edge-compute platforms.
Recommended
Industrial Automation and Machine Vision
Industrial machine vision and motion control systems leverage the 10AX090N2F45I2SG's parallel pipeline for multi-camera ingest, real-time image processing, and deterministic control loops. The 900K logic elements run multiple image signal processing pipelines in parallel while the hard DSP blocks accelerate convolution and feature extraction. Industrial temperature rating (-40C to +100C) allows direct deployment on the factory floor without additional thermal conditioning. The integrated SERDES support Camera Link, CoaXPress, or GigE Vision aggregation on a single FPGA, simplifying the overall BOM.
Recommended
Defense and Aerospace Signal Processing
The 10AX090N2F45I2SG's 900K logic elements and industrial temperature grade suit ruggedized defense subsystems such as radar front-end preprocessing, electronic warfare (EW) digitizers, and software-defined radio (SDR) basebands. The 1932-ball FCBGA package supports the high pin density required for multi-channel ADC/DAC fanout and JESD204B/C interfaces. Designers can implement high-throughput FFTs, pulse compression, and direction-finding algorithms in hard DSP blocks while soft logic handles control-plane tasks. The programmable nature allows quick upgrades for evolving mission requirements.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090N2F45I2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090N2F45I1SG | 10AX090N2F45E2SG | 10AX090N2F45E1SG | 10AX090N2F45I2LG | 10AX090N2F45E2LG | 10AX090N2F40I2SG |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1932-BBGA F45 | 1932-BBGA F45 - same | 1932-BBGA F45 - same | 1932-BBGA F45 - same | 1932-BBGA F45 - same | 1932-BBGA F45 - same | 1932-BBGA F40 - different size |
| Speed Grade | -2 | -1 (-10-15% Fmax vs -2) | -2 (same) | -1 | -2 (same) | -2 (same) | -2 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (same) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (same) | Commercial (0C to +85C) | Industrial (same) |
| Logic Elements | 900,000 | 900,000 (same) | 900,000 (same) | 900,000 (same) | 900,000 (same) | 900,000 (same) | 900,000 (same) |
| Embedded Memory | 59,234,104 bits | 59,234,104 bits (same) | 59,234,104 bits (same) | 59,234,104 bits (same) | 59,234,104 bits (same) | 59,234,104 bits (same) | 59,234,104 bits (same) |
| User I/Os | 768 | 768 (same) | 768 (same) | 768 (same) | 768 (same) | 768 (same) | Fewer I/Os (F40 package) |
| Process Node | 20 nm | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) | 20 nm (same) |
| Approx Unit Price (USD) | 4250.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher Fmax on -2 speed grade vs -1 grade at industrial temperature (vs 10AX090N2F45I1SG)
- Industrial temperature grade for outdoor/harsh-environment deployment (vs 10AX090N2F45E2SG)
- Same Arria 10 GX die available in F45 and F40 packages for design migration (vs 10AX090N2F40I2SG)
Design Notes
The 1932-ball F45 FCBGA requires a high-density PCB stack-up with microvia (laser-drilled) layer transitions to escape the 1.0 mm pitch BGA. Use a minimum 6-6-6 build-up stack-up (6 core layers + 6 sequential build-up layers each side) or a coreless equivalent. Each signal escape must have its own microvia, and paired ground/power vias for return-current continuity. Estimated stack-up cost is significant; verify with your PCB vendor before committing. Reference Intel's Arria 10 GX F45 package mechanical drawing for exact ball coordinates and recommended via dimensions.
Estimated: the 10AX090N2F45I2SG requires a 0.9V core rail plus multiple auxiliary rails for transceivers, I/O banks, and PLLs/HPS. Estimated total power consumption at typical utilization (50% LE, 50% DSP, mid-speed SERDES) is approximately 20-30W; peak power with full SERDES activity can exceed 40W. Design the core VR with at least 30% margin and use a multi-phase controller capable of fast load-transient response. Decouple each rail with a combination of bulk tantalum/polymer capacitors near the regulator and 0402/0201 MLCCs within 1-2 mm of every BGA ball cluster.
Estimated: with 20-30W typical power dissipation on the 1932-ball FCBGA, the 10AX090N2F45I2SG requires a heatsink plus adequate airflow, or a cold-plate / heat-spreader attachment. The F45 package has a top-side exposed die that allows direct thermal interface material (TIM) attachment. Theta_JB is approximately 0.4 C/W for this package; with a quality heatsink and 200 LFM airflow, junction-to-air thermal resistance can reach 1.0-1.5 C/W, keeping junction rise below 40C for industrial-grade 100C operation.
Differential SERDES channels require matched-length routing within the skew tolerance specified by Intel Quartus Prime's transceiver parameter editor. Maintain 85-100 ohm differential impedance for high-speed serial lanes and 50 ohm single-ended for general-purpose GPIO. Reference the Arria 10 GX PCB Design Guidelines for via-stub length limits (typically under 0.2x rise time), AC-coupling capacitor placement, and return-path continuity. Pin-swapping assignments to optimize routing is permitted within Quartus Prime pin planner.
Do not assume the 10AX090N2F45I2SG is pin-compatible with the commercial-grade 10AX090N2F45E2SG on hardware - the silicon is identical but factory test programs differ and Intel's ordering code matrix treats them as separate OPNs. Verify configuration mode (JTAG vs serial flash) before committing to a PCB; using the wrong AS/PS pin strapping will lock out boundary-scan debugging. Lastly, ensure Quartus Prime version is 18.0 or later to support current silicon errata patches; older 17.x builds do not include the latest transceiver analog settings.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 is not applicable for FPGAs (AEC-Q100 targets automotive-grade ICs). Lead-free BGA balls support SAC305 reflow profiles. Conflict-mineral reporting is filed under the Intel PSG supply chain disclosure program. Halogen-free status not explicitly stated in the verified web data.
