10AX090U4F45I3SG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
MPN: 10AX090U4F45I3SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $4050 | $40,500.00 |
| 100 | $3820 | $382,000.00 |
| 500 | $3650 | $1,825,000.00 |
| 1,000 | $3490 | $3,490,000.00 |
Drop-in alternatives for 10AX090U4F45I3SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090U4F45I3LG
✅ Drop-In✓ In Stock
$7450 / Unit
View Datasheet →10AX090U4F45E3LG
✅ Drop-In✓ In Stock
$7147.8719 / Unit
View Datasheet →10AX090U3F45I2SG
✅ Drop-In✓ In Stock
$7450 / Unit
View Datasheet →10AX090S4F45I3SG
✅ Drop-In✓ In Stock
$4520 / Unit
View Datasheet →10AX090N4F45I3LG
✅ Drop-In✓ In Stock
$5202.97 / Unit
View Datasheet →10AX090U4F45I3SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (Bits) | 59,234,304 |
| Transceivers | Up to 48 channels |
| Transceiver Data Rate (max) | 14.1 Gbps |
| Maximum User I/O | 480 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Package | 1932-BBGA FCBGA (F45) 45x45 mm, 1 mm pitch |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
10AX090U4F45I3SG 1932-bbga fcbga (f45) 45x45 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for 10AX090U4F45I3SG (1932-bbga fcbga (f45) 45x45 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090U4F45I3SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090U4F45I3SG is suitable for 6 applications: 4K Video Broadcast and Professional AV, 100G/400G Ethernet Line-Card Packet Processing, Military Radar and Electronic Warfare Baseband, Test and Measurement Instrumentation, ASIC Prototyping and Emulation, High-Performance Industrial Imaging and Machine Vision.
4K Video Broadcast and Professional AV
The 10AX090U4F45I3SG's 900,000 logic elements and DSP density make it ideal for 4K/UHD video broadcast pipelines that require real-time up/down/cross-conversion, color-space transform, and HDR processing. The 48 transceivers at 14.1 Gbps aggregate >600 Gbps of serial bandwidth, sufficient for SDI 12G and emerging IP-based ST 2110 video-over-Ethernet fabrics in broadcast routers. Compared with a discrete ASIC, the FPGA fabric enables rapid codec-standard adaptation as SMPTE and AIMS evolve; designers typically instantiate hard memory controllers driving DDR4 to act as line buffers and frame stores, and the industrial temperature grade ensures 24/7 rack-mount reliability.
Recommended
100G/400G Ethernet Line-Card Packet Processing
The Arria 10 GX device's 48 transceivers at 14.1 Gbps, combined with 900K logic elements and embedded 59 Mbit memory, enable line-card designs that aggregate multiple 10G/25G/40G Ethernet links into 100G or 400G uplinks. Hardened PCS and MAC blocks accelerate packet classification, deep buffering, and QoS scheduling in switch fabric applications. The 1932-ball F45 package supports the high pin-count needed for multiple QSFP28 cages plus DDR4 buffer memory; industrial temperature grade suits both centralized-office and outdoor-ruggedized line-card deployments.
Recommended
Military Radar and Electronic Warfare Baseband
The 10AX090U4F45I3SG's hardened floating-point DSP blocks deliver massive parallel arithmetic throughput required for phased-array radar beamforming, pulse-Doppler processing, and adaptive electronic-countermeasure algorithms. With 900K logic elements and high M20K memory density, the device supports simultaneous multi-channel waveform generation and channelized receiver processing on a single die. The F45 package and industrial temperature rating meet the ruggedization envelope for ground-vehicle and shipboard EW installations, and the device's built-in partial reconfiguration allows runtime mode switching between radar and jamming profiles.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol analyzers leverage the 10AX090U4F45I3SG's DSP density and 14.1 Gbps transceivers to perform real-time signal integrity analysis on multi-gigabit serial buses. The 900K logic elements and 59 Mbit embedded memory support deep acquisition memory and complex trigger logic for protocols such as PCIe Gen3, USB 3.1, and 100G Ethernet. The device's PCIe hard IP enables direct host-attach in PXIe and AXIe modular instrument chassis, while the 1932-ball F45 package allows integration of multiple high-speed ADC/DAC front-ends on a single board.
Recommended
ASIC Prototyping and Emulation
With 900,000 logic elements and 480 user I/O, the 10AX090U4F45I3SG provides the logic capacity to partition and emulate multi-million-gate ASIC designs in bring-up and validation stages. The high transceiver count enables realistic ASIC-to-ASIC link emulation at production-clock speeds, while the embedded M20K memory accurately models large on-die SRAMs. Multiple Arria 10 GX F45 boards can be co-hosted in a logic-emulation chassis to scale capacity beyond a single FPGA; the 20nm process node ensures timing-accuracy emulating ASICs fabricated at similar process generations.
Recommended
High-Performance Industrial Imaging and Machine Vision
The Arria 10 GX device's parallel DSP throughput and 14.1 Gbps transceivers support multi-camera CoaXPress, 10 GigE Vision, and Camera Link HS aggregation in machine-vision systems for high-speed sortation, semiconductor inspection, and robotics guidance. The 900K logic elements enable real-time image preprocessing, lens-distortion correction, and convolutional feature extraction close to the sensor array. With 480 user I/O plus hard memory controllers, the 10AX090U4F45I3SG can drive DDR4 frame buffers alongside multi-gigabit sensor links, and the industrial temperature rating supports factory-floor deployment.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090U4F45I3SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090U4F45I3LG | 10AX090U4F45E3LG | 10AX090U3F45I2SG | 10AX090S4F45I3SG | 10AX090N4F45I3LG |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-BBGA FCBGA (F45) 45x45 mm | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same | 1932-BBGA FCBGA (F45) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Mbit) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit |
| Transceiver Channels | Up to 48 | Up to 48 | Up to 48 | Up to 48 | Up to 48 | None (N variant) |
| Transceiver Max Rate | 14.1 Gbps | 14.1 Gbps | 14.1 Gbps | ~12.5 Gbps (-1 bin) | ~13.4 Gbps (SEU variant) | N/A |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Enhanced | Industrial | Industrial | Industrial |
| Lead-Free (RoHS) | No (lead-pkg finish) | Yes (LG suffix) | Yes (LG suffix) | No | No | Yes (LG suffix) |
| Special Feature | Standard (U4 highest speed) | Standard lead-free | Enhanced temperature | U3 = lower speed bin | S = SEU-mitigated (rad-hard) | N = no-transceiver |
Key Differentiators
- Highest-density Arria 10 GX in the F45 package footprint (vs 10AX090U3F45I2SG)
- Lead-free drop-in available for RoHS-restricted markets (vs 10AX090U4F45I3LG)
- Available with hardened SEU mitigation for military/space (vs 10AX090S4F45I3SG)
- Optional no-transceiver variant in same F45 package (vs 10AX090N4F45I3LG)
Design Notes
The 1932-ball F45 FCBGA package at 1 mm pitch requires an 8-layer or higher PCB stack-up with laser-drilled microvias (typically 0.1 mm finished) for inner-row breakout. Per Intel's Arria 10 GX hardware design guidelines, all transceiver lanes must be length-matched to within 0.127 mm (5 mil) for pairs and 1.27 mm (50 mil) for channel-to-channel, with continuous reference planes on layers 2 and 7 for 100-ohm differential impedance. Skip microvia fan-out and the design will fail PCIe Gen3 and 10G-KR compliance at first silicon.
At full utilization (90% logic, all 48 transceivers active, DDR4 at full rate), the 10AX090U4F45I3SG can dissipate 20-30 W. With the FCBGA's typical theta_JA of ~12 C/W at 1 m/s airflow, junction temperature can climb 240-360 C above ambient under industrial (-40C to +100C) envelopes. Recommended: thermal pad with 1.5-2.5 W/m-K TIM, integrated heat-spreader lid, and 200-400 LFM chassis airflow. Estimated: P=25 W, theta_JA=12 C/W, delta_T = 300 C - sufficient margin only with active cooling.
Common pitfalls when bringing up the 10AX090U4F45I3SG include: (1) missing transceiver reference-clock jitter-cleaner PLLs (per Arria 10 GX design guidelines, each bank requires a dedicated clean PLL); (2) incorrect MSEL configuration pin strapping (MSEL[3:0] must match the intended fast passive or active serial configuration mode); (3) using the wrong Quartus Prime device family variant (select '10AX090' family, NOT '10AS066' or '10CL' - they have different IO standards); and (4) violating the I/O power-on ramp sequence which can latch-up the device.
Power-rail sequencing for the 10AX090U4F45I3SG must follow Intel's recommended order: 0.9V core first, then 1.8V transceiver analog, then 1.2V/1.5V DDR4 interface, then 3.0V/2.5V/1.8V I/O banks per bank voltage. Estimated total supply current at full load: ~25 A on the 0.9V rail, requiring a 30 A capable buck regulator such as the LTC3615 or similar. Use TI's Power Designer or Intel's Early Power Estimator spreadsheet before committing PCB to power-stage component selection.
For 14.1 Gbps transceiver operation, follow Intel's 'Arria 10 GX Transceiver Link Design Guide' for via optimization (back-drilled stubs <0.15 mm), AC-coupling capacitor selection (0402 X7R 100 nF, placed within 5 mm of the RX pin), and receiver CTLE adaptation. The reference clock input path requires a jitter attenuator between the upstream PLL and the FPGA REFCLK pin - using a raw TCXO will fail PCIe Gen3 jitter compliance. Target <500 fs RMS jitter at the device REFCLK input for reliable 10 Gbps link-up.
Compliance Information
The 'G' suffix in 10AX090U4F45I3SG denotes lead-pkg terminal finish per Intel Arria 10 ordering nomenclature; for lead-free (RoHS) choose 'LG' suffix variant. RoHS and REACH compliance per the Intel product page; AEC-Q100 not applicable to FPGAs.
