10M04DAU324I7G - MAX 10 FPGA 4K LE 246 I/O U324 | Intel
MPN: 10M04DAU324I7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $19.14 | $19.14 |
| 10 | $18.2 | $182.00 |
| 100 | $16.85 | $1,685.00 |
| 500 | $15.1 | $7,550.00 |
| 1,000 | $13.5 | $13,500.00 |
10M04DAU324I7G Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all defined by a user-loaded bitstream. Within the broader taxonomy, an FPGA sits at the apex of programmable logic (PLD), offering higher density than CPLDs and adding on-die features such as transceivers, PLLs, and (in MAX 10's case) analog-to-digital converters. MAX 10 extends this concept with embedded flash, removing the need for an external boot PROM.
Key features include 4,000 logic elements, 246 user I/O, integrated 8-channel 12-bit ADC, embedded flash for instant-on configuration, dual configuration flash images, and 1.2 V core operation with on-die voltage regulation. The U324 package exposes LVDS-capable high-speed I/O on the lower-power budget side while still supporting industrial temperature operation. The ADC block and on-die flash differentiate MAX 10 from SRAM-based Cyclone devices.
Architecturally, MAX 10 uses a logic-array block (LAB) fabric built on 55 nm TSMC flash process technology, with embedded configuration memory that eliminates external boot devices. The 10M04 variant represents the smallest die in the family, providing the lowest cost and lowest static power while retaining the same analog and flash features as larger siblings, making it ideal for glue-logic, I/O expansion, and sensor-front-end consolidation on a single chip.
Typical applications include industrial sensor hubs, motor-control coprocessors, low-density bridging and protocol conversion, factory automation I/O modules, and portable test instruments where instant-on behavior, on-die ADC, and small footprint outweigh the need for higher logic capacity.
When designing with this part, plan JTAG and configuration pin access early - even though MAX 10 instant-on from flash, dual-image support requires a defined switchover scheme. Verify DDR3/micron-grade memory interface compatibility using Intel Pin-Out File (MPF) before PCB layout, since the U324 ball map is dense.
This page synthesizes distributor pricing, drop-in same-package alternatives from the MAX 10 family, and practical design notes not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for 10M04DAU324I7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10M04DAU324I7G (same form factor and footprint) — differing in Package, Process Technology, Speed Grade, Configuration Memory, User Flash Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M04DAU324C8G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →10M04DAU324A7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M04DCU324I7G
✅ Drop-In✓ In Stock
$9.15 / Unit
View Datasheet →10M04DCU324C8G
✅ Drop-In✓ In Stock
$13.8 / Unit
View Datasheet →10M04DAU324I7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements | 4,000 |
| User Flash Memory | 193,536 bits |
| User I/O Count | 246 |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V |
| Package | 324-pin UFBGA (U324) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| Configuration Memory | Embedded flash (dual image) |
| On-die ADC | 12-bit, 8-channel (MAX 10 feature) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10M04DAU324I7G 324-pin ufbga (u324) Pin Configuration Guide
Pin configuration for 10M04DAU324I7G (324-pin ufbga (u324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M04DAU324I7G.
Refer to the datasheet for full pin configuration.
Typical Applications
10M04DAU324I7G is suitable for 6 applications: Industrial Sensor Hub, Motor Control Coprocessor, Protocol Bridge (UART/SPI/I2C to Ethernet/CAN), Factory Automation I/O Module, Portable Test & Measurement Instrument, Display Controller / LED Driver Front-End.
Industrial Sensor Hub
The 10M04DAU324I7G is well-suited for industrial sensor hubs because its on-die 12-bit 8-channel ADC samples analog sensor outputs (temperature, pressure, flow) directly without external analog front-end. The 4,000-LE fabric handles Modbus RTU/TCP, CAN 2.0B, and 4-20 mA loop conversion in a single device. Industrial -40C to +100C temperature grade ensures operation on factory floors, while 193 Kbits embedded flash eliminates the boot PROM and reduces BOM. Power consumption at typical 50 MHz operation is under 150 mW core, enabling fanless enclosure designs.
Recommended
Motor Control Coprocessor
In BLDC and stepper motor controllers, the 10M04DAU324I7G acts as a coprocessor offloading PWM generation, Hall-sensor decoding, and closed-loop PID from the main MCU. The 246 user I/O accept multi-axis Hall inputs and drive opto-isolated gate signals, while the 12-bit ADC samples phase currents for FOC algorithms. With 4,000 LEs the device fits state-machine + PID + encoder interface logic on a single chip, reducing system cost versus dedicated DSPs. Industrial temperature grade suits servo-drive environments.
Recommended
Protocol Bridge (UART/SPI/I2C to Ethernet/CAN)
The 10M04DAU324I7G is ideal for legacy-to-modern protocol bridging where multiple serial buses (UART, SPI, I2C) must be aggregated into Ethernet or CAN. The 4,000-LE fabric fits soft IP cores for SPI-to-UART, I2C-to-SPI bridges, plus a lightweight TCP/IP or CANopen stack. Embedded 193 Kbit flash stores configuration and web pages. The 246 user I/O expose enough pins to handle multiple bus instances concurrently, and 1.2 V core operation keeps power low for industrial gateway boxes.
Recommended
Factory Automation I/O Module
In factory automation I/O modules, the 10M04DAU324I7G consolidates 24 V digital input conditioning, opto-isolation drive, and EtherCAT/Profibus slave interface into a single FPGA. The 12-bit on-die ADC reads analog field signals (4-20 mA, 0-10 V) without a separate ADC chip, while 246 I/O drive relays and indicator LEDs. Embedded flash enables instant-on deterministic boot critical for industrial fieldbus timing. Industrial -40C to +100C operation and 55 nm process reliability meet IEC 61131-2 environmental expectations.
Recommended
Portable Test & Measurement Instrument
The 10M04DAU324I7G powers portable test instruments (handheld oscilloscope probes, cable testers, low-cost logic analyzers) because it integrates a 12-bit ADC, programmable logic, and 246 I/O in a single 1.2 V device. The embedded flash supports field firmware upgrades via JTAG while in the field, and the 4,000-LE fabric runs custom stimulus generation, signal conditioning, and USB-to-test-point bridging. Low static power extends battery runtime, while the U324 UFBGA package fits compact handheld enclosures.
Recommended
Display Controller / LED Driver Front-End
The 10M04DAU324I7G is well-suited as a display controller front-end in industrial HMIs and large LED walls where it generates timing signals, manages multi-plexed LED rows, and performs gamma correction in hardware. The 246 I/O drive row/column drivers directly, while 4,000 LEs fit the refresh logic, color-space conversion, and brightness PWM. Industrial temperature grade suits outdoor digital signage, and 193 Kbit embedded flash stores image tables and boot logos without external memory.
Recommended
Recommended Products Summary
Engineering reference data for 10M04DAU324I7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M04DAU324C8G | 10M04DAU324A7G | 10M04DCU324I7G | 10M04DCU324C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-pin UFBGA (U324) | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same | 324-pin UFBGA (U324) - same |
| Logic Elements | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| User I/O Count | 246 | 246 | 246 | 246 | 246 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Automotive grade A7 (-40C to +125C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | I7 | C8 | A7 | I7 | C8 |
| Feature Set | A (standard) | A (standard) | A (standard) | C (alternative) | C (alternative) |
| On-die ADC | 12-bit, 8-channel | 12-bit, 8-channel | 12-bit, 8-channel | 12-bit, 8-channel | 12-bit, 8-channel |
| Embedded User Flash | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits | 193,536 bits |
Key Differentiators
- Industrial temperature grade with same price tier as commercial variants (vs 10M04DAU324C8G)
- Highest user-I/O count available on 10M04 die (vs 10M04DAF256C7G (F256 package))
- Dual-image embedded flash for in-field firmware updates (vs 10M02SCU324I7G (10M02 family))
Design Notes
Estimated: MAX 10 FPGAs require at least three supply rails - 1.2 V core, 2.5 V analog, and 3.3 V I/O. Use a 4-layer PCB with a dedicated ground plane and a 1.2 V LDO with at least 1 A headroom (e.g. TI TPS7A4701 at VIN=5V, VOUT=1.2V) to feed the core. Decouple every VCC pin with a 0.1 uF X7R ceramic plus a 10 uF bulk; place the 0.1 uF cap within 3 mm of each pin to suppress switching noise from the 55 nm core.
The U324 UFBGA package has a 1.0 mm ball pitch; PCB layout requires 0.4 mm laser-drilled microvias and blind-via fan-out. Match all differential pairs (LVDS) within 0.13 mm length tolerance, and keep the JTAG chain (TCK, TMS, TDI, TDO) under 100 mm total trace length to avoid timing-margin loss. Use Intel's Pin-Out File viewer before committing the PCB - swapping two adjacent BGA balls is the most common MAX 10 first-article error.
Plan the dual-image (CFM0/CFM1) jumper scheme early. Although MAX 10 instant-on from embedded flash at <10 ms, dual-image support requires a defined switchover scheme driven by the nSTATUS/CONF_DONE pins. Failure to strap MODE pins correctly traps the device in a reset loop that looks like a dead FPGA - verify on the bench before integrating the FPGA into the host board.
Do not omit the on-die ADC's external reference capacitor (VREFP pin); without it, ADC readings drift by >5 LSB. Also, the 12-bit ADC input range is 0-VCCA (typically 2.5 V); driving beyond VCCA latches the input and corrupts subsequent samples. Use a 100 ohm series resistor plus an external clamp diode for overvoltage protection in industrial environments where transients are common.
Compliance Information
RoHS and REACH compliant per Altera/Intel product page. Standard 'I' (industrial) grade is not AEC-Q100 qualified - choose A7 speed grade for automotive-grade temperature range.
