A3P600-2FG256I - ProASIC3 Flash FPGA 256-FBGA | Microchip
MPN: A3P600-2FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $61.65 | $616.50 |
| 100 | $54.8 | $5,480.00 |
| 500 | $49.3 | $24,650.00 |
| 1,000 | $44.4 | $44,400.00 |
Drop-in alternatives for A3P600-2FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P600-2FGG256I
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View Datasheet →A3P600-1FGG256I
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View Datasheet →A3P600-1FG256
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View Datasheet →A3P600-2FG256I Maximum Ratings & Electrical Characteristics
| Manufacturer Series | ProASIC3 (A3P600) |
| Logic Elements (LEs) | 7K LEs (approximately) |
| Configuration Memory | 110592 bits (flash, non-volatile) |
| Number of I/Os | 177 I/O |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| Temperature Range | -40C to +85C (industrial, suffix I) |
| Package | 256-FBGA (LBGA) |
| Mounting Style | SMD/SMT |
| Configuration Technology | Flash (single-chip, no external PROM) |
| Reprogrammability | Yes (in-system reprogrammable) |
| Power-up Behavior | Live at power-up (instant-on) |
| I/O Banks | 4 I/O banks with dedicated VCCIBx supplies |
| Logic Architecture | VersaTile (3-input LUT / D-FF / latch with enable) |
A3P600-2FG256I 256-fbga (lbga) Pin Configuration Guide
Complete pinout information for A3P600-2FG256I (256-fbga (lbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-2FG256I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-2FG256I is suitable for 6 applications: Industrial Automation and Control, Communications Line Cards and Bridging, Medical Instrumentation Control Logic, Aerospace and Defense Subsystems, Secure Single-Chip Embedded Systems, Test and Measurement Equipment.
Industrial Automation and Control
The A3P600-2FG256I fits industrial automation because its -40C to +85C industrial rating tolerates unconditioned factory enclosures, and its flash fabric is live at power-up, so I/O pins reach defined states instantly with no configuration delay - important for machines that must resume safely after power cycles. The 177 user I/Os, grouped into 4 VCCIBx banks, let one device bridge mixed-voltage sensor buses, encoder interfaces, and actuator drivers, while the -2 speed grade supports deterministic sequencing and protocol bridging at the modest logic density (~7K LEs) typical of control cards. Because configuration is non-volatile, no external flash is exposed to vibration or corruption, improving field MTBF. Estimated power is dominated by 1.5V core static current plus I/O switching, so bank-by-bank VCCIBx assignment should follow the actual board voltage map.
Recommended
Communications Line Cards and Bridging
In communications equipment, the A3P600-2FG256I serves as glue logic, backplane interface bridging, and control-plane fabric on line cards where a ~7K-LE FPGA with 177 I/Os is sufficient and cost matters. The -2 speed grade provides the timing headroom needed for parallel bus translation and synchronization logic between PHY devices and the card controller, while banked VCCIBx supplies allow the same chip to talk to legacy 3.3V/2.5V devices and newer 1.8V logic simultaneously - a common requirement in mixed-generation backplanes. ProASIC3 flash configuration removes the boot-flash availability risk associated with SRAM FPGAs in long-life telecom deployments, and the device is reprogrammable in-system for firmware field upgrades. Designers should validate timing closure in Microchip Libero SoC at the -2 grade across the -40C to +85C corner before release.
Recommended
Medical Instrumentation Control Logic
Medical diagnostic and monitoring instruments benefit from the A3P600-2FG256I's deterministic, instant-on behavior: flash configuration means sensor front-end enables and safe default I/O states are active the moment power is applied, with no configuration window in which outputs float. The industrial -40C to +85C rating exceeds typical clinical ambient requirements with margin, and the single-chip design reduces component count on boards that must fit compact handheld or benchtop enclosures. The 177 I/Os cover ADC/DAC control, motorized stage drivers, and front-panel interfaces, while the VersaTile fabric packs the ~7K LEs needed for sequencing and data-path formatting. Reprogrammability supports regulatory-driven feature updates without board respins; designers should document the flash programming flow in the device history file for audit traceability.
Recommended
Aerospace and Defense Subsystems
The A3P600-2FG256I is used in defense and aerospace ground, avionics-adjacent, and secure subsystems where single-chip, non-volatile configuration is a reliability and anti-tamper advantage: the bitstream resides in on-chip flash, eliminating the external configuration device that would otherwise expose the design image and add a failure point. Instant-on I/O states simplify power-sequencing interlocks in mission equipment, and the -40C to +85C industrial grade suits ruggedized ground platforms. The ~7K-LE VersaTile fabric implements interfaces, bus formatting, and sequencing logic; for higher-complexity or radiation-tolerant requirements, Microchip's RTAX-series antifuse FPGAs in CQ352 packages extend the same tool flow. Designers should verify the applicable programmatic qualification level (industrial vs automotive ProASIC3 datasheet DS50003485) before flight usage.
Recommended
Secure Single-Chip Embedded Systems
Applications requiring secure, self-contained logic - access-control units, encryption helper blocks, and licensing managers - fit the A3P600-2FG256I because the flash bitstream is stored on-chip, removing the external configuration read-out path that attackers exploit on SRAM FPGA systems. Live-at-power-up operation means protection logic is enforcing rules before the host CPU finishes booting, closing cold-boot gaps. The 177 I/Os interface to sensors, relays, and host buses across mixed voltage banks, and the -2 speed grade supports real-time authentication routines within ~7K LEs. In-system reprogrammability allows key or policy updates in the field, while the absence of a boot flash removes the most commonly cloned component from the BOM. Designers should combine on-chip logic protection with board-level measures for defense-in-depth.
Recommended
Test and Measurement Equipment
Benchtop and modular test instruments use the A3P600-2FG256I as timing controllers, trigger engines, and interface logic. The -2 speed grade delivers the deterministic delays needed for trigger synchronization, while the VersaTile architecture packs counters, comparators, and bus formatters into the ~7K-LE budget typical of instrument control boards. Its 177 I/Os with banked VCCIBx supplies let one FPGA connect to mixed-voltage front ends and backplanes (PXI/VME-style) without level-shifters, saving board area. Non-volatile flash configuration makes instruments power up ready for calibration routines immediately, and field firmware updates are performed through JTAG programming without swapping devices. For channels requiring more block RAM for capture buffers, the A3PE600 family in PQG208 offers an upgrade path within the same Libero SoC toolchain.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-2FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-2FGG256I | A3P600-2FGG256 | A3P600-FG256I | A3P600-1FGG256I | A3P600-1FG256 |
|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 | -2 | -2 | Standard (slower than -2) | -1 | -1 |
| Temperature Range | -40C to +85C (I) | -40C to +85C (I) | Commercial | -40C to +85C (I) | -40C to +85C (I) | Commercial |
| Number of I/Os | 177 I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O | 177 I/O |
| Configuration Memory | 110592 bits (flash) | 110592 bits (flash) | 110592 bits (flash) | 110592 bits (flash) | 110592 bits (flash) | 110592 bits (flash) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lead-Free / Green Assembly | No (FG standard assembly) | Yes (FGG lead-free) | Yes (FGG lead-free) | No (FG standard) | Yes (FGG lead-free) | No (FG standard) |
| RoHS Compliance | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest standard speed grade in the A3P600 256-FBGA family (vs A3P600-1FGG256I)
- Industrial -40C to +85C rating at top speed grade (vs A3P600-2FGG256)
- Lower unit cost than lead-free FGG variants (vs A3P600-2FGG256I)
- Single-chip non-volatile flash configuration (vs Cross-brand SRAM FPGAs (Xilinx/Intel Altera))
Design Notes
The 256-FBGA (FG256) footprint for ProASIC3 uses standard ball lands; design land diameter per IPC-style nominal ball diameter minus reduction, but always copy the exact land pattern from the Microchip ProASIC3 datasheet package table. Route the four VCCIBx bank supplies separately so each I/O bank can run its own voltage standard - do not tie VCCIB banks together unless all banks share one standard. Place 0.1uF decoupling within 3 mm of each VCC/VCCIBx ball pair and add bulk 10uF per rail near the device.
Estimated: the A3P600 core runs at 1.5 V; total power is dominated by static core current plus I/O switching, which varies heavily with toggle rate and I/O loading. Use Microchip's SmartPower design tools in Libero SoC with your actual netlist to estimate worst-case current before sizing the 1.5 V regulator - do not size from another A3P design's measurement. Allow margin on VCCIBx supplies for the highest I/O standard used per bank (e.g., 3.3 V banks draw more transient current when driving many loads).
Two frequent mistakes on A3P600-2FG256I designs: (1) assuming the -2 speed grade is timing-equivalent to the -1 grade when reusing a design from another A3P variant - always re-run Libero SoC timing analysis at -2 across -40C to +85C corners; (2) mixing incompatible I/O voltage standards in one VCCIBx bank, which the architecture forbids because each of the four banks has a dedicated supply rail. Also remember the device is live at power-up - define safe default I/O states in the design rather than relying on configuration delay to mask start-up glitches.
For the 256-FBGA, prefer via-in-pad or short dog-bone escapes with microvias on dense boards; keep JTAG (TDI/TDO/TMS/TCK) traces short and series-terminated at the source to avoid boundary-chain failures during production programming. Because configuration is internal flash, there is no configuration bus to protect, but the JTAG port remains the programming/debug entry point - consider a pull-down on TMS and controlled power sequencing of VCC relative to VCCIBx per the ProASIC3 power-up guidelines in the family datasheet.
Compliance Information
FG vs FGG suffix distinction implies standard vs lead-free/green assembly respectively; RoHS/REACH declarations must be confirmed via Microchip's official environmental documentation for the exact ordering code. Microchip also offers an Automotive ProASIC3 variant (datasheet DS50003485) for AEC-qualified builds; the standard A3P600-2FG256I ordering code should not be assumed AEC-Q100 qualified.
