AGFB014R24A2E2V - Agilex 7 FPGA, 1.44M LE, 10nm | Altera
MPN: AGFB014R24A2E2V ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
AGFB014R24A2E2V Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be configured by the end user after manufacturing. Within the programmable-logic hierarchy, FPGAs sit above CPLDs in density and capability, and the Agilex 7 family represents Intel/Altera's flagship line of high-performance FPGAs, positioned above Agilex 5 and Stratix-class mid-range devices for data center, networking, and signal processing workloads.
Key features include the 1,437,240 logic cell count organized into approximately 48,720 CLBs, 768 user inputs and 768 outputs, and 10nm FinFET process technology that delivers high logic density with improved power efficiency compared to the prior 14nm generation. The E2 speed grade balances performance and power, and the core supply operates at 0.9V per distributor data.
Technically, the Agilex 7 F-Series fabric leverages second-generation Intel EMIB and advanced die-stacking packaging concepts to connect the 10nm core fabric with high-speed transceiver tiles, providing very high aggregate bandwidth for Ethernet, PCIe-class and optical-fron GPLD workloads; exact transceiver counts and data rates for this OPN are given in the manufacturer datasheet.
Typical applications include data center acceleration, 5G and wireless baseband, high-bandwidth networking and switching, broadcast video processing, and defense/aerospace radar and electronic-warfare signal processing, where over one million logic elements and high-speed serial bandwidth are required.
A key design consideration: Agilex 7 F-Series devices require a rigorous multi-rail power sequencing design and dedicated Intel Enpirion-class power solutions; always validate the power tree against the manufacturer power specs before layout.
This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for AGFB014R24A2E2V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
AGFB014R24B2E2V
✅ Drop-In📋 Reference alternative (not in catalog)
AGFB014R24A2E1V
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AGFB014R24A2E3V
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AGFB014R24A2E4V
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AGFB014R24B2E1V
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
AGFB014R24A2E2V Maximum Ratings & Electrical Characteristics
| Family | Agilex 7 FPGA F-Series 014 (R24A) |
| Logic Cells | 1,437,240 |
| CLBs / Logic Array Blocks | 48,720 |
| Process Technology | Intel 10nm FinFET |
| Core Supply Voltage | 0.9 V |
| Speed Grade | E2 |
| Total Inputs/Outputs | 768 inputs / 768 outputs |
| Total Terminals | 2,486 |
| Device Type | FPGA (fabric-only, non-SoC variant per verified data) |
| Operating Temperature | 0C to 100C |
| Mounting Type | Surface Mount |
AGFB014R24A2E2V standard Pin Configuration Guide
Pin configuration for AGFB014R24A2E2V (standard package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for AGFB014R24A2E2V.
Refer to the datasheet for full pin configuration.
Typical Applications
AGFB014R24A2E2V is suitable for 6 applications: Data Center Acceleration, 5G Wireless Baseband, High-Bandwidth Networking and Switching, Broadcast Video Processing, Defense and Aerospace Signal Processing, Test and Measurement Instrumentation.
Data Center Acceleration
The AGFB014R24A2E2V fits data center acceleration because its 1,437,240 logic cells on Intel 10nm FinFET supply the parallel compute capacity needed for inference, compression, and search workloads while high-speed transceiver tiles provide the serial bandwidth for host and network connectivity. In a typical server card, the fabric implements fixed-function kernels plus DMA and PCIe-class host interface logic, offloading the CPU. The 10nm process improves perf-per-watt versus the prior 14nm generation, reducing TCO in scale-out deployments.
Recommended
5G Wireless Baseband
For 5G massive-MIMO radio units and baseband units, the AGFB014R24A2E2V provides over one million logic elements to implement beamforming, Layer 1 acceleration, and fronthaul (eCPRI) pipelines concurrently. The Agilex 7 F-Series transceivers deliver the deterministic low-latency serial links that fronthaul timing requires, and the E2 speed grade offers a practical balance of timing closure headroom and power. The 0.9V core supply keeps the power budget compatible with outdoor unit thermal constraints when paired with proper heatsinking.
Recommended
High-Bandwidth Networking and Switching
Networking equipment benefits from the AGFB014R24A2E2V because packet parsing, classification, queuing, and traffic management map efficiently onto the 1.4M logic cell fabric, while Agilex 7 F-Series transceivers provide high aggregate bandwidth for 100G/400G-class Ethernet line cards. The 768 user I/O allow wide parallel interfaces to PHY and memory subsystems. Designers should validate the transceiver count and data rates for this specific OPN against the manufacturer datasheet when partitioning MAC and PCS layers.
Recommended
Broadcast Video Processing
The AGFB014R24A2E2V suits broadcast and professional AV because 4K/8K video codecs, frame buffers, and SDI/IP gateway pipelines require both logic density and high-bandwidth serial I/O that the Agilex 7 F-Series 014 provides. The 10nm fabric supports multiple concurrent 4K encode/decode pipelines, and the transceivers terminate SMPTE ST 2112-class IP streams deterministically. The 0C to 100C operating range accommodates rack equipment ambient conditions with conventional forced-air cooling.
Recommended
Defense and Aerospace Signal Processing
Radar, electronic warfare, and SIGINT systems use the AGFB014R24A2E2V to implement wideband channelizers, FFT engines, and adaptive filtering at sample rates that saturate lower-density devices. The 1,437,240 logic cells and 768 I/O support multi-channel ADC/DAC front ends, and Agilex 7 transceivers move raw sample data between boards over high-speed serial links. The E2 speed grade with 10nm fabric delivers high throughput per watt, critical for conduction-cooled embedded platforms.
Recommended
Test and Measurement Instrumentation
Protocol analyzers, arbitrary waveform generators, and logic analysis platforms rely on the AGFB014R24A2E2V for real-time data capture and stimulus generation, using the 768 user I/O for wide parallel probes and the high-speed transceivers for serial protocol analysis. The 1.4M logic cell fabric sustains deep trigger engines and timestamping logic entirely in hardware, achieving deterministic capture that software-based instruments cannot match. The 0C to 100C range suits benchtop and lab environments.
Recommended
Recommended Products Summary
Engineering reference data for AGFB014R24A2E2V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | AGFB014R24B2E2V | AGFB014R24A2E1V | AGFB014R24A2E3V | AGFB014R24A2E4V |
|---|---|---|---|---|---|
| Package | R24A (FBGA, surface mount) | R24B (FBGA) - same footprint | R24A (FBGA) - same | R24A (FBGA) - same | R24A (FBGA) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Cells | 1,437,240 | 1.4M logic elements (same platform) | 1,437,240 | 1,437,240 | 1,437,240 |
| Hard Processor System | No (fabric-focused variant per verified data) | Quad ARM Cortex-A53 up to 1.4GHz | No | No | No |
| Speed Grade | E2 | E2 | E1 (slower) | E3 (faster) | E4 (fastest) |
| Process Technology | Intel 10nm FinFET | Intel 10nm FinFET | Intel 10nm FinFET | Intel 10nm FinFET | Intel 10nm FinFET |
| Core Supply Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | 0C to 100C | 0C to 100C | 0C to 100C | 0C to 100C | 0C to 100C |
Key Differentiators
- Fabric-focused variant without hard processor overhead (vs AGFB014R24B2E2V)
- 10nm FinFET process advantage (vs AGFB014R24A2E1V)
- Cost-effective performance tier (vs AGFB014R24A2E3V / AGFB014R24A2E4V)
- High I/O availability (vs AGFB014R24B2E2V)
Design Notes
The AGFB014R24A2E2V requires a multi-rail power design with a 0.9V core rail plus separate rails for I/O banks, transceivers, and configuration. Use the Intel FPGA Power Analyzer in Quartus Prime with a representative post-fit design to estimate per-rail currents, then apply 30-50% margin in the DC-DC selection. Respect the manufacturer-recommended power sequencing order between rails; violating sequence can latch up the 10nm fabric or damage the transceiver tiles. Intel's Enpirion power solutions and Agilex 7 power reference designs should be the starting point.
Estimated: a mid-utilization Agilex 7 F-Series design can dissipate tens of watts across the R24A FBGA; at 30W and a target 85C junction in 45C ambient, the total thermal resistance from junction to ambient must be under about 1.3 C/W, which is achievable only with a heatsink plus airflow or a cold plate. Generate the actual TDP estimate with the Intel FPGA Power Analyzer for your utilization profile, then size the heatsink, TIM, and airflow so worst-case junction temperature stays below the 100C operating limit.
The R24 FBGA is a large fine-pitch ball grid array with 2,486 terminals; plan the stackup early with sufficient signal layers and dedicated power/ground planes for transceiver impedance control. Fan out with via-in-pad (filled and capped) for the densest BGA regions, and follow the Altera pinout and trace-impedance guidelines in the Agilex 7 pin connection guidelines for transceiver differential pairs and configuration pins. Verify DDR/memory interfaces against Intel's memory controller layout rules before routing.
Do not assume the R24A (FPGA) and R24B (SoC) variants are interchangeable in software: the R24B includes the quad ARM Cortex-A53 hard processor system requiring SoC Embedded Design Suite flows, while the R24A does not, even though they share the package footprint. Also confirm the OPN speed grade (E1-E4) matches your Quartus timing constraints; migrating speed grades is pin-compatible but requires full re-timing of the design. Always re-verify I/O bank voltage assignments after any OPN change.
Compliance Information
Compliance details (RoHS/REACH/lead-free) were not stated in the verified web data; confirm on the Altera OPN specification page which lists trade compliance and material attributes per ordering part number.
