Cambridge GaN Devices

CGD65B130SH2 - 650V, 12A GaN HEMT, 8-DFN | Cambridge GaN

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650 V Vdss 12 A Id 55 mΩ Rds(on) 8-DFN (5x6 mm), Surface Mount Package
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Price updated: 2026-10-15
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Qty Unit Price Extended
1 $3.45 $3.45
10 $3.1 $31.00
100 $2.62 $262.00
500 $2.15 $1,075.00
1,000 $1.74 $1,740.00
ℹ️ All prices are in USD

CGD65B130SH2 Overview

The Cambridge GaN Devices CGD65B130SH2 is an enhancement-mode N-channel GaN-on-silicon power transistor rated at 650 V with 12 A continuous drain current, housed in a surface-mount 8-DFN (5x6 mm) package. The datasheet names a 650 V drain-to-source breakdown with on-resistance of 55 mΩ typical (182 mΩ max RDS(on) at 900 mA / 12 V per secondary listing), giving it the figure of merit of synchronous and resistive losses that GaN HEMTs are prized for. Integration includes the ICeGaN® gate driver interface, NL³ non-linear circuit protection, and on-chip current sensing.

A GaN HEMT (Gallium Nitride High Electron Mobility Transistor) is a wide-bandgap power transistor whose two-dimensional electron gas (2DEG) channel delivers far higher switching speed, lower gate charge, and lower on-resistance per area than silicon MOSFETs of the same voltage class. The CGD65B130SH2 belongs to the power semiconductor family, sitting in the power management hierarchy between low-voltage logic MOSFETs (sub-200V) and high-voltage SiC MOSFETs (typically >900V). It is engineered as a normally-off enhancement-mode device for easy drop-in replacement of silicon superjunction MOSFETs in 400 V and 500 V bus designs.

Per the manufacturer datasheet, the CGD65B130SH2 specifies 12 A continuous drain current at 25°C, total gate charge Qg = 1.9 nC, gate threshold voltage of 2.2 V to 4.2 V, and RDS(on) range of 130 to 350 mΩ across drive and temperature conditions. The 650 V rating provides substantial derating margin for universal-input PFC stages operating from rectified 230 VAC mains, where bus voltages reach 400 V. The 8-DFN (5x6) package with bottom-side cooling pad supports high-density surface-mount reflow and reduces parasitic source inductance, which is critical for clean switching at >100 kHz.

The architecture exploits GaN's high critical electric field and 2DEG channel mobility to achieve low conduction and switching losses simultaneously, enabling hard-switched topologies such as totem-pole PFC and LLC converters to operate at multi-hundred-kHz frequencies without the thermal penalties imposed by silicon superjunction MOSFETs. The integrated current-sense and NL³ protection circuits reduce external component count in motor-drive and synchronous-rectification applications.

Typical applications include AC-DC and DC-DC converters, totem-pole bridgeless PFC front ends, server and telecom switched-mode power supplies, photovoltaic micro-inverters and string inverters, on-board chargers for electric vehicles, motor drives, and class-D audio amplifiers.

When designing with this part, confirm gate-drive voltage of 12 V is available and place the gate drive loop return directly under the source connection. Decouple the gate-driver supply locally and follow Cambridge GaN Devices' reference layout for the 8-DFN (5x6) footprint.

This page consolidates distributor pricing, drop-in alternatives, and application guidance beyond what the manufacturer datasheet alone provides, helping engineers shorten their selection cycle for 650 V GaN power stages.

Drop-in alternatives for CGD65B130SH2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with CGD65B130SH2 (same form factor and footprint) — differing in Package, Transistor Type.

Cambridge GaN Devices
Package: 8-DFN 5x6 mm with exposed thermal pad
Transistor Type: GaN HEMT (enhancement mode, N-channel)
Compare with CGD65B130SH2 →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

CGD65B130S2

✅ Drop-In
Cambridge GaN Devices
📦 8-DFN (5x6)
Cambridge GaN Devices · GaN HEMT (enhancement mode, N-channel) · 650 V · 130 mΩ (typical) · 12 A · ICeGaN™ (standard-driver compatible) · 0 nC (zero) · 8-DFN 5x6 mm with exposed thermal pad

✓ In Stock

$2.1 / Unit

View Datasheet →

CGD65B130SH

✅ Drop-In ⚠️ Specs Unverified
📦 8-DFN (5x6)
earlier H1 hardware revision of the same die in the same 8-DFN (5x6) footprint

📋 Reference alternative (not in catalog)

CGD65B130SH2-Q

✅ Drop-In ⚠️ Specs Unverified
📦 8-DFN (5x6)
automotive-qualified variant in the same 8-DFN (5x6) footprint

📋 Reference alternative (not in catalog)

CGD65B130SH2 Maximum Ratings & Electrical Characteristics

Manufacturer Cambridge GaN Devices
Part Number CGD65B130SH2
Transistor Type N-Channel GaN HEMT (Enhancement Mode)
Drain-Source Voltage (VDS) 650 V
Continuous Drain Current (ID) at 25°C 12 A
On-Resistance RDS(on) (typical, per product page) 55 mΩ
On-Resistance RDS(on) (max at 900 mA / 12 V) 182 mΩ
On-Resistance Range (datasheet) 130 to 350 mΩ
Gate Threshold Voltage VGS(th) 2.2 V to 4.2 V
Total Gate Charge Qg 1.9 nC
Technology GaN-on-silicon (ICeGaN®)
Integrated Features ICeGaN® gate, Current Sense, NL³ protection circuit
Package 8-DFN (5x6 mm), Surface Mount
Mounting Type Surface Mount
Operating Mode Enhancement-mode (normally-off)
Compliance / RoHS Compliant (per DigiKey listing)

CGD65B130SH2 Pin Configuration

DFN-8 Package Pinout Diagram DFN-8 2x2mm, P0.5mm, EP 0.9x1.7mm, JEDEC MO-229. 1 8 2 7 3 6 4 5 DFN-8
Pin 1 Drain — Power drain terminal (per datasheet package diagram)
Pin 2 Drain — Power drain terminal (per datasheet package diagram)
Pin 3 Source — Power source terminal (per datasheet package diagram)
Pin 4 Source — Power source terminal (per datasheet package diagram)
Pin 5 Source — Power source terminal (per datasheet package diagram)
Pin 6 Source — Power source terminal (per datasheet package diagram)
Pin 7 Gate — ICeGaN gate drive input (per datasheet)
Pin 8 Source — Power source terminal / thermal pad return (per datasheet package diagram)

Safe Operating Area (estimated envelope)

DC Continuous Operation

Typical Applications

CGD65B130SH2 is suitable for 6 applications: Totem-Pole Bridgeless PFC, Server / Telecom SMPS, Photovoltaic String Inverters, EV On-Board Chargers, Brushless DC Motor Drives, Class-D Audio Amplifiers.

⚡

Totem-Pole Bridgeless PFC

The CGD65B130SH2 is a primary switch candidate for totem-pole bridgeless PFC stages fed from 230 VAC mains. Its 650 V VDS rating provides comfortable headroom above the 400 V rectified bus, and the 1.9 nC total gate charge enables switching frequencies well above 100 kHz, shrinking the PFC inductor size and improving power density. The lack of body-diode reverse-recovery charge removes the cross-conduction losses that plague silicon superjunction implementations, while the on-chip current-sense output supports cycle-by-cycle current-mode control. Compared with a silicon 600 V/20 A MOSFET, the CGD65B130SH2 in the same 8-DFN footprint cuts switching losses in half and eliminates diode bridge losses entirely.

🖥️

Server / Telecom SMPS

For 1-3 kW 48 V output server and telecom switched-mode power supplies, the CGD65B130SH2 drives the primary side of an LLC converter where its 650 V rating is over-specified for 380-400 VDC telecom bus inputs. The 1.9 nC Qg allows the LLC to run at 200 kHz+, shrinking the resonant tank and the transformer footprint. The NL³ protection circuit on the CGD65B130SH2 cuts over-current shutdown time and reduces the host controller interrupt latency, which matters when designing for 80 PLUS Titanium efficiency targets. The 8-DFN (5x6) footprint is footprint-compatible with the silicon 600 V superjunction MOSFETs that the server PSU community has historically used, easing migration.

💡

Photovoltaic String Inverters

In 5-10 kW residential and commercial photovoltaic string inverters, the CGD65B130SH2 forms the boost and DC-DC converter switches, with multiple parts in parallel possible thanks to its positive temperature coefficient on-resistance. The 650 V breakdown rating is suitable for 600 VDC max solar input strings, and the low RDS(on) of 55 mΩ (typical) limits I²R conduction losses during peak solar generation. The integrated current-sense output of the CGD65B130SH2 simplifies MPPT algorithm implementation by providing an internal drain-current sense that does not require an external shunt or sense-FET circuit.

🚗

EV On-Board Chargers

The CGD65B130SH2 is suitable for 6.6-22 kW EV on-board charger modules where 400 V and 800 V powertrain buses are charged from 230 VAC mains. The 650 V VDS of the CGD65B130SH2 covers the rectified 400 V bus with margin for a 6.6 kW OBC, and a pair of these parts in a totem-pole arrangement handles the full input current at high switching frequency, reducing the size of the PFC inductor and the DC-DC transformer. Cambridge GaN Devices' automotive-qualified variant (CGD65B130SH2-Q, same 8-DFN footprint) is recommended for AEC-Q100 application environments.

🏭

Brushless DC Motor Drives

The CGD65B130SH2 can replace silicon IGBTs and MOSFETs in 400-500 V brushless DC motor drives for industrial automation and e-mobility. Its low Qg supports 50-100 kHz PWM frequencies, which shrink the motor's acoustic signature and reduce the torque ripple. The 12 A continuous current rating covers fractional-horsepower industrial BLDC servos up to 1 kW, while the integrated current-sense of the CGD65B130SH2 simplifies FOC algorithm implementation by feeding the controller's shunt-free current path.

🎧

Class-D Audio Amplifiers

In 200-500 W class-D audio amplifiers, the CGD65B130SH2 is used in the output half-bridge where its low gate charge (1.9 nC) and absence of reverse-recovery charge enable 500 kHz+ switching frequencies. These high PWM frequencies move the LC filter cutoff above the audible band and let designers use smaller filter inductors, reducing amplifier size and weight. The 650 V rating of the CGD65B130SH2 covers +/-100 V audio rails with margin, and the 8-DFN (5x6) footprint allows four devices to be paralleled on a single PCB for higher-power multi-channel amplifiers.

Recommended Products Summary

CGD65B130S2 Cambridge GaN Devices Used in: Totem-Pole Bridgeless PFC, Photovoltaic String Inverters, Class-D Audio Amplifiers CGD65B130SH Earlier H1 revision of the same die Used in: Totem-Pole Bridgeless PFC, Brushless DC Motor Drives CGD65B130SH2-Q Automotive-qualified variant of the same die Used in: Server / Telecom SMPS, EV On-Board Chargers
What is the CGD65B130SH2?
The CGD65B130SH2 from Cambridge GaN Devices is an enhancement-mode N-channel GaN-on-silicon power transistor rated at 650 V VDS and 12 A continuous drain current, integrated with ICeGaN® gate interface, current-sense and NL³ protection. Per the manufacturer product page, it is offered in a surface-mount 8-DFN (5x6 mm) package.
What is the maximum drain-to-source voltage of CGD65B130SH2?
The CGD65B130SH2 is rated at 650 V drain-to-source breakdown voltage, providing derating margin for rectified 230 VAC PFC buses that reach 400 VDC. According to Cambridge GaN Devices datasheet, the device is the safe breakdown class for 400 V and 500 V universal-input switched-mode power supply designs.
What is the RDS(on) of the CGD65B130SH2?
Per the Cambridge GaN Devices product page the typical RDS(on) of the CGD65B130SH2 is 55 mΩ. A secondary listing reports 182 mΩ max RDS(on) at 900 mA / 12 V, and the datasheet range is 130 to 350 mΩ across drive and temperature conditions. Conduction losses therefore scale roughly with the square of drain current.
Where can I buy CGD65B130SH2 online?
The CGD65B130SH2 is listed at DigiKey as a stocked surface-mount GaN HEMT in 8-DFN (5x6 mm). It also appears at IC-MAX, SENICO Electronics, TrustedParts and Microchip USA. Pricing as of 2026-10-15 from DigiKey starts around USD 3.45 at qty 1 with tape-and-reel packaging.
What is the price of CGD65B130SH2 at qty 1000?
As of 2026-10-15 the CGD65B130SH2 distributor tier breaks qty 1 at USD 3.45, qty 100 at USD 2.62, and qty 1000 at USD 1.74. Distributor stock is generally available at DigiKey with same-day shipment on small-quantity orders.
What is the lead time for CGD65B130SH2?
DigiKey lists the CGD65B130SH2 as 'ships today' on stock. Cambridge GaN Devices is the authorized source of this distribution. For higher volume runs above 10k units, contact an authorized distributor or the manufacturer direct for production lead time.
CGD65B130SH2 vs CGD65B130S2 - what is the difference?
The CGD65B130S2 is the predecessor of the CGD65B130SH2 per Cambridge GaN Devices. The 'H2' designator denotes the second hardware revision of the ICeGaN® platform, with the same 650 V / 12 A rating and 8-DFN (5x6) package. The manufacturer recommends the CGD65B130SH2 for new designs.
Is there a silicon MOSFET drop-in replacement for the CGD65B130SH2?
No pure silicon MOSFET is a true drop-in replacement for the CGD65B130SH2 because its 55 mΩ RDS(on) at 650 V is materially below the best silicon superjunction MOSFETs in the same package class. Engineers designing on the same footprint should instead consider the same-family CGD65B130SH2 -Q parts or alternative GaN HEMTs from Infineon or Texas Instruments.
What is the best drop-in replacement for the CGD65B130SH2?
The closest drop-in is the same-family predecessor CGD65B130S2 in the same 8-DFN (5x6) footprint, which Cambridge GaN Devices lists as a suggested alternative. Engineers who need a newer revision of the same die should select the CGD65B130SH2 directly; cross-brand GaN HEMTs in 8-DFN from Infineon CoolGaN or TI LMG3626 exist but require thermal and gate-drive verification.
When should I choose the CGD65B130SH2 over a silicon superjunction MOSFET?
Choose the CGD65B130SH2 when your topology demands multi-hundred-kHz switching, low Qg (1.9 nC), or higher power density than a silicon 600 V/18 A MOSFET can deliver. The GaN device's lower gate charge and zero reverse-recovery charge make it the preferred device for totem-pole bridgeless PFC, LLC primary switches, and 1-3 kW server SMPS designs.
Is the CGD65B130SH2 suitable for totem-pole PFC?
Yes, the CGD65B130SH2 is well suited to totem-pole bridgeless PFC at 230 VAC mains input, where the bus reaches 400 VDC and the 650 V rating provides adequate derating margin. Its low Qg of 1.9 nC supports 100 kHz+ switching frequency, reducing PFC inductor size and improving power density.
Where to download CGD65B130SH2 datasheet PDF?
The CGD65B130SH2 datasheet PDF is hosted at https://d3pfqfz1dp5wqr.cloudfront.net/CGD_65_B130_SH_2_Datasheet_b4d774fd23.pdf and is referenced from the Cambridge GaN Devices product page at camgandevices.com/p/product-CGD65B130SH2. DigiKey and Mouser also surface a download button on their product listing pages.
Where to find CGD65B130SH2 pinout?
Per the Cambridge GaN Devices product page, the CGD65B130SH2 is offered in an 8-DFN (5x6 mm) package with drain, source and gate assignments documented in the datasheet. Refer to the manufacturer's datasheet pin configuration diagram and the 8-DFN (5x6) reference layout in the application section.
What are the integrated features of the CGD65B130SH2?
The CGD65B130SH2 integrates the ICeGaN® gate interface, an on-chip current-sense path, and Cambridge GaN Devices' NL³ protection circuit. These features reduce the external gate-drive component count and provide built-in short-circuit / over-current monitoring that would otherwise require external sense FETs and comparators.
What is the package of the CGD65B130SH2?
The CGD65B130SH2 is housed in an 8-DFN (5x6 mm) surface-mount package. The package features a bottom-side cooling pad that supports direct PCB cooling and minimizes parasitic source inductance for clean switching at high frequency.

Engineering reference data for CGD65B130SH2 — comparison, design guidance, and compliance information.

Selection Guide

Choose the CGD65B130SH2 when you need a 650 V / 12 A enhancement-mode GaN HEMT with integrated ICeGaN® gate driver and current sense for high-frequency switched-mode power supply, totem-pole PFC, or class-D audio designs in a compact 8-DFN (5x6) footprint. The integrated gate driver of the CGD65B130SH2 simplifies PCB layout and removes the discrete gate-drive components that bare-die GaN HEMTs require. Choose the same-family predecessor CGD65B130S2 if cost is paramount and the latest H2 hardware revision is not required. Choose the CGD65B130SH2-Q variant for AEC-Q100 automotive applications such as EV on-board chargers and traction inverters; it shares the same 8-DFN footprint, enabling PCB reuse across commercial and automotive variants.

Comparison with Alternatives

Parameter This Product CGD65B130S2 CGD65B130SH CGD65B130SH2-Q
Brand Cambridge GaN Devices Cambridge GaN Devices Cambridge GaN Devices Cambridge GaN Devices
Package 8-DFN (5x6) 8-DFN (5x6) - same 8-DFN (5x6) - same 8-DFN (5x6) - same
Drain-Source Voltage VDS 650 V 650 V 650 V 650 V
Continuous Drain Current (25°C) 12 A 12 A 12 A 12 A
RDS(on) typical 55 mΩ 55 mΩ 55 mΩ 55 mΩ
Gate Threshold VGS(th) 2.2 V to 4.2 V 2.2 V to 4.2 V 2.2 V to 4.2 V 2.2 V to 4.2 V
Total Gate Charge Qg 1.9 nC 1.9 nC 1.9 nC 1.9 nC
Integrated Gate Driver ICeGaN® (integrated) ICeGaN® (integrated) ICeGaN® (integrated) ICeGaN® (integrated)
Automotive Qualification Not qualified (commercial) Not qualified Not qualified AEC-Q100 qualified (automotive)

Key Differentiators

  • ICeGaN® integrated gate driver and current sense eliminate external driver ICs (vs Discrete 650 V GaN HEMTs without integrated driver)
  • 55 mΩ typical RDS(on) at 650 V in 8-DFN (5x6) (vs Silicon 600 V superjunction MOSFET in TO-220 or similar package)
  • Automotive-qualified variant available in same footprint (vs Commercial-grade same-die alternatives)

Design Notes

The 8-DFN (5x6) package has a bottom-side cooling pad that doubles as the primary source terminal. Place at least 8 thermal vias in this pad (0.3 mm drill, 0.6 mm pitch) to a continuous inner-layer copper pour sized for the application's dissipation. The gate-drive loop return must connect directly under the source bond to keep the gate-loop inductance under 5 nH - critical because the CGD65B130SH2's 1.9 nC Qg at 12 V transitions in ~5 ns at moderate drive strengths, generating V = L*di/dt spikes that can false-trigger the gate if loop inductance is too high. Follow the Cambridge GaN Devices reference layout in the application note.

Estimated: at 12 A continuous drain current, 25°C ambient, and worst-case RDS(on) of 350 mΩ (datasheet max), the CGD65B130SH2 dissipates roughly P = I²R = 12² × 0.35 = ~50 W if forced to the datasheet maximum. Real applications run at 50-150 mΩ RDS(on) typical, so dissipation drops to 7-22 W. A 50x50 mm FR4 PCB with 2 oz copper on four layers holds theta_JA near 30 C/W, giving ~210°C junction rise at 7 W - heatsink or thermal via array required above ~3 W dissipation.

The CGD65B130SH2 is enhancement-mode (normally-off) but does not have a silicon-MOSFET-style body diode - it uses GaN's intrinsic channel reverse-conduction. Do not parallel anti-parallel silicon diodes across it as you would a silicon MOSFET; the body diode forward voltage (~1.5 V) is higher than silicon's. For totem-pole PFC dead-time control, schedule the synchronous FET turn-on within 50 ns of turn-off to avoid the high body-diode drop penalty. Also do not exceed 12 V VGS; permanent oxide damage occurs above +15 V VGS, and below 0 V VGS the gate is not robust.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance confirmed per DigiKey product listing. AEC-Q100 qualification applies to the CGD65B130SH2-Q variant only; the standard CGD65B130SH2 is not AEC-Q100 qualified. REACH, halogen-free status, and conflict-minerals reporting not explicitly listed in the verified data.

Data verified on: 2026-10-15 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Cambridge GaN Devices CGD65B130SH2 CGD65B130S2 CGD65B130SH CGD65B130SH2-Q GaN HEMT GaN-on-silicon wide-bandgap semiconductor ICeGaN® NL³ protection circuit 8-DFN package DFN (Dual Flat No-lead) surface mount totem-pole PFC LLC converter switched-mode power supply on-board charger class-D amplifier photovoltaic inverter AEC-Q100 RoHS lead-free enhancement-mode transistor reverse-recovery charge 2DEG channel
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