CSD17303Q5 - 30V N-Ch NexFET MOSFET 2.6mΞ© | TI
MPN: CSD17303Q5 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.09 | $2.09 |
| 10 | $1.88 | $18.80 |
| 100 | $1.67 | $167.00 |
| 500 | $1.46 | $730.00 |
| 1,000 | $1.25 | $1,250.00 |
Drop-in alternatives for CSD17303Q5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
CSD17301Q5
β Drop-Inπ Reference alternative (not in catalog)
CSD17306Q5A
β Drop-Inπ Reference alternative (not in catalog)
CSD17322Q5A
β Drop-Inπ Reference alternative (not in catalog)
CSD17579Q5A
β Drop-Inπ Reference alternative (not in catalog)
VBQA1302
β Drop-Inπ Reference alternative (not in catalog)
CSD17303Q5 Maximum Ratings & Electrical Characteristics
| Polarity | N-Channel |
| Vds Drain-Source Voltage | 30 V |
| Rds(on) Max | 2.6 mOhm |
| Continuous Drain Current | 32 A (Ta), 100 A (Tc) |
| Power Dissipation | 3.2 W (Ta) |
| Gate Drive Optimization | 5 V gate drive |
| Gate Charge Qg | [DATA_NEEDED: Qg typical value] |
| Vgs Gate-Source Voltage | [DATA_NEEDED: Vgs max] |
| Operating Temperature | -55C to +150C |
| Package | VSON-CLIP (DQH), 8 pins, 5 mm x 6 mm |
| Mounting Type | Surface Mount |
| Avalanche Rated | Yes |
| Technology | NexFET |
| Terminal Plating | Pb-free |
| RoHS Status | Compliant |
| Halogen Free | Yes |
CSD17303Q5 Pin Configuration
| Pin 1-3 | GATE β Gate terminal (multiple pins for low inductance) |
| Pin 4-5 | SOURCE β Source terminal / Kelvin connection |
| Pin 6-8 | SOURCE β Source terminal |
| Pin PAD | DRAIN β Exposed clip pad - drain terminal and thermal path |
Safe Operating Area (from TI datasheet Fig. curves)
Typical Applications
CSD17303Q5 is suitable for 6 applications: Notebook Point-of-Load Conversion, Synchronous Buck in Networking and Telecom, Computing Server Power Rails, High-Current DC-DC Module Design, Industrial Motor Drive Low-Side Switching, Battery-Powered High-Current Load Switching.
Notebook Point-of-Load Conversion
Notebook POL converters require MOSFETs that combine low on-resistance with low gate charge to maximize battery runtime. The CSD17303Q5's 2.6 mOhm Rds(on) minimizes conduction loss in high-current CPU and GPU rails, while its NexFET low Qgd reduces switching loss at typical 300 kHz to 1 MHz POL frequencies. Optimized for 5V gate drive, it interfaces directly with common buck controllers without needing a higher gate-driver rail. The 5x6 mm VSON-CLIP package with low thermal resistance fits dense notebook layouts where airflow is minimal.
Recommended
Synchronous Buck in Networking and Telecom
In 12V-input telecom and networking power trees, the CSD17303Q5 serves as the control FET in point-of-load synchronous buck stages. Its 30V Vds rating provides margin against 12V bus transients, and the ultra-low Qg reduces driver losses in high-density line cards with limited thermal budgets. Avalanche rating adds ruggedness against input transients and body-diane events during dead time. The -55C to +150C range supports telecom outdoor and extreme-temperature equipment per TI datasheet application guidance.
Recommended
Computing Server Power Rails
Server and workstation power stages push tens of amps through POL converters, making conduction loss dominated by Rds(on) the primary concern. The CSD17303Q5's 100A (Tc) current rating and clip-bonded package enable high continuous current with manageable temperature rise. Its low FOM (Rds(on) x Qg) directly improves the energy efficiency metrics that datacenter operators track. Multiphase designs parallel multiple MOSFETs; sharing the same Q5 footprint simplifies second-source qualification across family members.
Recommended
High-Current DC-DC Module Design
Power module designers use the CSD17303Q5 where a discrete 30V MOSFET with low thermal resistance is required. The VSON-CLIP package's exposed clip dramatically lowers junction-to-board thermal impedance compared to standard SON, allowing 3.2W dissipation at Ta without a heatsink. Combine with TI buck controllers or integrated drivers in compact power modules for industrial 12V buses. Its avalanche rating tolerates inductive kick from parasitic layout inductance, improving robustness in module prototypes.
Recommended
Industrial Motor Drive Low-Side Switching
For 12V or 24V industrial motor drives, the CSD17303Q5 can serve as a low-side switch or synchronous rectification element. The 30V rating covers 24V nominal buses with headroom for inductive flyback, and avalanche capability absorbs clamp energy during PWM switching. The 5V gate-drive optimization matches industrial logic-level gate drivers, while -55C to +150C operation suits factory-floor environments. Low Rds(on) of 2.6 mOhm minimizes self-heating in enclosed drives without forced airflow.
Recommended
Battery-Powered High-Current Load Switching
Battery systems with 3S-6S cell stacks (12-25V) need low-loss switching elements for protection, hot-swap, and load management. The CSD17303Q5's 2.6 mOhm Rds(on) keeps voltage drop and heat low at 30A+ loads, critical for battery runtime and thermal safety. Its 30V Vds rating withstands typical pack transients, and the small 5x6 mm footprint suits compact BMS boards. Pair with a gate driver or load switch for controlled slew rates limiting inrush current on capacitive loads.
Recommended
Recommended Products Summary
Engineering reference data for CSD17303Q5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | CSD17301Q5 | CSD17306Q5A | CSD17322Q5A | VBQA1302 |
|---|---|---|---|---|---|
| Package | VSON-CLIP (DQH) 5x6 mm, 8 pins | SON 5x6 mm - same | SON 5x6 mm - same | SON 5x6 mm - same | SON 5x6 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Will Semiconductor (VBsemi) |
| Vds | 30 V | 30 V | 30 V | 30 V | 30 V |
| Continuous Current | 32 A (Ta) | 33 A | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Rds(on) | 2.6 mOhm | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Gate Drive | Optimized 5 V | Optimized 5 V | Optimized 5 V | Optimized 5 V | [DATA_NEEDED] |
| Avalanche Rated | Yes | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Price (1 pc) | $2.09 (as of 2026-08-29) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lowest Rds(on) in the 30V Q5 family at 2.6 mOhm (vs CSD17301Q5)
- Optimized for 5V gate drive with ultra-low Qg/Qgd (vs CSD17306Q5A)
- Clip-bond package lowers thermal resistance (vs VBQA1302)
Design Notes
The VSON-CLIP (DQH) package achieves its low thermal resistance through a clip-bonded exposed pad serving as the drain. Pour maximum copper on the drain-side pad and use an array of thermal vias (6-8 mil drill, filled or tented) to spread heat into inner layers. At 3.2W Ta dissipation, verify junction temperature at worst-case ambient of 85C in notebook and telecom enclosures with no airflow.
Keep the gate drive loop short and route the gate trace away from the drain copper to reduce Miller coupling. Use multiple source pins with a Kelvin source connection for the gate return to minimize common-source inductance, which degrades switching speed and can cause spurious turn-on in synchronous buck topologies.
The 2.6 mOhm Rds(on) is specified at the optimized 5V gate drive. Driving below 4.5V significantly increases Rds(on) and conduction loss - check the Rds(on) vs Vgs curve in the TI datasheet for your actual drive level. Also derate current rating above 25C ambient following the datasheet normalized thermal impedance curves.
Compliance Information
Pb-free terminal plating, RoHS compliant, halogen free per TI datasheet and FindIC comparison data. REACH and conflict mineral status not stated in provided data.
