DSPIC33EP128GS705-I/PT - 16-Bit 70 MIPS DSC 128KB | Microchip
MPN: DSPIC33EP128GS705-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.21 | $62.10 |
| 100 | $5.52 | $552.00 |
| 500 | $4.97 | $2,485.00 |
| 1,000 | $4.48 | $4,480.00 |
DSPIC33EP128GS705-I/PT Overview
A Digital Signal Controller combines the compute architecture of a microcontroller with DSP-grade math capability in a single core. Within the power-management hierarchy, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes C code for housekeeping tasks while simultaneously running fast multiply-accumulate loops for control algorithms such as proportional-integral (PI) loops and space-vector modulation in switch-mode power conversion.
Key features include the 70 MIPS 16-bit pipeline core, 128KB dual-partition Flash supporting live field firmware updates, and an SMPS-optimized peripheral set. Microchip classifies the dsPIC33EPXXGS70X family as a Digital Power Conversion DSC, with peripherals specifically designed for multi-loop digital switch-mode power supplies (SMPS). The part is also listed by DigiKey as Functional Safety (FuSa) supported.
Technically, the dual-partition Flash architecture allows one code bank to execute while the other is erased and reprogrammed, which is essential for power products that require uninterrupted operation during firmware upgrades. The high instruction rate enables closure of fast control loops at switching frequencies common in AC-DC and DC-DC converters, reducing external analog circuitry.
Typical applications include AC to DC converters, power factor correction (PFC) stages, DC-DC converters, and other digital power-conversion systems such as solar inverters and server power supplies. Microchip's Interleaved PFC reference design demonstrates the family producing a high-voltage DC output up to 350W from a universal input range.
Design consideration: budget decoupling capacitance and a solid ground plane under the TQFP, and confirm 3.3V supply sequencing; SMPS-familiarity peripherals assume the board delivers clean analog reference rails for best control-loop accuracy.
This page synthesizes distributor inventory data, drop-in alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128GS705-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GS705-I/PT (same form factor and footprint) — differing in Core Architecture, Package, Functional Safety, SRAM, Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS705-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GS705-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GS705T-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GS705-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Flash Memory | 128KB (43K x 24), dual partition |
| RAM | 8KB |
| Supply Voltage | 3.3 V |
| Package | 48-TQFP (7x7x1.0 mm) |
| Mounting Type | Surface Mount |
| Temperature Grade | I (Industrial) |
| Product Family | dsPIC33EPXXGS70X SMPS / Digital Power Conversion |
| Functional Safety | FuSa supported |
| Flash Partitioning | Dual Partition Flash |
| Target Applications | SMPS, AC-DC converters, digital power |
DSPIC33EP128GS705-I/PT 48-tqfp (7x7x1.0 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP128GS705-I/PT (48-tqfp (7x7x1.0 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GS705-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GS705-I/PT is suitable for 6 applications: AC to DC Converter Control, Interleaved Power Factor Correction (PFC), DC-DC Converter Digital Control, Solar Micro-Inverter and Energy Conversion, Industrial Embedded Control Systems, Digital Battery Chargers.
AC to DC Converter Control
The DSPIC33EP128GS705-I/PT is purpose-built for digitally controlled AC-DC converters, per Microchip's SMPS DSC family description. Its 70 MIPS 16-bit DSP core executes multi-loop voltage and current control inside switching periods, while the SMPS-optimized peripheral set generates high-resolution PWM for primary-side switching. Dual-partition Flash allows firmware updates without dropping output power - essential for always-on power supplies. In a typical topology the DSC samples input/output voltages and currents, runs PI compensation, and drives PWM gates, replacing multiple analog control ICs and improving transient response and efficiency across universal input ranges.
Recommended
Interleaved Power Factor Correction (PFC)
Microchip's Interleaved PFC reference design is built on the dsPIC33EP GS family, producing up to 350W of high-voltage DC output from a universal input voltage range. The DSPIC33EP128GS705-I/PT closes the fast current loop and slower voltage loop needed for interleaved PFC, using its DSP multiply-accumulate throughput for per-phase current balancing at 70 MIPS. Interleaving with digital control reduces input current ripple and EMI filter size compared to single-phase solutions. The dual-partition Flash permits field firmware tuning of PFC gains, enabling OEMs to optimize efficiency across product variants with one PCB.
Recommended
DC-DC Converter Digital Control
For telecom rectifiers, server VRMs, and industrial DC-DC bricks, the DSPIC33EP128GS705-I/PT provides deterministic control-loop execution with its 70 MIPS core and 8KB on-chip RAM for state variables and compensation tables. High-resolution PWM peripherals adjust duty cycles with fine granularity, supporting tight output regulation at high switching frequency. Digital control enables telemetry, adaptive tuning, and fault logging that analog controllers cannot offer. The 3.3V industrial-grade device in a compact 48-TQFP (7x7 mm) footprint fits densely populated power boards while FuSa support eases safety-relevant power system qualification.
Recommended
Solar Micro-Inverter and Energy Conversion
Grid-tied solar conversion requires MPPT algorithms, synchronous grid-current waveform generation, and safety monitoring simultaneously - a workload the DSPIC33EP128GS705-I/PT handles with its 70 MIPS DSP core and SMPS peripheral suite. The DSC samples PV voltage/current, tracks the maximum power point, and synthesizes PWM drive for the power stage. Dual-partition Flash enables field updates as grid codes evolve, a major advantage for deployed inverters with long service lives. The industrial temperature grade and 3.3V operation suit outdoor-rated enclosure electronics where the controller shares the board with sensing and gate-driver circuitry.
Recommended
Industrial Embedded Control Systems
Beyond power conversion, the DSPIC33EP128GS705-I/PT serves as a general 16-bit industrial controller where DSP math benefits sensor processing: motor control, digital filtering, and closed-loop actuators. The 128KB Flash accommodates substantial C applications with communication stacks, while the 70 MIPS core outpaces conventional 16-bit MCUs. The 48-pin TQFP offers a practical I/O count for industrial boards, and the FuSa designation supports functional-safety-oriented designs. Designers using PIC16 parts that hit compute limits can move to this DSC while keeping Microchip MPLAB X toolchain and XC16 compiler investment intact.
Recommended
Digital Battery Chargers
Smart multi-stage battery chargers benefit from the DSPIC33EP128GS705-I/PT's ability to run CC/CV charging curves, temperature derating, and fault protection in firmware. Its SMPS peripherals generate the PWM for the charging power stage while the DSP core executes coulomb counting and charge-state algorithms at 70 MIPS. Dual-partition Flash allows charging profiles to be updated in the field for new battery chemistries - valuable for product families sharing one hardware platform. The 48-TQFP 7x7 mm package balances I/O availability for UI, sensing, and communication with a footprint friendly to cost-sensitive consumer and industrial charger boards.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GS705-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS705-I/PT | DSPIC33EP32GS705-I/PT | DSPIC33EP128GS705T-I/PT |
|---|---|---|---|---|
| Package | 48-TQFP (7x7x1.0 mm) | 48-TQFP (7x7 mm) - same | 48-TQFP (7x7 mm) - same | 48-TQFP (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128KB (43K x 24) | 64KB | 32KB | 128KB |
| Flash Partitioning | Dual Partition | Dual Partition | Dual Partition | Dual Partition |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Packaging Format | Tray | Tray | Tray | Tape & Reel |
| Functional Safety | FuSa supported | FuSa supported | FuSa supported | FuSa supported |
Key Differentiators
- Largest Flash in the pin-compatible GS705 family (vs DSPIC33EP64GS705-I/PT)
- SMPS-optimized digital power peripherals (vs DSPIC33EP128GM306-E/PT (general dsPIC33EP))
- Dual-partition Flash for live field updates (vs DSPIC33EP32GS705-I/PT)
Design Notes
Provide a continuous ground plane beneath the 48-TQFP and place 100 nF ceramic decoupling capacitors within 2-3 mm of each VDD pin pair, plus bulk capacitance (4.7-10 uF) near the supply entry. In digital power applications the DSC's ADC references are noise-sensitive: route analog feedback traces away from PWM gate-drive lines and use a dedicated analog ground return to the plane. Microchip's SMPS reference designs demonstrate recommended layout practice for the GS family.
The device operates from a 3.3V rail; sequence VDD cleanly and confirm the exact absolute maximum ratings in the Microchip datasheet before finalizing the power design. In SMPS boards the controller often shares the rail with gate drivers - isolate the DSC supply with an LC or LDO filter to prevent gate-drive switching transients from corrupting ADC samples used in the control loops.
Take advantage of dual-partition Flash deliberately: plan the linker placement so the live partition and update partition map predictably, and test the update path on hardware early - an untested field-upgrade path is the most common failure mode in digital power products. Also confirm firmware fits before substituting the 64KB or 32KB Flash variants, since those drop-in siblings cannot hold a 128KB image.
Compliance Information
Compliance status not stated in provided web data; verify RoHS/REACH certificates on the Microchip product page or distributor compliance data before BOM approval.
