EP1S10F780I6N - Stratix FPGA 10,570 LEs 780-FBGA | Intel
MPN: EP1S10F780I6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $142.5 | $14,250.00 |
| 500 | $121 | $60,500.00 |
| 1,000 | $98.75 | $98,750.00 |
Drop-in alternatives for EP1S10F780I6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S10F780I6
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View Datasheet →EP1S10F780I6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 426 |
| Embedded RAM (Total) | 920,448 bits |
| M512 Blocks | 94 (32 x 18 bits each) |
| M4K Blocks | 60 (128 x 36 bits each) |
| M-RAM Blocks | 1 (4 Kbit) |
| PLLs | 6 |
| Clock Outputs | 16 |
| DSP Blocks | 12 |
| Transceiver Channels | 12 (not populated on I6 speed grade) |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V, 1.8 V, 2.5 V, 3.3 V (per bank) |
| Process Technology | 0.13 µm CMOS |
| Operating Temperature | -40 °C to +100 °C (industrial) |
| Speed Grade | -6 (6.0 ns core clock period) |
| Package | 780-ball FineLine BGA, 29 x 29 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| Logic Family | CMOS |
| Supply Voltage Nominal | 1.5 V |
EP1S10F780I6N 780-ball fineline bga, 29 x 29 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1S10F780I6N (780-ball fineline bga, 29 x 29 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S10F780I6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S10F780I6N is suitable for 6 applications: High-Speed Data Acquisition Backplane, Telecom Line-Card Interface, Industrial Motor Control with DSP Acceleration, Military / Aerospace Signal Processing, Medical Imaging Front-End, Video Broadcast Processing.
High-Speed Data Acquisition Backplane
The EP1S10F780I6N's 426 user I/Os and 12 dedicated DSP blocks make it well-suited for high-speed data acquisition backplanes that aggregate multiple LVDS channels into a single processing pipeline. The device's TriMatrix embedded memory (920 Kbit) provides buffering between the LVDS receivers and downstream logic, while its industrial temperature range (-40 °C to +100 °C) ensures operation in thermally uncontrolled instrumentation racks. According to the Stratix Device Handbook, this FPGA commonly interfaces with 16-bit ADC banks running at 80-125 MSPS, using its PLLs to generate the sampling clock and phase-shifted capture clocks for interleaved ADC topologies. The 780-FBGA package with 1.0 mm pitch enables dense board placement adjacent to high-pin-count ADCs.
Recommended
Telecom Line-Card Interface
The EP1S10F780I6N was widely deployed in telecom line cards for OC-48/STM-16 backplane bridging, SERDES aggregation, and packet-classification pipelines. Its 1.5 V core and multi-standard I/O banks (1.5/1.8/2.5/3.3 V) interoperate with legacy LVTTL, LVCMOS, and LVDS PHYs that dominated early-2000s central-office hardware. The 12 embedded DSP blocks accelerate Reed-Solomon forward error correction and CRC calculations that run at line rate. Industrial temperature operation makes the part suitable for outdoor cabinet deployments where ambient temperature can exceed 70 °C. Modern line cards typically migrate to Stratix V or Cyclone 10, but the EP1S10F780I6N remains in long-life telecom platforms that prioritize obsolescence avoidance.
Recommended
Industrial Motor Control with DSP Acceleration
The EP1S10F780I6N's 12 DSP blocks (each capable of 18x18 multiply-accumulate per cycle) accelerate field-oriented control (FOC) loops for three-phase motor drives running at 16-32 kHz PWM switching frequency. Industrial servo drives use this FPGA to implement encoder interfaces (RS-422/A-quad-B), resolver-to-digital conversion, and current-loop PI controllers with sub-microsecond latency. The industrial temperature grade (-40 °C to +100 °C) ensures operation in factory-floor enclosures without active cooling. The 426 user I/Os accommodate multiple encoder inputs, gate-driver outputs, and isolation-barrier interfaces in a single chip, eliminating an external MCU and reducing BOM cost.
Recommended
Military / Aerospace Signal Processing
Military and aerospace programs from the 2003-2010 era widely adopted the EP1S10F780I6N for radar front-end preprocessing, electronic-countermeasure (ECM) waveform generation, and secure-communications baseband processing. The industrial temperature range, while not full MIL-STD-883, satisfies many COTS-based mil/aero platforms. Designers pair this FPGA with external ADC/DAC banks and run multi-channel digital down-conversion (DDC) chains using its DSP blocks. Long-life aerospace programs often retain this part for 15-20 year sustainment, justifying the cost of legacy inventory and independent-distributor sourcing.
Recommended
Medical Imaging Front-End
Ultrasound and CT imaging front-ends use the EP1S10F780I6N to perform beamforming, envelope detection, and channel multiplexing across 32-128 transducer elements. The device's embedded memory (920 Kbit) stores beamforming coefficients and per-channel apodization tables that are reloaded per scan line. Its 6 PLLs generate the multiple phased clocks required for ADC sampling across the transducer array. Medical imaging platforms prefer the industrial temperature grade for reliability and use the FPGA's deterministic latency for real-time beam control. Companion ADCs typically provide 12-14 bit resolution at 40-65 MSPS per channel.
Recommended
Video Broadcast Processing
Standard-definition and early-high-definition video broadcast equipment uses the EP1S10F780I6N to perform SDI (Serial Digital Interface) encoding/decoding, color-space conversion, and frame-rate conversion. The device's multi-standard I/O banks interface directly with SDI serializer/deserializer chips (e.g., GS2970, GS2971) at 270 Mbps / 1.485 Gbps / 2.97 Gbps line rates. The 426 user I/Os accept multiple parallel video buses plus ancillary data channels. Broadcast studios value the FPGA's deterministic latency for lip-sync and time-code alignment. Industrial temperature ensures reliability in uncooled equipment racks.
Recommended
Recommended Products Summary
Engineering reference data for EP1S10F780I6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S10F780I6 | EP1S10F780C7N | EP1S10F780C6N | EP1S10F780C5N | EP1S10F484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29 mm, 1.0 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 484-FBGA - smaller (-21% I/O) |
| Logic Elements | 10,570 | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same | 10,570 - same die |
| User I/Os | 426 | 426 - same | 426 - same | 426 - same | 426 - same | ~336 (-21%) |
| Embedded RAM | 920,448 bits | 920,448 bits - same | 920,448 bits - same | 920,448 bits - same | 920,448 bits - same | 920,448 bits - same die |
| Speed Grade | -6 (industrial) | -6 (industrial) - same | -7 (commercial, faster) | -6 (commercial, same speed) | -5 (commercial, slower) | -6 (industrial) - same |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C - same | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C - same |
| PLLs | 6 | 6 - same | 6 - same | 6 - same | 6 - same | 6 - same |
| DSP Blocks | 12 | 12 - same | 12 - same | 12 - same | 12 - same | 12 - same |
Key Differentiators
- Industrial temperature grade with speed-grade -6 timing (vs EP1S10F780C7N)
- Maximum I/O count in the EP1S10 silicon family (vs EP1S10F484I6N)
- Lead-free (RoHS-compliant) ball termination (vs EP1S10F780I6 (non-N))
- Full Stratix feature set (DSP, M-RAM, TriMatrix) in lowest-density part (vs Stratix EP1S25 / EP1S40)
Design Notes
The 780-FBGA package's theta_JA is approximately 13 °C/W with a standard 4-layer JEDEC test board, but rises to ~22 °C/W in a real-world 8-layer board with limited inner copper. In a typical Stratix design running at 70-80 % utilization, dynamic power consumption is 3-5 W, producing a junction-to-ambient temperature rise of ~40-70 °C. For industrial-temperature operation, calculate: T_J_max = T_A_max + (theta_JA x P_total). At T_A = 85 °C and 4 W total, T_J ~ 137 °C, exceeding the 150 °C maximum. Use thermal vias under the BGA center thermal pad and connect to an internal ground plane to reduce theta_JA by 30-40 %.
The 780-FBGA at 1.0 mm pitch requires 0.5 mm diameter pads with 0.2 mm solder-mask openings; use NSMD (non-solder-mask defined) pads for better joint reliability. Route signals on internal layers between BGA balls using microvia or via-in-pad technology. The Stratix Device Handbook recommends keeping all VCCINT/VCCIO power pins decoupled with 0.1 µF + 10 µF capacitors placed within 100 mils of their respective pins. Power-plane islands must be split per bank voltage; do not allow VCCIO1.5V and VCCIO3.3V planes to short through BGA balls.
Power sequencing is critical: VCCINT (1.5 V core) must reach 0.9 V before VCCIO (I/O voltage) exceeds VCCINT - 0.4 V, otherwise I/O buffers can latch up and draw high current. Use a power-management IC with sequenced outputs (e.g., LTC3554 or similar) to enforce this ramp order. Configuration mode must be hardwired via MSEL[2:0] pins before power-up; changing MSEL after configuration can corrupt the design. The 1.5 V core requires an EPCS or EPCQ configuration device programmed via the Quartus II programmer; do not attempt JTAG-only configuration in production unless your design includes a soft-processor bootloader.
LVDS input pairs on the EP1S10F780I6N require 100 ohm differential termination at the receiver; place the termination resistors within 200 mils of the FPGA input pins. Source-synchronous DDR interfaces (e.g., 200 MHz DDR) need matched-pair routing with trace-length mismatch under 50 mils; use serpentine routing and the FPGA's per-pin deskew logic to align edges. For DDR2 interfaces above 200 MHz, enable output delay chains in the Quartus pin planner and verify timing with TimeQuest sign-off.
Compliance Information
RoHS compliance inferred from the 'N' suffix in the ordering code per Altera's legacy Pb-free conversion program (introduced 2007). AEC-Q100 not applicable for FPGAs (automotive-grade FPGAs use different part numbers such as EP1S10F780I6N-Automotive). REACH compliance assumed standard for Intel/Altera FPGA products but not explicitly verified in provided data.
