EP1S25F1020I6 - Stratix 25K LE FPGA, 706 I/O, FC-FBGA-1020 | Altera
MPN: EP1S25F1020I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1752.77 | $1,752.77 |
| 10 | $1700 | $17,000.00 |
| 50 | $1620 | $81,000.00 |
| 100 | $1580 | $158,000.00 |
| 250 | $1530 | $382,500.00 |
Drop-in alternatives for EP1S25F1020I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S25F1020I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | Stratix I |
| Logic Elements (LEs) | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (RAM bits) | 1,944,576 bits (≈ 1.85 Mbits) |
| Maximum User I/O | 706 |
| Maximum Operating Frequency | 450 MHz (per datasheet reference) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| Configuration | Passive serial, fast passive parallel, JTAG, enhanced configuration device |
| On-chip PLL | Yes |
| DSP Blocks | Yes (Stratix DSP blocks) |
EP1S25F1020I6 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1S25F1020I6 (1020-ball fc-fbga (33 x 33 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F1020I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F1020I6 is suitable for 6 applications: Telecommunications Backplane Bridging, High-Speed Protocol Bridging (PCI Express, RapidIO), Video and Imaging Pipeline Processing, ASIC Prototyping and Emulation, Industrial Control and DSP, Test and Measurement Instrumentation.
Telecommunications Backplane Bridging
The EP1S25F1020I6's 25,660 logic elements and 706 user I/O pins make it well suited to telecommunications backplane bridging, where a single FPGA aggregates multiple lower-speed serial links into a higher-speed uplink. With 1.85 Mbits of embedded TriMatrix memory, the device can buffer packets across clock-domain crossings without external SRAM. Per Altera's Stratix datasheet, on-chip PLLs and high-speed LVDS I/O support the multi-channel SERDES aggregation typical of SONET/SDH and OTN bridging designs. The industrial -40 °C to +85 °C grade tolerates outdoor cabinet deployments.
Recommended
High-Speed Protocol Bridging (PCI Express, RapidIO)
The 1020-ball FC-FBGA package exposes enough I/O to implement multi-lane PCI Express or RapidIO endpoints with sideband signals and reference clocks, while the 25,660 LEs provide the throughput for protocol state machines, link-layer buffering, and DMA engines. According to Altera's Stratix Family Data Sheet, embedded DSP blocks accelerate encoding/decoding, and the 1.85 Mbit on-chip memory eliminates external FIFOs for typical 256-byte packet buffering. The 1.5 V core and industrial temperature grade support hot-plug PCIe add-in cards and industrial-embedded hosts.
Recommended
Video and Imaging Pipeline Processing
The EP1S25F1020I6 is a strong fit for video and imaging pipelines that require pixel-rate processing at HD and 4K resolutions. Its 25,660 LEs sustain wide datapaths for color-space conversion, deinterlacing, and scaling, while 1.85 Mbits of embedded memory provide line buffers that would otherwise require external SRAM. Per Altera's datasheet, dedicated DSP blocks accelerate FIR filters and motion-estimation kernels common in broadcast and machine-vision designs. The 706 user I/Os accept parallel camera LVDS streams and drive HDMI/DVI transmitters directly.
Recommended
ASIC Prototyping and Emulation
With 25,660 logic elements in 2,566 LABs, the EP1S25F1020I6 can host multi-million-gate ASIC prototypes for pre-silicon validation and firmware bring-up. Multiple devices can be chained via the dedicated configuration pins to prototype even larger ASICs. Per Altera's documentation, the TriMatrix memory blocks (M512, M4K, MegaRAM) map efficiently onto typical ASIC register files and SRAM macros. The industrial temperature grade supports in-vehicle and outdoor validation environments.
Recommended
Industrial Control and DSP
The on-chip DSP blocks combined with 1.85 Mbits of memory make the EP1S25F1020I6 well suited to industrial control loops, motor-control algorithms, and real-time DSP. Its industrial -40 °C to +85 °C grade handles factory-floor ambient swings, while 706 I/O pins drive PWM channels, encoder inputs, and fieldbus interfaces in a single chip. Per the manufacturer datasheet, the 1.5 V core and 130 nm CMOS process balance performance against power dissipation typical of continuous industrial operation.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol testers, and arbitrary waveform generators benefit from the EP1S25F1020I6's deep logic capacity, wide I/O, and embedded memory for deep capture buffers. The 1020-ball FC-FBGA exposes high-speed LVDS pairs for direct ADC/DAC interfacing, while 25,660 LEs implement triggering, sequencing, and on-chip DSP for FFT-based analysis. According to the Stratix datasheet, the device's PLL count and skew control support the multi-channel timing alignment required in digitizer and ATE designs.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F1020I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F1020C7 | EP1S25F1020C6N | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (33x33 mm, 1 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements (LEs) | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Maximum User I/O | 706 | 706 | 706 | 706 | 706 | 706 |
| Operating Temperature Grade | Industrial -40 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C |
| Speed Grade | 6 (I6) | 7 (faster) | 6 (identical) | 6 (identical) | 5 (slower) | 5 (slower) |
| Lead-Free / N Suffix | Not specified (per lot) | Not specified | Yes (N suffix) | Not specified | Yes (N suffix) | Not specified |
Key Differentiators
- Industrial temperature grade with full Stratix I logic capacity (vs EP1S25F1020C6)
- Speed grade 6 balances performance and yield for industrial sockets (vs EP1S25F1020C5)
- 706 user I/O - the maximum density option in the Stratix I family (vs EP1S25B672C6)
Design Notes
The 1020-ball FC-FBGA package exposes a large thermal pad array but has no integrated heatsink. Estimated: at typical Stratix I utilization of 60-70% LE toggle rate with 1.5 V core, junction-to-ambient thermal resistance (θJA) on a JEDEC 4-layer test board is approximately 12-15 °C/W for 33 x 33 mm FC-FBGA, so a 5 W dissipation produces ~75 °C rise over ambient. Provide a full thermal-ball land pattern on the PCB with continuous copper pour and micro-via array; consider a small clip-on heatsink or 200 LFM airflow for industrial-temperature deployments at high duty cycle.
The 1 mm ball pitch FC-FBGA requires 4-6 layer PCB stack-up with sequential lamination for the micro-via fan-out. Per Altera's Stratix Hardware Reference, route all 706 user I/O through the outer two signal layers with 0.8 mm via-in-pad micro-vias, and dedicate the inner layers to GND and 1.5 V VCCINT planes for solid power integrity. Matched-length groups (within 25 mil) are mandatory for LVDS and DDR interfaces; use series-termination resistors near the FPGA balls per the Quartus II pin planner recommendations.
Do not mix 1.5 V VCCINT and 3.3 V VCCIO rails on the same regulator without proper sequencing - Stratix I devices require VCCINT to ramp before VCCIO. Per Altera's configuration handbook, hot-socketing is not supported on legacy Stratix I, so always sequence power rails via a power-good supervisor before driving I/O. Verify the configuration mode (passive serial, fast passive parallel, JTAG) via MSEL pins before generating the bitstream; mismatched MSEL settings prevent configuration without any visible error.
Compliance Information
RoHS/REACH/lead-free status for the EP1S25F1020I6 varies by manufacturing lot and distributor source. Lead-free N-suffixed variants (e.g., EP1S25F1020C6N) are RoHS-compliant; non-N variants may be tin-lead BGA. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC; Stratix automotive applications typically use the Cyclone or newer Intel FPGA families. Always request the lot-specific compliance certificate from the distributor (Heisener, Arrow, XAIPART) before release to manufacturing.
